Thermal/Mechanical Simulation & Characterization
Major topics: Thermal/mechanical simulation and characterization at component, board, and system levels for all packaging technologies; Reliability related modeling including fracture mechanics, fatigue, electromigration, warpage, delamination, moisture, drop, shock and vibration, and modeling for harsh environments (thermal, chemical, etc.); Material constitutive relations; Chip-package interaction for heterogeneous integration, wafer fabrication and package assembly process related modeling; Novel modeling techniques including multi-scale physics, co-design approaches; Quantum computing; Measurement methodologies, characterization and correlations, model order reduction, sensitivity analysis, optimization, statistical analysis; application of artificial intelligence on modeling, characterization, and digital twin; credible simulations; CFD simulation.
