Emerging Technologies
Major topics: Emerging, novel and unique packaging and material technologies for: soft and intelligent packaging, flexible/stretchable hybrid electronics, implantable biosensors and bioelectronics, bio-resorbable packaging, extreme harsh environment, nanomanufacturing, paper sensors/electronics pop-up/origami, MEMS & NEMS, Close-To-Motor high-voltage power electronics, packaging for wide band gap devices, anti-tamper, cryptography, additive manufacturing, packaging for quantum computing and electro-optical integration, recyclable and sustainable electronics packaging, AI, ML and computer vision for packaging, point-of-care diagnostic packaging, space hardened packaging, green and sustainable electronics, net zero strategy/technology.
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Chair
Hongqing Zhang IBM Corporation 2070 Route 52 Hopewell Jct NY 12533 USA Phone: 484-896-8709 Email: Click Here |
Assistant Chair
Zhuo Li Fudan University Materials Science Building 1, Room 504 220 Handan Road Shanghai 200433 China Phone: +86-21-65643267 Email: Click Here |
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Isaac Robin Abothu
Siemens Healthineers Ultrasound Division 22010 SE 51st Street Issaquah WA 98029 USA Phone: +1-425-557-1288 Email: Click Here |
Karlheinz Bock
Technische Universitat Dresden Institut für Aufbau- und Verbindungstechnik der Elektronik Mommsenstrasse 15 Dresden 01062 Germany Phone: +49-351-46336345 Email: Click Here |
Benson Chan
Binghamton University IEEC, Center of Excellence Building Office 1109 85 Murray Hill Rd Vestal NY 13850 USA Phone: +1-607-777-4349 Email: Click Here |
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Vaidyanathan Chelakara
Acacia Communications 50 Allanford Ave. Ottawa None K1T 3Z6 Canada Phone: +1-613-720-2994 Email: Click Here |
Rabindra N. Das
MIT Lincoln Labs Advanced Technology Division 244 Wood St. Lexington MA 02420 USA Phone: +1-781-981-1318 Email: Click Here |
Dongming He
Qualcomm Technologies, Inc. 5775 Morehouse Drive San Diego CA 92121 USA Phone: +1-858-651-8139 Email: Click Here |
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Hao Hu
Huazhong University of Science and Technology Huazhong China Phone: (086)18062644856 Email: Click Here |
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Tengfei Jiang
University of Central Florida 4000 Central Florida Blvd Orlando FL 32816 USA Phone: 1-407-823-2284 Email: Click Here |
Jong-Hoon Kim
Washington State University Vancouver School of Engineering and Computer Science 14204 NE Salmon Creek Avenue Vancouver WA 98686-9600 USA Phone: +1-360 546-9250 Email: Click Here |
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Ramakrishna Kotlanka
Analog Devices Mail Stop:113 804 Woburn Street Wilmington MA 01887-3494 USA Phone: +1-781-937-1076 Email: Click Here |
Santosh Kudtarkar
Analog Devices 804 Woburn Street Wilmington MA 01887 USA Phone: +1-781-9372462 Email: Click Here |
Kevin J. Lee
Qorvo Corporation 2300 NE Brookwood Parkway Hillsboro OR 97124 USA Phone: +1-503-615-9151 Email: Click Here |
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Yang Liu
Nokia Bell Labs 600 Mountain Ave New Providence NJ 07974 USA Phone: 914-330-9341 Email: Click Here |
Chukwudi Okoro
Corning Mechanics and Reliability Sciences Dept. 1 Science Center Drive Corning NY 14831 USA Phone: +1-607-248-0717 Email: Click Here |
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Jintang Shang
Southeast University Key Lab of MEMS of Education Ministry,Southeast University, Sipailou 2, Nanjing, P.R. China Sipailou 2 Nanjing 210096 P.R. China Phone: +86 13913869603 Email: Click Here |
Rohit Sharma
IIT Ropar Room # 109 Nangal Road Rupnagar PB 140001 India Phone: +91-8288002273 Email: Click Here |
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Nancy Stoffel
GE Research KW-B1327 1 Research Circle Niskayuna NY 12309 USA Phone: +1-518-387-4529 Email: Click Here |
W. Hong Yeo
Georgia Insitute of Technology Pettit Microelectronics Research Center 791 Atlantic Dr NW #204 Atlanta GA 30332 United States Phone: 404-385-5710 Email: Click Here |
