Professional Development Courses


The Professional Development Courses Committee have selected 16 PDCs for presentation at the 2023 ECTC on May 30, 2023, at the JW Marriott, Orlando, Florida. These PDCs are 4-hour, Professional Development Course (PDCs) on relevant electronic packaging topics and are taught by world-class experts, enabling participants to broaden their technical knowledge base.

Attendees of the PDCs will be offered Continuing Education Units (CEUs) or Professional Development Hours (PDHs). These CEUs and PDHs are recognized by employers as a formal measure of participation and attendance in “noncredit” self-study courses, tutorials, symposia, and workshops. Below you will find the list of the 2023 PDCs that are being offered. Each PDC has a clickable link that will take you to each PDC course description, course outline, who should attend, and a short author bio.

Kitty Pearsall, PhD., PE

Contact Kitty Pearsall, the ECTC PDC Committee chair, in case of questions.


  1. High Reliability of Lead-Free Solder Joints -- Materials Considerations
    Course Leader: Ning-Cheng Lee – ShinePure Hi-Tech
  2. Wafer-Level Chip-Scale Packaging (WCSP) Fundamentals
    Course Leader: Patrick Thompson– Texas Instruments, Inc.
  3. Fundamentals of RF Design and Fabrication Processes of Fan-Out Wafer/Level and Advanced RF Packages
    Course Leader: Ivan Ndip and Markus Wöhrmann – Fraunhofer IZM
  4. Eliminating Failure Mechanisms in Advanced Packages
    Course Leader: Darvin Edwards – Edwards Enterprises
  5. Reliability Engineering Testing Methodology and Statistical Knowledge for Qualifications of Consumer and Automotive Electronic Components
    Course Leaders: Fen Chen – Cruise LLC (a GM company)
  6. Reliability Physics and Failure Mechanisms in Electronics Packaging
    Course Leaders: Xuejun Fan – Lamar University
  7. Reliable Integrated Thermal Packaging for Power Electronics
    Course Leader: Patrick McCuskey – University of Maryland
  8. Introduction to PWB Thermal Analyses
    Course Leaders: Patrick Loney - Northrop Grumman


  1. Additive Flexible Hybrid Electronics – Manufacturing and Reliability
    Course Leader: Pradeep Lall – Auburn University
  2. Fan-Out Packaging and Chiplet Heterogeneous Integration
    Course Leaders: John Lau - Unimicron
  3. Photonic Technologies for Communication, Sensing, and Displays
    Course Leader: Torsten Wipiejewski, Huawei Technologies
  4. Flip Chip Technologies
    Course Leader: Shengmin Wen – JCET and Eric Perfecto – IBM Research
  5. Packaging and Heterogeneous Integration for Automotive Electronics and Advanced Characterization of EMCs
    Course Leader: Przemyslaw Gromala – Robert Bosch GmbH
  6. Analysis of Fracture and Delamination in Microelectronic Packages
    Course Leader: Andrew Tay - National University of Singapore
  7. Polymers in Wafer Level Packaging
    Course Leaders: Jeffrey Gotro –InnoCentrix, LLC
  8. Thermal Management of Electronics
    Course Leaders: Jaime Sanchez – Intel Corporation

Contact Kitty Pearsall, the ECTC PDC Committee chair, in case of questions.