Professional Development Courses
Welcome!
The Professional Development Courses Committee have selected 16 PDCs for presentation at the 2023 ECTC on May 30, 2023, at the JW Marriott, Orlando, Florida. These PDCs are 4-hour, Professional Development Course (PDCs) on relevant electronic packaging topics and are taught by world-class experts, enabling participants to broaden their technical knowledge base.
Attendees of the PDCs will be offered Continuing Education Units (CEUs) or Professional Development Hours (PDHs). These CEUs and PDHs are recognized by employers as a formal measure of participation and attendance in “noncredit” self-study courses, tutorials, symposia, and workshops. Below you will find the list of the 2023 PDCs that are being offered. Each PDC has a clickable link that will take you to each PDC course description, course outline, who should attend, and a short author bio.
Kitty Pearsall, PhD., PE
ECTC PDC Chair
Contact Kitty Pearsall, the ECTC PDC Committee chair, in case of questions.
MORNING COURSES 8:00 AM – 12:00 PM
- 1. High Reliability of Lead-Free Solder Joints -- Materials Considerations
Course Leader: Ning-Cheng Lee – ShinePure Hi-Tech - 2. Wafer-Level Chip-Scale Packaging (WCSP) Fundamentals
Course Leader: Patrick Thompson– Texas Instruments, Inc. - 3. Fundamentals of RF Design and Fabrication Processes of Fan-Out Wafer/Level and Advanced RF Packages
Course Leader: Ivan Ndip and Markus Wöhrmann – Fraunhofer IZM
- 4. Eliminating Failure Mechanisms in Advanced Packages
Course Leader: Darvin Edwards – Edwards Enterprises - 6. Reliability Physics and Failure Mechanisms in Electronics Packaging
Course Leaders: Xuejun Fan – Lamar University - 7. Reliable Integrated Thermal Packaging for Power Electronics
Course Leader: Patrick McCuskey – University of Maryland - 8. Introduction to PWB Thermal Analyses
Course Leaders: Patrick Loney - Northrop Grumman
AFTERNOON COURSES 1:30 PM – 5:30 PM
- 9. Additive Flexible Hybrid Electronics – Manufacturing and Reliability
Course Leader: Pradeep Lall – Auburn University - 10. Fan-Out Packaging and Chiplet Heterogeneous Integration
Course Leaders: John Lau - Unimicron - 11. Photonic Technologies for Communication, Sensing, and Displays
Course Leader: Torsten Wipiejewski, Huawei Technologies - 12. Flip Chip Technologies
Course Leader: Shengmin Wen – HaiSemi and Eric Perfecto – IBM Research - 13. Packaging and Heterogeneous Integration for Automotive Electronics and Advanced Characterization of EMCs
Course Leader: Przemyslaw Gromala – Robert Bosch GmbH - 14. Analysis of Fracture and Delamination in Microelectronic Packages
Course Leader: Andrew Tay - National University of Singapore - 15. Polymers in Wafer Level Packaging
Course Leaders: Jeffrey Gotro –InnoCentrix, LLC
Contact Kitty Pearsall, the ECTC PDC Committee chair, in case of questions.
