Program
The following is the preliminary technical program for the 71st ECTC, this year a Virtual Conference. This program may undergo many changes, in the weeks and months to come, before evolving into the Final Program of the conference.
TECHNICAL SESSIONS of the Virtual Event
Packaging Technologies
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Session
1: 2D and 3D Chiplets Interconnects in FO-WLP/PLP
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Session
2: Wafer/Panel Level System Integration and Process Advances
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Session
3: Advanced Heterogenous Chiplet and Integration for HPC
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Session
4: Heterogeneous Integration Using 2.xD/3D Packaging Technologies
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Session
5: Technologies for Advanced Substrates and Flip-Chip Bonding
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Session
42: Topics in Advanced Packaging
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RF, High-Speed Components & Systems
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Session
26: Antenna-in-Package for 5G/6G and Radar Systems
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Session
27: Novel High-Frequency Integrated Modules and Systems
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Session
28: High-Speed Signal Integrity and Interconnections
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Session
29: 3D Power Components and Power Integrity
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Emerging Technologies
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Session
34: Flexible Hybrid Sensors and Electronics
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Session
35: Emerging Quantum and Advanced Interconnects
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Session
36: Packaging, Machine Learning, and Integration Technologies
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Session
45: Heterogeneous Integration, Flex and Emerging Technologies
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Interconnections
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Session
7: 3D TSV and Interposer
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Session
8: Chiplet Integration and Fan-Out Interconnections
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Session
9: Advances in Cu Bonding
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Session
10: Surface Preparation for Cu Bonding
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Session
11: Advanced Chip to Chip/Package Interconnections for 3D and Heterogeneous Integration
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Session
12: Flexible Interconnects and Low-Temperature Sintering
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Session
40: Materials and Techniques in High-Speed Interconnects
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Assembly & Manufacturing Technology
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Session
23: Heterogeneous Integration Processes and Manufacturing
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Session
24: Fan-Out Wafer Level Packaging Developments and Applications
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Session
25: Advances in Assembly Methods
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Session
43: Manufacturing Techniques for Emerging Packaging Requirements
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Materials & Processing
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Session
13: Dielectric Materials for High-Speed Wireless Communications
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Session
14: Enhancements in Sintering Technology and Power Applications
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Session
15: Material and Process Advancements for Interconnects and Metallurgy Reliability
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Session
16: Innovation on Bonding and Hybrid Bonding Materials and Processing
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Session
17: Latest Trends in Fan-Out Packaging and Substrate Technology
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Session
18: Emerging Technology Advancements in Applications and Processing
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Thermal/Mechanical Simulation & Characterization
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Session
22: Advanced Package Modeling and Reliability
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Session
30: Package to System Level Thermo-Mechanical Reliability Modeling
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Session
31: Analyses on Chip Package Interaction and Thermal Management for Heterointegration
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Session
32: Novel Approaches for Reliability and Process Modeling
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Session
33: Flexing and Warpage Characterization and Modeling
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Session
44: Thermo-Mechanical Analysis for Reliability in Packaging Technology
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Photonics
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Session
6: Advanced Optoelectronics Packaging
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Session
37: Photonics, 5G, mm-Wave Applications & Techniques
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Applied Reliability
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Session
19: Enhanced Reliability Characterization and Methodologies
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Session
20: Reliability of Automotive Electrification and Autonomous Electronic Components
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Session
21: Advances in Interconnect Reliability
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Session
22: Advanced Package Modeling and Reliability
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Session
38: Reliability Analysis of New Materials in Modern Packaging
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Session
39: High-Speed Channel Design, Power Delivery and Analysis
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Topical Sessions Hosted by Interactive Presentations Technical Subcommittee
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Session
37: Photonics, 5G, mm Wave Applications & Techniques
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Session
38: Reliability Analysis of New Materials in Modern Packaging
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Session
39: High Speed Channel Design, Power Delivery and Analysis
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Session
40: Materials and Techniques in High Speed Interconnects
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Session
41: Characterization and Performance Analysis of Packaging Materials
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Session
42: Topics in Advanced Packaging
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Session
43: Manufacturing Techniques for Emerging Packaging Requirements
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Session
44: Thermo-mechanical Analysis for Reliability in Packaging Technology
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Session
45: Heterogeneous Integration, Flex and Emerging Technologies
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Session
46: Student Session
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