Materials & Processing
Major topics: Wafer/panel level packaging materials and process advancements; Advanced materials and processes for FOWLP, FOPLP, 2.5D/3D, SiP, TSV, chiplets, and advanced packaging architectures; Harsh environment resistant materials; Packaging substrates; Flexible, stretchable, & wearable electronics; Temporary wafer bond/debond materials/processes; Permanent adhesives; TCB and hybrid bonding; Adhesives, dielectrics and underfills; Emerging electronic materials & processes; Conductive and Non-Conductive adhesives; 3D Materials and Thin Wafer Processing, Novel solder metallurgies; Molding compounds; Thermal interface materials; Advanced wire bonding, Novel Materials and Processing, Emerging Materials.
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Chair
Qianwen Chen IBM Research 1101 Kitchawan Rd Yorktown Heights NY 10562 USA Phone: +1-914-945-1612 Email: Click Here |
Assistant Chair
Vidya Jayaram Intel Corporation 5000 W Chandler Blvd Chandler Az 85226 Phone: +1 (480) 277-6784 Email: Click Here |
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Tanja Braun
Fraunhofer IZM Gustav-Meyer-Allee 25 Berlin 13355 Germany Phone: +49 30 46403244 Email: Click Here |
Yu-Hua Chen
Unimicron Carrier SBU/R&D Division No. 179, Shanying Road, Guishan Ind. Park, Taoyuan City Taiwan 33342 R.O.C Phone: +886-3-3503535#8782109 Email: Click Here |
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Bing Dang
IBM Corporation 1101 Kitchawan Road Yorktown Heights NY 10598 USA Phone: +1-914-945-1568 Email: Click Here |
Yung-Yu Hsu
Meta Platforms, Inc. 1 Hacker Way Menlo Park CA 94025 United States Phone: +1-617-866-3431 Email: Click Here |
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C. Robert Kao
National Taiwan University Dept. of Materials Sci. & Eng. Taipei City 106 Taiwan Phone: +886-233663745 Email: Click Here |
Alvin Lee
Brewer Science 3F-2. No. 142, Chung-Hsiao E. Rd., Sec. 4 Taipei 106 Taiwan Phone: +886-2-2777-2990 Email: Click Here |
Yi Li
Intel Corporation 5000 W Chandler Blvd Chandler Arizona 85226 United States Phone: +1-480-554-1657 Email: Click Here |
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Yan Liu
Medtronic Inc. USA 2343 W Medtronic Way Tempe AZ 85281 Phone: +1-480-477-2311 Email: Click Here |
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Praveen Pandojirao-S
Johnson & Johnson 25A Technology Drive Irvine CA 92618 USA Phone: +1(949)450-6838 Email: Click Here |
Mark Poliks
Binghamton University Watson School, SSIE Dept, EB Room S09 PO Box 6000 Binghamton NY 13902 USA Phone: +1-607-727-7014 Email: Click Here |
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Ivan Shubin
Raytheon Technologies 9985 Pacific Heights Blvd. Suite 150 San Diego CA 92121-4310 USA Phone: Email: Click Here |
Bo Song
HP Inc. 1030 NE Circle Blvd Corvallis Oregon 97330 United States Phone: +1-607-727-8309 Email: Click Here |
Yoichi Taira
Keio University 3-14-1 Hiyoshi Kohoku-ku, Yokohama 223-8522 Japan Phone: +81-90-8777-5836 Email: Click Here |
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Frank Wei
DISCO Corporation 40 Shattuck Road, Suite 103 Andover United States 01810 USA Phone: 6036569019 Email: Click Here |
Kimberly Yess
Brewer Science 2401 Brewer Drive Rolla MO 65401 USA Phone: +1-573-201-8669 Email: Click Here |
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Hongbin Yu
Arizona State University School of Electrical, Computer and Energy Engineering, Arizona State University Tempe AZ 85287 USA Phone: +1-480-965-4455 Email: Click Here |
Zhangming Zhou
Qualcomm 5745 Pacific Center Blvd San Diego Ca 92121 USA Phone: +1(858)888-1388 Email: Click Here |
