ECTC 2021 Conference Program | ECTC 2021 Technical Session Program | ZOOM QA Schedule

Program

The following is the preliminary technical program for the 71st ECTC, this year a Virtual Conference. This program may undergo many changes, in the weeks and months to come, before evolving into the Final Program of the conference.

TECHNICAL SESSIONS of the Virtual Event

Packaging Technologies
Session 1: 2D and 3D Chiplets Interconnects in FO-WLP/PLP
Session 2: Wafer/Panel Level System Integration and Process Advances
Session 3: Advanced Heterogenous Chiplet and Integration for HPC
Session 4: Heterogeneous Integration Using 2.xD/3D Packaging Technologies
Session 5: Technologies for Advanced Substrates and Flip-Chip Bonding
Session 42: Topics in Advanced Packaging
RF, High-Speed Components & Systems
Session 26: Antenna-in-Package for 5G/6G and Radar Systems
Session 27: Novel High-Frequency Integrated Modules and Systems
Session 28: High-Speed Signal Integrity and Interconnections
Session 29: 3D Power Components and Power Integrity
Emerging Technologies
Session 34: Flexible Hybrid Sensors and Electronics
Session 35: Emerging Quantum and Advanced Interconnects
Session 36: Packaging, Machine Learning, and Integration Technologies
Session 45: Heterogeneous Integration, Flex and Emerging Technologies
Interconnections
Session 7: 3D TSV and Interposer
Session 8: Chiplet Integration and Fan-Out Interconnections
Session 9: Advances in Cu Bonding
Session 10: Surface Preparation for Cu Bonding
Session 11: Advanced Chip to Chip/Package Interconnections for 3D and Heterogeneous Integration
Session 12: Flexible Interconnects and Low-Temperature Sintering
Session 40: Materials and Techniques in High-Speed Interconnects
Assembly & Manufacturing Technology
Session 23: Heterogeneous Integration Processes and Manufacturing
Session 24: Fan-Out Wafer Level Packaging Developments and Applications
Session 25: Advances in Assembly Methods
Session 43: Manufacturing Techniques for Emerging Packaging Requirements
Materials & Processing
Session 13: Dielectric Materials for High-Speed Wireless Communications
Session 14: Enhancements in Sintering Technology and Power Applications
Session 15: Material and Process Advancements for Interconnects and Metallurgy Reliability
Session 16: Innovation on Bonding and Hybrid Bonding Materials and Processing
Session 17: Latest Trends in Fan-Out Packaging and Substrate Technology
Session 18: Emerging Technology Advancements in Applications and Processing
Thermal/Mechanical Simulation & Characterization
Session 22: Advanced Package Modeling and Reliability
Session 30: Package to System Level Thermo-Mechanical Reliability Modeling
Session 31: Analyses on Chip Package Interaction and Thermal Management for Heterointegration
Session 32: Novel Approaches for Reliability and Process Modeling
Session 33: Flexing and Warpage Characterization and Modeling
Session 44: Thermo-Mechanical Analysis for Reliability in Packaging Technology
Photonics
Session 6: Advanced Optoelectronics Packaging
Session 37: Photonics, 5G, mm-Wave Applications & Techniques
Applied Reliability
Session 19: Enhanced Reliability Characterization and Methodologies
Session 20: Reliability of Automotive Electrification and Autonomous Electronic Components
Session 21: Advances in Interconnect Reliability
Session 22: Advanced Package Modeling and Reliability
Session 38: Reliability Analysis of New Materials in Modern Packaging
Session 39: High-Speed Channel Design, Power Delivery and Analysis
Topical Sessions Hosted by Interactive Presentations Technical Subcommittee
Session 37: Photonics, 5G, mm Wave Applications & Techniques
Session 38: Reliability Analysis of New Materials in Modern Packaging
Session 39: High Speed Channel Design, Power Delivery and Analysis
Session 40: Materials and Techniques in High Speed Interconnects
Session 41: Characterization and Performance Analysis of Packaging Materials
Session 42: Topics in Advanced Packaging
Session 43: Manufacturing Techniques for Emerging Packaging Requirements
Session 44: Thermo-mechanical Analysis for Reliability in Packaging Technology
Session 45: Heterogeneous Integration, Flex and Emerging Technologies
Session 46: Student Session