Applied Reliability
Major topics: Reliability of 2D, 2.5D, Si-bridge, 3D, chiplets, WLCSP, FOWLP, FOPLP & heterogeneous integration and Co-packaged optics (CPO); interconnect reliability in micro-bump, micro-pillar, Cu-pillar, TSV, RDL, stacked-die, hybrid-bond, flip chip & wire bonded packages, novel reliability test methods, life models, FA techniques & materials characterization, component and board level reliability in computing, HPC, mobile, networking, automotive, power electronics, harsh/hi-temp environments, IoT, sensors, AI, autonomous vehicles, medical, wearable electronics, LEDs, displays and memory; reliability and test methods for thermal materials (TIM) and reliability in related to liquid cooling and immersion cooling.
