ECTC | IEEE Electronic Components and Technology Conference

Electrical Design & Analysis (formerly RF, High-Speed Components & Systems)

Major topics: 5G/6G, IoT, cloud computing, autonomous vehicles, AI/machine learning; antennas, sensors, power transfer, wired/wireless communications, RF to THz; multiphysics/multiscale modeling & characterization of interconnects, modules, components, and systems; chiplet, heterogeneous Integration, chip-to-chip, die-to-die, SiP/MCM/system co-design (chip/pkg/board), UCIe, HBM/HPC; opto-Electrical (OE) hybrid integration, analog packaging, power electronics modeling/characterization; high-speed/frequency (RF, mmWave, THz) signal integrity, power integrity, and EMI/EMC; 5G/6G, IoT, cloud computing, autonomous vehicles, AI/machine learning.

Chair Jaemin Shin Qualcomm Technologies, Inc. 5775 Morehouse Drive San Diego CA 92121 USA Phone: +1-858-845-7500 Email: Click Here	Assistant Chair Hideki Sasaki Rapidus Corporation Tokyo Japan Phone: Email: Click Here
Amit P. Agrawal AMD 2100 Logic Dr. San Jose CA 95124 United States Phone: 1-408-666-8452 Email: Click Here	Kemal Aygun Intel Corporation CH5-157 5000 W. Chandler Blvd. Chandler AZ 85226 USA Phone: +1-480-552-1740 Email: Click Here	Wendem Beyene Meta 1 Hacker Way Menlo Park CA 94025 USA Phone: +1-408-421-8007 Email: Click Here
Eric Beyne IMEC Kapeldreef 75 B-3001 Leuven Belgium Phone: +32-16-281-261 Email: Click Here	Prem Chahal Michigan State University 2120 Engineering Building East Lansing MI 48824 USA Phone: +1-517-355-0248 Email: Click Here	Harrison Chang ASE 13F No.66 SanChong Rd. Taipei City 11560 Taiwan Phone: +886-2-27820366 Email: Click Here
Zhaoqing Chen IBM Corporation B002 2455 South Rd. Poughkeepsie NY 12601 USA Phone: +1-845-435-5595 Email: Click Here	Charles Nan-Cheng Chen WinWay Technology Co. No. 68, Chuangyi S. Rd. Nanzih District Kaohsiung City 811646 Taiwan Phone: +886 3 5537632 ext 5201 Email: Click Here	Craig Gaw NXP Semiconductor CH220 1300 North Alma School Chandler AZ 85224 USA Phone: +1-480-814-5142 Email: Click Here
Xiaoxiong (Kevin) Gu Astrabeam 520 White Plains Rd. Suite 500 Tarrytown NY 10591 USA Phone: Email: Click Here	Rockwell Hsu Cisco Systems, Inc. 425 E Tasman Dr. San Jose CA 95134 USA Phone: +1-480-612-1469 Email: Click Here	Lianjun Liu NXP Semiconductor, Inc. MD CH330 1300 N Alma School Rd Chandler AZ 85224 USA Phone: +1-480-4134022 Email: Click Here
Sungwook Moon Samsung Electronics Phone: Email: Click Here	Rajen M Murugan Texas Instruments 917 Clack Drive Dallas TX 75044 USA Phone: +1-214-567-6377 Email: Click Here	Ivan Ndip Fraunhofer IZM/Brandenburg University of Technology Gustav-Meyer-Allee 25 Berlin 13355 Germany Phone: '+49 30 464 03 679 Email: Click Here
P. Markondeya Raj Florida International University Biomedical Engineering 10555 W. Flagler St Miami FL 33185 USA Phone: +1-305 348 6249 Email: Click Here	Li-Cheng Shen Universal Scientific Industrial Co. Ltd. (USI) Rm.6, 3F, No.66, SanChong Rd., Nangang Dist. Tapei Taiwan Phone: '+886-2-2782-0366 ext. 27025 Email: Click Here	Srikrishna Sitaraman Marvell Technology Phone: Email: Click Here
Xiao Sun IMEC Kapeldreef 75 Leuven 3001 Belgium Phone: +32-16-288649 Email: Click Here	Manos M. Tentzeris Georgia Institute of Technology ECE Dept Atlanta GA 30332-0250 USA Phone: +1-404-385-6006 Email: Click Here	Chuei-Tang Wang Taiwan Semiconductor Manufacturing Company (TSMC) 166, Park Ave. 2, Hsinchu Science Park Hsinchu 300-091 Taiwan Phone: +886 933 580 009 Email: Click Here
Maciej Wojnowski Infineon Technologies AG Am Campeon 1-15 Neubiberg 85579 Germany Phone: +49 89 234 26531 Email: Click Here	Yong-Kyu Yoon University of Florida 225 Larsen Hall Gainesville FL 32611 USA Phone: +1-352-392-5985 Email: Click Here

2025 IEEE 75th Electronic Components and Technology Conference

Electrical Design & Analysis (formerly RF, High-Speed Components & Systems)

ECTC Technical Program Subcommittees