Materials & Processing

Major topics: Wafer/panel level packaging materials and process advancements; Advanced materials and processes for FOWLP, FOPLP, 2.5D/3D, SiP, TSV, chiplets, and advanced packaging architectures; Harsh environment resistant materials; Packaging substrates; Flexible, stretchable, & wearable electronics; Temporary wafer bond/debond materials/processes; Permanent adhesives; TCB and hybrid bonding; Adhesives, dielectrics and underfills; Emerging electronic materials & processes; Conductive adhesives; Novel solder metallurgies; Molding compounds; Thermal interface materials; Advanced wire bonding.

Chair
Kimberly Yess
Brewer Science

2401 Brewer Drive
Rolla MO 65401
USA
Phone: +1-573-201-8669
Email: Click Here
Assistant Chair
Qianwen Chen
IBM Research

1101 Kitchawan Rd
Yorktown Heights NY 10562
USA
Phone: +1-914-945-1612
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Tanja Braun
Fraunhofer IZM

Gustav-Meyer-Allee 25
Berlin 13355
Germany
Phone: +49 30 46403244
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Yu-Hua Chen
Unimicron
New Business Development Division
No. 290, Chung-Lun Village, Hsin-Feng
Hinchu Taiwan 304
R.O.C
Phone: +886-3-5995899#2109
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Jae Kyu Cho
GlobalFoundries

400 Stonebreak Road Extension
Malta NY 12020

Phone:
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Bing Dang
IBM Corporation

85 Park Drive
Chappaqua NY 10514
USA
Phone: +1-914-945-1568
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Yung-Yu Hsu
Meta Platforms, Inc.

1 Hacker Way
Menlo Park CA 94025
United States
Phone: +1-617-866-3431
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Lewis Huang
Senju Electronic



Taiwan
Phone:
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C. Robert Kao
National Taiwan University
Dept. of Materials Sci. & Eng.

Taipei City 106
Taiwan
Phone: +886-233663745
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Alvin Lee
Brewer Science
3F-2.
No. 142, Chung-Hsiao E. Rd., Sec. 4
Taipei 106
Taiwan
Phone: +886-2-2777-2990
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Yi Li
Intel Corporation

5000 W Chandler Blvd
Chandler Arizona 85226
United States
Phone: +1-480-554-1657
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Ziyin Lin
Intel Corporation




Phone:
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Yan Liu
Medtronic Inc. USA

2343 W Medtronic Way
Tempe AZ 85281

Phone: +1-480-477-2311
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Mikel Miller
Apple Inc.

10335 N. Tantau Avenue
Cupertino CA 95014
USA
Phone:
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Praveen Pandojirao-S
Johnson & Johnson

1700 E. Saint Andrew Place
Santa Ana CA 92618
USA
Phone: +1-714-247-8280
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Mark Poliks
Binghamton University
Watson School, SSIE Dept, EB Room S09
PO Box 6000
Binghamton NY 13902
USA
Phone: +1-607-727-7014
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Dwayne Shirley
Inphi


San Diego CA 92121
USA
Phone:
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Ivan Shubin
RAM Photonics LLS

9985 Pacific Heights Blvd. Suite 150
San Diego CA 92121-4310
USA
Phone:
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Bo Song
HP Inc.

1030 NE Circle Blvd
Corvallis Oregon 97330
United States
Phone: +1-607-727-8309
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Yoichi Taira
Keio University

3-14-1 Hiyoshi
Kohoku-ku, Yokohama 223-8522
Japan
Phone: +81-90-8777-5836
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Jayaram Vidya
Intel Corporation




Phone: +1 (480) 277-6784
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Lingyun (Lucy) Wei
Dupont




Phone:
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Frank Wei
DISCO Corporation

40 Shattuck Road, Suite 103
Andover United States 01810
USA
Phone: 6036569019
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Myung Jin Yim
Apple Inc.



USA
Phone:
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Hongbin Yu
Arizona State University
School of Electrical, Computer and Energy Engineering,
Arizona State University
Tempe AZ 85287
USA
Phone: +1-480-965-4455
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Zhangming Zhou
Qualcomm




Phone:
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