ECTC | IEEE Electronic Components and Technology Conference

Assembly & Manufacturing Technology

Major topics: Assembly and manufacturing challenges for new markets; die bonding methods and process challenges: D2D, D2W, W2W; Wafer level process/materials technologies; Die and package singulation manufacturing; New & next generation substrates; Smart factory/manufacturing; Assembly related test/yield hardware development/improvement; Integrating advanced thermal solutions in manufacturing: Design/performance, integrating solutions, thermal materials, low stress/high thermal; Process advancements/yield enhancements; Cost of inspection, sampling, metrology, new processes for fine RDL, small via fabrication, transfer/compression/injection mold; Heterogeneous integration and process: FlipChip, chiplets, 3D stacking, bridge technology, large body, warpage management; Shielding/protection technologies and manufacturing and market requirements.

Chair Paul Houston Engent Suite 300A 3140 Northwoods Parkway Norcross GA 30071 USA Phone: +1-770-280-4238 Email: Click Here	Assistant Chair Christo Bojkov Adj. Faculty with UT Dallas Dallas TX USA Phone: +1-468.486.0662 Email: Click Here
Sai Ankireddi Maxim Integrated 160 Rio Robles San Jose CA 95134 USA Phone: +1-408-582-2231 Email: Click Here	Pascale Gagnon IBM Canada 23 Boulevard del'Aeroport Bromont, Quebec Canada Phone: Email: Click Here	Mark Gerber Advanced Semiconductor Engineering Inc. 14785 Preston Road, Suite 670 Dallas TX 75254 USA Phone: +1-214-305-2154 Email: Click Here
Omkar Gupte AMD 7171 Southwest Parkway, bldg 200 Austin TX 78735 USA Phone: Email: Click Here	Timo Henttonen Microsoft Mountain View CA USA Phone: Email: Click Here	Habib Hichri Ajinomoto Fine-Techno USA Corporation Suite 105 20380 Town Center Lane Cupertino CA 95014 USA Phone: +1 408 564 7245 Email: Click Here
Li Jiang Texas Instruments South Campus, K2-250 12500 TI Blvd Dallas TX 75080 USA Phone: +1-214-479-4537 Email: Click Here	Zia Karim Yield Engineering Systems 3178 Laurelview Ct Fremont CA 94538 USA Phone: (408) 329 2809 Email: Click Here	Wei Koh Pacrim Technology 12 Flora Springs Irvine CA 92606 USA Phone: +1-714-417-9979 Email: Click Here
Siddarth Krishnan Applied Materials San Jose CA Phone: 512-699-2372 Email: Click Here	Wenhao (Eric) Li Intel Corporation 5000 W Chandler Blvd Chandler AZ 85226 USA Phone: Email: Click Here	Venkata Mokkapati AT & S Fabriksgasse 13 Leoben Austria Phone: Email: Click Here
Jae-Woong Nah IBM Corporation 1101 Kitchawan Rd. Yorktown Heights NY 10598 USA Phone: +1-914-945-1875 Email: Click Here	Valerie Oberson IBM Canada Ltd 23 Boulevard Bromont QC JOE 1L0 Canada Phone: +1-450-534-7767 Email: Click Here	Jason Rouse Taiyo America, Inc. 2675 Antler Drive Carson City NV 89701 USA Phone: 408-821-2705 Email: Click Here
A R Nazmus Sakib Renesas Austin TX 78735 USA Phone: 817-501-8161 Email: Click Here	Andy Tseng Qualcomm 2841 Mission College Blvd Santa Clara California 95054 USA Phone: +1-510-402-8085 Email: Click Here	Jobert Van Eisden ATOTECH USA LLC 1750 Overview Drive Rock Hill NC 29730 USA Phone: Email: Click Here
Jan Vardaman TechSearch International 4801 Spicewood Springs Road #150 Austin TX 78759 Phone: Email: Click Here	Shaw Fong Wong Intel Corporation KM3-2-E19 Lot-8, Jalan Hi-Tech 2/3, Kulim High Tech Park Kulim Kedah 09000 Malaysia Phone: +604-433-2941 Email: Click Here	Jin Yang Samsung Electronics USA Phone: Email: Click Here
Cong Zhao Meta 900 Discovery Wy Sunnyvale CA 94089 Phone: Email: Click Here	Ralph Zoberbier Evatec AG Hauptstrasse 1A Trübbach 9477 Switzerland Phone: Email: Click Here

2025 IEEE 75th Electronic Components and Technology Conference

Assembly & Manufacturing Technology

ECTC Technical Program Subcommittees