Professional Development Courses

ECTC 2021 PDC Schedule

Welcome!

The 2021 ECTC Professional Development Courses are a good representation of topics of interests for Electronic Packaging Technologists.  Each of these courses are presented by world-class experts, enabling participants to broaden their technical knowledge base.  As in previous years there will be 14 courses, each 2.5 hours long. Each PDC will occur within the 1st two weeks of the conference. After the initial presentation, all PDC's will be available for the duration of the conference. As in the past CEU/PDH credit will be provided at no expense to the attendee upon request.  A list of these professional development courses is provided below.  As a potential attendee please review them so that you select the specific course or courses that you would like to register for. Bear in mind you can register for more than the traditional "2" PDCs.

Kitty Pearsall
ECTC PDC Chair

Jeff Suhling
ECTC PDC Assistant Chair

2021 Virtual Conference Courses

  1. ACHIEVING HIGH RELIABILITY OF LEAD-FREE SOLDER JOINTS – MATERIALS CONSIDERATIONS
    Course Leader: Ning-Cheng Lee – Indium Corporation
  2. FUNDAMENTALS OF GLASS TECHNOLOGY AND APPLICATIONS FOR ADVANCED SEMICONDUCTOR PACKAGING
    Course Leaders: Prakash Gajendra and Joseph Canale – Corning, Inc.
  3. FUNDAMENTALS OF RF DESIGN AND FABRICATION PROCESSES OF FAN-OUT WAFER/PANEL LEVEL PACKAGES AND INTERPOSERS
    Course Leaders: Ivan Ndip and Markus Wöhrmann – Fraunhofer IZM
  4. ELIMINATING PACKAGE FAILURE MECHANISMS FOR IMPROVED RELIABILITY
    Course Leader: Darvin Edwards –Edwards Enterprises
  5. CHARACTERIZATION OF ADVANCED EMCs FOR FO-WLP, HETEROGENEOUS INTEGRATION, AND AUTOMOTIVE ELECTRONICS
    Course Leaders: Przemyslaw Gromala – Robert Bosch GmbH
  6. RELIABLE INTEGRATED THERMAL PACKAGING FOR POWER ELECTRONICS
    Course Leader: Patrick McCluskey – University of Maryland
  7. FLIP CHIP TECHNOLOGIES
    Course Leaders: Eric Perfecto –IBM Research and Shengmin Wen – Synaptics Inc.
  8. WAFER-LEVEL CHIP-SCALE PACKAGING (WCSP) FUNDAMENTALS
    Course Leader: Patrick Thompson -- Texas Instruments, Inc.
  9. ADDITIVE FLEXIBLE HYBRID ELECTRONICS – MANUFACTURING AND RELIABILITY
    Course Leader: Pradeep Lall – Auburn University
  10. FAN-OUT WAFER/PANEL LEVEL PACKAGING AND 3D CHIPLET HETEROGENEOUS INTEGRATION
    Course Leader: John Lau – Unimicron Technology Corporation
  11. POLYMERS IN WAFER LEVEL PACKAGING
    Course Leader: Jeffrey Gotro –InnoCentrix, LLC
  12. RELIABILITY MECHANICS AND MODELING FOR IC PACKAGING
    Course Leaders: Ricky Lee -- HKUST and Xuejun Fan – Lamar University
  13. FROM WAFER TO PANEL LEVEL PACKAGING
    Course Leaders: Tanja Braun and Michael Töpper – Fraunhofer IZM
  14. THERMAL MANAGEMENT OF ELECTRONICS
    Course Leader: Jaime Sanchez – Intel Corporation

Contact Kitty Pearsall, the ECTC PDC Committee chair, in case of questions.