Materials & Processing
Major topics: Advanced materials and processes for hybrid bonding, fan-out, Si interposer, 2.5D/3D, Chiplets, HI, TSV; advanced materials and processes for thermal and mechanical improvement for packaging; wafer & panel level packaging materials and process advancements; dielectrics and underfills, molding compounds, thermal interface materials; harsh environment resistant materials; temporary wafer bond/debond materials and processes, TCB and hybrid bonding, conductive adhesives; emerging electronic materials and processes; novel solder metallurgies; novel materials and processes for high density interconnect.
