Technical Program

The following is the technical program for the 72nd ECTC. For additional conference information, see the Final Program available to the right.

Special Sessions
Description

Packaging Technologies
Session 1: Advanced Packaging for Heterogeneous Integration and High Performance Computing
Session 7: Advanced Flip Chip and Embedded Substrate Technologies
Session 13: Technologies for Heterogeneous Integration, Automotive and Power Electronics
Session 19: Advances in Fan-Out Panel Level Packaging
Session 25: Advancements in 2.5D and 3D Packaging Technology
Session 31: Fan-Out Packaging Technologies and Applications
RF, High-Speed Components & Systems
Session 3: Antenna-in-Package for Communication, Radar and Energy Transfer
Session 9: Millimeter-Wave Antenna-In-Package: Design, Manufacturing and Test
Session 21: Millimeter-Wave RF Components and Modules for 5G
Session 30: High-Speed Challenges in Power and Signal Integrity
Emerging Technologies
Session 18: Flexible, Wearable Sensors and Electronics
Session 22: AI, Quantum Computing and Novel 3D Packaging Solutions
Session 35: Packaging with Additive Manufacturing for Harsh Conditions
Interconnections
Session 4: Hybrid Bonding and Innovations for 3D Integration
Session 8: Hybrid and Direct Bonding Development and Characterization
Session 16: Hybrid & Direct Bonding Innovation, Optimization & Yield Improvement
Session 26: Soldered and Sintered Interconnections
Session 32: Advanced Interconnect and Wire Bond Technologies for Flexible Device Applications
Assembly & Manufacturing Technology
Session 5: Bonding Technology: Novel Assembly Methods and Processes
Session 15: Enhanced Methods & Processes for Heterogeneous Integration Assembly
Session 23: Advanced Processes for Manufacturing and Yield Enhancement
Session 28: Packaging Assembly: Solder, Sintering, and Thermal Interface Materials
Materials & Processing
Session 2: High Performance Dielectric Materials for Advanced Packaging
Session 14: Novel Bonding and and Stacking Technologies
Session 20: Enhancements in Fine-Pitch Interconnects, Redistribution Layers and Through-Vias
Session 28: Packaging Assembly: Solder, Sintering, and Thermal Interface Materials
Session 29: Materials and Processes for Fan-Out and Advanced Packaging
Session 34: Processing Enhancements in Fan-Out and Heterogeneous Integration
Thermal/Mechanical Simulation & Characterization
Session 6: Emerging Modeling Including AI and Machine Learning
Session 12: Manufacturing and Assembly Process Modeling
Session 24: Thermal Management and Warpage Analysis of Highly Integrated Packages
Session 33: Advanced Reliability Modeling and Characterization
Session 36: Modeling and Characterization of Interfaces and Interconnects
Photonics
Session 10: Novel Photonics Packaging Technology
Applied Reliability
Session 11: Automotive and Harsh Environment
Session 17: Novel Characterization Techniques and Test Methods
Session 27: Interconnection Reliability
Session 33: Advanced Reliability Modeling and Characterization
Interactive Presentations
Session 37: Interactive Presentations 1
Session 38: Interactive Presentations 2
Session 39: Interactive Presentations 3
Session 40: Interactive Presentations 4
Session 41: Student Interactive Presentations