Applied Reliability
Major topics: Reliability of 2D, 2.5D, Si-bridge, 3D, chiplets, SiP, WLCSP, FOWLP, FOPLP & heterogeneous integration; interconnect reliability in micro-bump, micro-pillar, Cu-pillar, TSV, TGV, RDL, HDI, stacked-die, hybrid-bond, flip chip & wire bonded packages; novel reliability test methods, life models, FA techniques & materials characterization; component and board level reliability in computing, HPC, mobile, networking, automotive, power electronics, harsh/hi-temp environments, IoT, sensors, AI, autonomous vehicles, medical, wearable electronics, LEDs, displays & memory; interfacial/bulk reliability of solder alloys, mold compound, epoxy, underfill, overcoat, build-up film, solder resist, & substrate laminate.
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Chair
Keith Newman AMD 2485 Augustine Drive Santa Clara CA 94054 USA Phone: (408) 749-5566 Email: Click Here |
Assistant Chair
Vikas Gupta ASE US, Inc 14785 Preston Road, Suite 670 Dallas TX 75254 USA Phone: +1-214-554-1152 Email: Click Here |
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Seung-Hyun Chae
SK Hynix 2091 Gyeongchung-daero, Bubal-eup Icheon-si Gyeonggi-do 17336 South Korea Phone: +82-31-5184-3108 -6202 Email: Click Here |
Tz-Cheng Chiu
National Cheng Kung University 1 University Rd., East District Tainan 701 Taiwan Phone: +886-6-2757575 Email: Click Here |
Darvin R. Edwards
Edwards Enterprise Consulting, LLC 5301 Glen Vista Dr. Dallas TX 75044 USA Phone: +1-972-571-7638 Email: Click Here |
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Deepak Goyal
Intel Corporation CH5-263 5000 W. Chandler Blvd. Chandler AZ 85226 USA Phone: +1-480-554-5203 Email: Click Here |
Sandy Klengel
Fraunhofer Institute for Microstructure of Materials and Systems Walter-Huelse-Strasse 1 Halle 06120 Germany Phone: +49 1733592438 Email: Click Here |
Tae-Kyu Lee
Cisco Systems, Inc. 3675 Cisco Way San Jose CA 95134 USA Phone: +1-408-525-7818 Email: Click Here |
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Pilin Liu
Intel Corporation CH5-263 5000 W. Chandler Blvd. Chandler AZ 85226 USA Phone: +1-480-570-7670 Email: Click Here |
Varughese Mathew
NXP Semiconductors MD: OE332 6501 William Cannon Drive Austin TX 78735 USA Phone: +1-512-895-6293 Email: Click Here |
Donna M. Noctor
Nokia 5596 Furnace Hill Road Zionsville PA 18092 USA Phone: +1-484-666-7379 Email: Click Here |
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S. B. Park
Binghamton University Thomas J. Watson School of Engineering and Applied Science Binghamton NY 13902-6000 USA Phone: +1-607-777-3415 Email: Click Here |
René Rongen
NXP Semiconductors Building BX-0.035 134 Avenue du Général Eisenhower Toulouse 31100 France Phone: +33 7 88 61 69 92 Email: Click Here |
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Scott Savage
Medtronic Microelectronics Center 2343 W. Medtronic Way Tempe AZ 85281-5133 USA Phone: +1-480-303-4749 Email: Click Here |
Christian Schmidt
NVIDIA Corporation 300 3rd Street Unit 612 San Francisco CA 94107 USA Phone: +1-408-805-9524 Email: Click Here |
Jeffrey Suhling
Auburn University Department of Mechanical Engineering 1418 Wiggins Hall Auburn AL 36849 USA Phone: +1-334-844-3332 Email: Click Here |
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Paul Tiner
Texas Instruments 12500 TI Blvd Dallas TX 75243 USA Phone: +1-469-471-3565 Email: Click Here |
Pei-Haw Tsao
Mediatek No. 1. Dusing 1st Rd. Hai chi Science Park Hsinchu None 30078 Taiwan Phone: +886-928-862279 Email: Click Here |
Dongji Xie
NVIDIA Corporation 2701 San Tomas Expressway Santa Clara CA 95050 USA Phone: +1-408-486-8630 Email: Click Here |
