Program

The following is the preliminary technical program for the 70th ECTC, now a Virtual Conference. This program may undergo many changes, in the weeks and months to come, before evolving into the Final Program of the conference.

SPECIAL SESSIONS of the Virtual Event
recorded presentations 

Special Sessions
Keynote Presentation: INNOVATIVE HETEROGENEOUS INTEGRATION TECHNOLOGIES INITIATE A NEW SEMICONDUCTOR ERA - Douglas Yu – Taiwan Semiconductor Manufacturing Company (TSMC)
Session: Bridge to quantum Computing
Session: Cutting-Edge Technology on Integrated Photonics and Packaging
Session: Diversity and Inclusion Drives Innovation and Productivity
Session: 3DIC - Past, Present and Future
Session: Future Semiconductor Packages For Artificial Intelligence Hardware
Session: Heterogeneous Integration Roadmap Workshop
Session: Presentations from our Conference Sponsors

More Information on all Special Sessions of the Virtual Event

TECHNICAL SESSIONS of the Virtual Event
recorded presentations

Packaging Technologies
Session 1: Fan-Out Technologies for System Integration
 Session 7: Advances in Packaging at the Wafer/Panel Level
 Session 10: MEMS and Sensors
 Session 13: 2.5D and 3D Technology Enabling High Performance Computing
 Session 19: Embedded and Heterogeneous Integration
 Session 25: High Density Fan-Out Technology
 Session 31: Automotive and Power Electronics Packaging
 High-Speed, Wireless & Components
Session 3: Antenna-in-Package for 5G and Radar Systems
 Session 9: Power Delivery and Conversion
 Session 21: High Speed in Signal Integrity
 Session 30: RF and Power Components and Modules
 Emerging Technologies
Session 18: Emerging Flexible Hybrid Electronics
 Session 22: Advanced Biosensors and Bioelectronics
 Session 35: Additive Manufacturing and Innovative Materials for Packaging
 Interconnections
Session 8: High-Density RDL for Advanced Interconnects
 Session 16: Sintering and Interconnect Reliability
 Session 26: Breakthroughs in TSV and TGV Technologies
 Session 32: Stacking and Bonding Technologies
 Assembly & Manufacturing Technology
Session 5: Advanced Bonding Methods and Processing
 Session 7: Advances in Packaging at the Wafer/Panel Level
 Session 15: Flexible and Printed Electronics
 Session 23: Advanced Dicing and Laser-Assisted Bonding
 Session 28: Enhanced Manufacturing and Process Integration
 Materials & Processing
Session 2: Innovation on WLCSP and 3D Packaging
 Session 14: Materials for High-Speed/Frequency and 5G
 Session 20: Materials and Processes for FOWLP and PLP
 Session 29: Advances in Bonding Materials and Processes
 Session 34: Emerging Materials and Processing
 Thermal/Mechanical Simulation & Characterization
Session 6: Interconnect Modeling
 Session 12: Modeling for Heterogeneous Integration: From Wafer to Board Level
 Session 24: Material and Interface Modeling
 Session 36: Multiphysics and AI-Enhanced Modeling Approaches
 Photonics
Session 4: Advanced Photonic Integration Packaging
 Applied Reliability
Session 11: Reliability of Next-Generation Interconnects
 Session 17: Automotive and Harsh Environment Reliability
 Session 27: WLP and Advanced Technology Reliability
 Session 33: Advances in Reliability Assessment
 Topical Sessions Hosted by Interactive Presentations Technical Subcommittee
Session 37: New Methods, Techniques and Devices in Packaging
 Session 38: 5G, mm-wave and RF Packaging
 Session 39: Current Trends in High Speed Interconnects
 Session 40: Manufacturing Techniques for Advanced Packaging
 Session 41: Characterization and Analysis of Packaging Materials
 Session 42: Thermo-Mechanical Effects in Packaging
 Session 43: Reliability and Failure Analyses of Emerging Materials
 Session 44: Optoelectronics, Flex and Emerging Techniques
 Session 45: Student Session