Packaging Technologies
Major Topics: 2.XD/3D architectures/designs for energy efficient HPC / C2C links / structures / thermal solutions / methods & processes; heterogeneous (chiplet) integration for 2.5D / 3D-IC for AI / Neural Nets / HBM / CPU / GPU / ASIC /CPO; silicon, glass, diamond & organic interposer & advanced package technology; DD Cu / Cu TSV / hybrid bonding / backside power; embedded die / bridge / passives, flexible, advanced substrates & modules; fan-out wafer and panel level packaging, advanced flip-chip, SiP, CSP, PoP; RF, wireless, MEMS, Sensors & loT, automotive, wireless power and power electronics; SiC, GaN, PMIC, SPS; bio, medical, flexible, wearable & extreme environments packaging.
