NOTICE: 2021 ECTC Virtual Exhibit Brochure now available. View brochure.

Technology Corner Exhibits

For more information on ECTC 2021 contact:
Exhibits Chair
Alan Huffman
Micross Advanced Interconnect
Technology
Phone: +1-919-248-9216
Email: alan.huffman@micross.com
ectc.exhibits@gmail.com


2021 Virtual Technology Corner Exhibits

For 2021, ECTC’s Technology Corner will be all virtual and accessible to all conference registrants. This year’s virtual format still provides opportunities for exhibitors and attendees to interact with one another and learn about new technology solutions, applications, and products for the packaging and interconnect industry. We invite all attendees to browse the virtual exhibit space and learn more about the 50+ companies participating.

5N Plus Micro Powders
Ajinomoto Fine-Techno USA Corporation
Amkor
AOI Electronics
ASE Group
Binghamton University
Brewer Science
Canon
Carl Zeiss Microscopy, LLC
ChipScale Review
Corning Incorporated
CPS Technologies Corp.
Deca Technologies Inc
DISCO Hi-Tec America, Inc.
DuPont Electronics and Imaging
Ebina Denka Kogyo
EMD Performance Materials Corp
EV Group
Evatec AG
Fraunhofer IIS
FujiFilm
HD Microsystems L.L.C.
Heidelberg Instruments
Henkel Corporation
IBM Canada
IC Chip Cooling Technologies, Inc.
Integrated Service Technology
Interconnect Systems International (ISI)
JCET Group Co., Ltd.

KLA Tencor
Kleindeik
Marvell
Microcircuit Laboratories
Micross Advanced Interconnect Technology
Nagase America Corporation
NAMICS Technologies, Inc.
Nepes
NTK Technologies
Onto Innovation
PacTech
QualiTau Inc. Semiconductor Equipment Corp.
Smoltek
SPIL
SPTS Technologies LTD
SUSS MicroTec
Taiyo Ink, Mfg., Co., Ltd
Tatsuta Electric Wire & Cable
TechSearch International
ThreeBond International
Toray International
Towa USA
TSMC
Xperi
Yield Engineering Systems
Yole Développement
Zuken
Zymet