Thermal/Mechanical Simulation & Characterization

Major topics: thermal/mechanical simulation and characterization at component, board, and system levels for all packaging technologies: reliability related modeling including fracture mechanics, fatigue, electromigration, warpage, delamination, moisture, drop, shock and vibration, and modeling for harsh environments (thermal, chemical, etc.); material constitutive relations; chip-package interaction for heterogeneous integration, wafer fabrication and package assembly process related modeling; novel modeling techniques including multi-scale physics, co-design approaches; quantum computing; measurement methodologies, characterization and correlations, model order reduction, sensitivity analysis, optimization, statistical analysis; application of artificial intelligence on modeling,  characterization, digital twin; and credible simulations for virtual release.

Chair
Wei Wang
Qualcomm Technologies, Inc.

5775 Morehouse Drive
San Diego CA 92121
USA
Phone: +1-858-651-5933
Email: Click Here
Assistant Chair
Karsten Meier
Technische Universit├Ąt Dresden
Institute of Electronic Packaging Technology
Mommsenstrasse 15
Dresden Saxony 01069
Germany
Phone: +49 351 463 - 36 594
Email: Click Here
Christopher J. Bailey
University of Greenwich
Old Royal Naval College
Park Row
London SE10 9LS
United Kingdom
Phone: +44 (0) 20 8331 8660
Email: Click Here
Rui Chen
Georgia Institute of Technology
George W. Woodruff School of Mechanical Engineering
813 Ferst Drive NW
Atlanta GA 30332
USA
Phone: +1-470-232-5868
Email: Click Here
Kuo-Ning Chiang
National Tsinghua University

No. 101, Sec. 2, KungFu Rd.
HsinChu 300
Taiwan
Phone: +886-3-574-2925
Email: Click Here
Xuejun Fan
Lamar University
Department of Mechanical Engineering
PO Box 10028
Beaumont TX 77710
USA
Phone: +1-409-880-7792
Email: Click Here
Przemyslaw Gromala
Robert Bosch GmbH
Automotive Elecronics
Tuebinger Str. 123
Reutlingen 72762
Germany
Phone: +49-162-8514983
Email: Click Here
Nancy Iwamoto



CA 92065
USA
Phone:
Email: Click Here
Pradeep Lall
Auburn University
Dept. of Mechanical Engineering
201 Ross Hall
Auburn AL 36830
USA
Phone: +1-334-844-3424
Email: Click Here
Chang-Chun Lee
National Tsing hua University (NTHU)

No. 101, Sec. 2, KungFu Rd.
HsinChu 300
Taiwan
Phone: +886-3-5162410
Email: Click Here
Sheng Liu
Wuhan University
School of Power and Mechanical Engineering
No. 8, South Donghu Road, Wuchang District
Wuhan Hubei Province
China
Phone: +86-27-68774381
Email: Click Here
Yong Liu
ON Semiconductor
MS 35-2E
82 Running Hill Road
South Portland ME 04106
USA
Phone: +1-207-761-3155
Email: Click Here
Erdogan Madenci
University of Arizona
Dept. of Aerospace and Mechanical Engineering

Tucson AZ 85721
USA
Phone: +1-520-621-6113
Email: Click Here
Tony Mak
Wentworth Institute of Technology
Applied Mathematics and Engineering
550 Huntington Ave.
Boston MA 02115
USA
Phone: +1-334-625-8669
Email: Click Here
Patrick McCluskey
University of Maryland
Dept. of Mechanical Engineering
2125 Glenn L. Martin Hall #88
College Park MD 20742
USA
Phone: +1-301-405-279
Email: Click Here
Jiamin Ni
IBM

1101 Kitchawan Rd
Yorktown Heights NY 10598
USA
Phone: +1-518-596-3407
Email: Click Here
Erkan Oterkus
University of Strathclyde


Glasgow G4 0LZ
United Kingdom
Phone: +44 (0)141 548 3876
Email: Click Here
Suresh K. Sitaraman
Georgia Institute of Technology
George W. Woodruff School of Mechanical Engineering
813 Ferst Dr., NW
Atlanta GA 30332
USA
Phone: +1-404-894-3405
Email: Click Here
Zhi Yang
Groq

400 Castro St
Mountain View CA 94041
USA
Phone:
Email: Click Here
Ning Ye
Western Digital

951 SanDisk Dr.
Milpitas CA 95035
USA
Phone: +1-408-801-1278
Email: Click Here
G. Q. (Kouchi) Zhang
Delft University of Technology (TUD)
Delft Institute for Micro/Nanoelectronics and System
Feldmannweg 17
Delft 2600 BG
Netherlands
Phone: +31-6-24888240
Email: Click Here
Tieyu Zheng
Microsoft Corporation

One Microsoft Way
Redmond WA 98052
USA
Phone: +1-425- 722-1141
Email: Click Here
Jiantao Zheng
Hisilicon
Section D, Bantian Longgang Base

Shenzhen
China
Phone: +86-755-28425738
Email: Click Here