ECTC | IEEE Electronic Components and Technology Conference

Materials & Processing

Major topics: Wafer/panel level packaging materials and process advancements; Advanced materials and processes for FOWLP, FOPLP, 2.5D/3D, SiP, TSV, chiplets, and advanced packaging architectures; Harsh environment resistant materials; Packaging substrates; Flexible, stretchable, & wearable electronics; Temporary wafer bond/debond materials/processes; Permanent adhesives; TCB and hybrid bonding; Adhesives, dielectrics and underfills; Emerging electronic materials & processes; Conductive adhesives; Novel solder metallurgies; Molding compounds; Thermal interface materials; Advanced wire bonding.

Chair Kimberly Yess Brewer Science 2401 Brewer Drive Rolla MO 65401 USA Phone: +1-573-201-8669 Email: Click Here	Assistant Chair Qianwen Chen IBM Research 1101 Kitchawan Rd Yorktown Heights NY 10562 USA Phone: +1-914-945-1612 Email: Click Here
Tanja Braun Fraunhofer IZM Gustav-Meyer-Allee 25 Berlin 13355 Germany Phone: +49 30 46403244 Email: Click Here	Yu-Hua Chen Unimicron New Business Development Division No. 290, Chung-Lun Village, Hsin-Feng Hinchu Taiwan 304 R.O.C Phone: +886-3-5995899#2109 Email: Click Here	Jae Kyu Cho GlobalFoundries 400 Stonebreak Road Extension Malta NY 12020 Phone: Email: Click Here
Bing Dang IBM Corporation 85 Park Drive Chappaqua NY 10514 USA Phone: +1-914-945-1568 Email: Click Here	Yung-Yu Hsu Meta Platforms, Inc. 1 Hacker Way Menlo Park CA 94025 United States Phone: +1-617-866-3431 Email: Click Here	Lewis Huang Senju Electronic Taiwan Phone: Email: Click Here
C. Robert Kao National Taiwan University Dept. of Materials Sci. & Eng. Taipei City 106 Taiwan Phone: +886-233663745 Email: Click Here	Alvin Lee Brewer Science 3F-2. No. 142, Chung-Hsiao E. Rd., Sec. 4 Taipei 106 Taiwan Phone: +886-2-2777-2990 Email: Click Here	Yi Li Intel Corporation 5000 W Chandler Blvd Chandler Arizona 85226 United States Phone: +1-480-554-1657 Email: Click Here
Ziyin Lin Intel Corporation Phone: Email: Click Here	Yan Liu Medtronic Inc. USA 2343 W Medtronic Way Tempe AZ 85281 Phone: +1-480-477-2311 Email: Click Here	Mikel Miller Apple Inc. 10335 N. Tantau Avenue Cupertino CA 95014 USA Phone: Email: Click Here
Praveen Pandojirao-S Johnson & Johnson 1700 E. Saint Andrew Place Santa Ana CA 92618 USA Phone: +1-714-247-8280 Email: Click Here	Mark Poliks Binghamton University Watson School, SSIE Dept, EB Room S09 PO Box 6000 Binghamton NY 13902 USA Phone: +1-607-727-7014 Email: Click Here	Dwayne Shirley Inphi San Diego CA 92121 USA Phone: Email: Click Here
Ivan Shubin RAM Photonics LLS 9985 Pacific Heights Blvd. Suite 150 San Diego CA 92121-4310 USA Phone: Email: Click Here	Bo Song HP Inc. 1030 NE Circle Blvd Corvallis Oregon 97330 United States Phone: +1-607-727-8309 Email: Click Here	Yoichi Taira Keio University 3-14-1 Hiyoshi Kohoku-ku, Yokohama 223-8522 Japan Phone: +81-90-8777-5836 Email: Click Here
Jayaram Vidya Intel Corporation Phone: +1 (480) 277-6784 Email: Click Here	Lingyun (Lucy) Wei Dupont Phone: Email: Click Here	Frank Wei DISCO Corporation 40 Shattuck Road, Suite 103 Andover United States 01810 USA Phone: 6036569019 Email: Click Here
Myung Jin Yim Apple Inc. USA Phone: Email: Click Here	Hongbin Yu Arizona State University School of Electrical, Computer and Energy Engineering, Arizona State University Tempe AZ 85287 USA Phone: +1-480-965-4455 Email: Click Here	Zhangming Zhou Qualcomm Phone: Email: Click Here

2022 IEEE 72nd Electronic Components and Technology Conference

Materials & Processing

Committee Links