ECTC | IEEE Electronic Components and Technology Conference

Packaging Technologies

Major Topics: Architectures, chiplets, and applications for 2.5 & 3D, TSV & interposer; Advanced flip-chip, SiP, CSP, PoP, MEMS, sensors & IoT; Automotive & power electronics; bio, medical, flexible & wearable packaging; Embedded& advanced substrates; Fan-out, wafer & panel level processes; Heterogeneous integration.

Chair Kuldip Johal MKS Instruments- MSD 1750 Overview Drive Rock Hill South Carolina 29732 USA Phone: +18033700669 Email: Click Here	Assistant Chair Jie Fu Apple Inc. 95014 1 Apple Park Way Cupertino CA 95014 United States Phone: +1-424-672-5772 Email: Click Here
Bora Baloglu Intel Corporation 5000 W. Chandler Blvd Chandler AZ 85226 USA Phone: +1-480 242 5870 Email: Click Here	Mike Gallagher DuPont Electronic and Imaging 455 Forest Street Marlborough MA 01752 USA Phone: +1-508229-7681 Email: Click Here	Ning Ge Consultant Newark California USA Phone: +1-650-966-4796 Email: Click Here
Sam Karikalan Broadcom Inc. 15191 Alton Pkwy Irvine CA 92618 USA Phone: 1-949-926-7296 Email: Click Here	Beth Keser Intel Corporation Germany Phone: +49 (89) 9988532 0713 Email: Click Here	Young-Gon Kim Renesas Electronics America 6024 Silver Creek Valley Road San Jose CA 95138 USA Phone: +1-408-761-5830 Email: Click Here
Andrew Kim Apple One Apple Park Way Cupertino CA 95014 USA Phone: + Email: Click Here	John Knickerbocker IBM Corporation 06-032 1101 Kitchawan Road Yorktown Heights NY 10598 USA Phone: +1-914-945-3306 Email: Click Here	Steffen Kroehnert ESPAT Consulting, Germany Nesselgrundweg 2 Dresden Saxony 01109 Germany Phone: +49 351 2758 1287 Email: Click Here
Albert Lan Applied Materials No 32, R&D Road II HsinChu Science Park HsinChu City 30076 Taiwan Phone: +886-3-5793588 Email: Click Here	John H. Lau Unimicron Technology Corporation No. 179, Shanying Road, Guishan Industrial Park Taoyuan City 33341 Taiwan Phone: 886-3350-0386 ext:11118 Email: Click Here	Jaesik Lee SK Hynix USA 3101 North 1st Street San Jose CA 95134 USA Phone: Email: Click Here
Kyu-Oh Lee Intel Corporation 5000 W Chandler Blvd Chandler AZ 85226 USA Phone: +1 480-554-7740 Email: Click Here	Markus Leitgeb AT&S Fabriksgasse 13 Leoben 8700 Austria Phone: +43-676-8955-4087 Email: Click Here	Dean Malta Micross Advanced Interconnect Technology P.O. Box 110283 3021 East Cornwallis Rd. Research Triangle Park NC 27709 USA Phone: +1-919-248-8405 Email: Click Here
Luu Nguyen Psi Quantum 700 Hansen Way Palo Alto CA 94306 USA Phone: +1-408-551-9117 Email: Click Here	Raj Pendse Facebook FRL (Facebook Reality Labs) 1350 Willow Road Menlo Park CA 94025 USA Phone: +1-(510)709-8076 Email: Click Here	Min Woo Rhee Samsung Phone: Email: Click Here
Subhash L. Shinde Notre Dame University Center for Sustainable Energy 115 Stinson-Remick Hall Notre Dame Indiana 46556 USA Phone: +1-574-631-1425 Email: Click Here	Joseph W. Soucy Draper Laboratory MS 68 555 Technology Square Cambridge MA 02139-3563 USA Phone: +1-617-258-2953 Email: Click Here	Peng Su Juniper Networks Building B 1137 Innovation Way Sunnyvale CA 94089 USA Phone: +1-408-936-5855 Email: Click Here
Eric Tremble Marvel Phone: Email: Click Here	Kuo-Chung Yee Taiwan Semiconductor Manufacturing Corporation, Inc. 168,Park Ave. 2, Hsinchu Science Park Hsinchu County 308-44 Taiwan R.O.C. Phone: +886-3-5636688 Ext. 7222920/7223012 Email: Click Here

2023 IEEE 73rd Electronic Components and Technology Conference

Packaging Technologies

Committee Links