Technical Program
The following is the technical program for the 72nd ECTC. For additional conference information, see the Final Program available to the right.
Special Sessions
Description
Packaging Technologies
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Session
1: Advanced Packaging for Heterogeneous Integration and High Performance Computing
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Session
7: Advanced Flip Chip and Embedded Substrate Technologies
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Session
13: Technologies for Heterogeneous Integration, Automotive and Power Electronics
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Session
19: Advances in Fan-Out Panel Level Packaging
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Session
25: Advancements in 2.5D and 3D Packaging Technology
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Session
31: Fan-Out Packaging Technologies and Applications
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RF, High-Speed Components & Systems
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Session
3: Antenna-in-Package for Communication, Radar and Energy Transfer
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Session
9: Millimeter-Wave Antenna-In-Package: Design, Manufacturing and Test
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Session
21: Millimeter-Wave RF Components and Modules for 5G
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Session
30: High-Speed Challenges in Power and Signal Integrity
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Emerging Technologies
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Session
18: Flexible, Wearable Sensors and Electronics
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Session
22: AI, Quantum Computing and Novel 3D Packaging Solutions
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Session
35: Packaging with Additive Manufacturing for Harsh Conditions
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Interconnections
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Session
4: Hybrid Bonding and Innovations for 3D Integration
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Session
8: Hybrid and Direct Bonding Development and Characterization
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Session
16: Hybrid & Direct Bonding Innovation, Optimization & Yield Improvement
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Session
26: Soldered and Sintered Interconnections
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Session
32: Advanced Interconnect and Wire Bond Technologies for Flexible Device Applications
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Assembly & Manufacturing Technology
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Session
5: Bonding Technology: Novel Assembly Methods and Processes
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Session
15: Enhanced Methods & Processes for Heterogeneous Integration Assembly
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Session
23: Advanced Processes for Manufacturing and Yield Enhancement
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Session
28: Packaging Assembly: Solder, Sintering, and Thermal Interface Materials
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Materials & Processing
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Session
2: High Performance Dielectric Materials for Advanced Packaging
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Session
14: Novel Bonding and and Stacking Technologies
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Session
20: Enhancements in Fine-Pitch Interconnects, Redistribution Layers and Through-Vias
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Session
28: Packaging Assembly: Solder, Sintering, and Thermal Interface Materials
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Session
29: Materials and Processes for Fan-Out and Advanced Packaging
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Session
34: Processing Enhancements in Fan-Out and Heterogeneous Integration
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Thermal/Mechanical Simulation & Characterization
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Session
6: Emerging Modeling Including AI and Machine Learning
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Session
12: Manufacturing and Assembly Process Modeling
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Session
24: Thermal Management and Warpage Analysis of Highly Integrated Packages
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Session
33: Advanced Reliability Modeling and Characterization
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Session
36: Modeling and Characterization of Interfaces and Interconnects
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Photonics
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Session
10: Novel Photonics Packaging Technology
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Applied Reliability
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Session
11: Automotive and Harsh Environment
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Session
17: Novel Characterization Techniques and Test Methods
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Session
27: Interconnection Reliability
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Session
33: Advanced Reliability Modeling and Characterization
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Interactive Presentations
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Session
37: Interactive Presentations 1
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Session
38: Interactive Presentations 2
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Session
39: Interactive Presentations 3
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Session
40: Interactive Presentations 4
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Session
41: Student Interactive Presentations
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