Assembly & Manufacturing Technology

Major topics: Assembly and manufacturing challenges for new markets; die bonding methods and process challenges: D2D, D2W, W2W; Wafer level process/materials technologies; Die and package singulation manufacturing; New & next generation substrates; Smart factory/manufacturing; Assembly related test/yield hardware development/improvement; Integrating advanced thermal solutions in manufacturing: Design/performance, integrating solutions, thermal materials, low stress/high thermal; Process advancements/yield enhancements; Cost of inspection, sampling, metrology, new processes for fine RDL, small via fabrication, transfer/compression/injection mold; Heterogeneous integration and process: FlipChip, chiplets, 3D stacking, bridge technology, large body, warpage management; Shielding/protection technologies and manufacturing and market requirements.