76th ECTC Highlights

Best Papers 76th ECTC

76th ECTC will have several best paper competitions. All awards will be presented at 77th ECTC.

Special Events Presentations

ECTC Young Professional Networking Event
Chair: Aakrati Jain, IBM

IEEE EPS Seminar on Organic Substrates in the Chiplet Era – Redefining System Integration: The Rise of Organic Substrates in the Chiplet Era
Chairs: Takashi Hisada, Rapidus and Yasumitsu Orii, Rapidus
Speakers: Toshihiko Nishio, SBR Technology

IEEE EPS President’s Panel – Data Centers in the Age of AI: Challenges and Solutions
Chairs: Benson Chan, EPS Emerging Technology TC Chair; David McCann, EPS VP Technology; Jeff Suhling, EPS President
Moderated by: Prof Kanad Ghose, Binghamton University

Professional Development Courses

PDC 01: High Reliability Soldering in Advanced Semiconductor Packaging – Ning-Cheng Lee, ShinePure Hi-Tech

PDC 02: Photonic Components and Packaging Technologies for Data Center, Communication, Sensing, and Displays – Torsten Wipiejewski, Huawei Technologies Duesseldorf GmbH

PDC 03: Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding for Heterogeneous Integration and Advanced Packaging – Viorel Dragoi, EV Group

PDC 04: Introduction to Quality and Reliability Engineering of Advanced Microelectronics Packaging – Shubhada Sahasrabudhe, QuRIuS LLC; Shalabh Tandon, QuRIuS LLC

PDC 05: 2.5D/3D Package Failure Analysis – Failure Mechanisms and Analytical Tools – Deepak Goyal, Carl Zeiss, Inc.

PDC 06: AI-Applications in Semiconductor Packaging – Pradeep Lall, Auburn University

PDC 07: Fundamentals of Fabrication Processes and RF Design of Advanced Packages Including Fan-Out, Chiplets, Glass and Polymer Interposers – Ivan Ndip, Brandenburg University of Technology/Fraunhofer IZM; Markus Woehrmann, Fraunhofer IZM

PDC 08: Electronics Cooling and Reliability for Data Centers – Patrick McCluskey, University of Maryland, College Park

PDC 09: Polymers for Advanced Packaging – Jeff Gotro, InnoCentrix, LLC

PDC 10: Diamond Heat Spreaders and Heterogeneous Integration – Joana-Catarina Mendes, Instituto de Telecomunicaciones

PDC 11: Advanced Packaging for Chiplet, Heterogeneous Integration, and Co-Packaged Optics – John H. Lau, Unimicron Technology Corp.

PDC 12: Preventing Packaging Failure – Modeling and Mitigation Strategies for Warpage, Fatigue, and Thermal Issues – Xuejun Fan, Lamar University

PDC 13: Failure Analysis of Engineering Materials for Advanced Electronic Packaging – Kuan Yew Cheong, Universiti Sains Malaysia

PDC 14: Flip Chip Technologies – Shengmin Wen, TATA Electronics Private Limited

PDC 15: Advanced Packaging for 5G/6G – RF Focus – Premjeet Chahal, Michigan State University

PDC 16: Thermal Management in the Age of AI – Course Leader(s): Jaime Sanchez, Lightmatter, Inc

Special Sessions

2026 Keynote Talk – Advanced Packaging and the Future of System Optimization
Chair: Michael Mayer, University of Waterloo, Canada
Speaker: Tien Wu, CEO of Advanced Semiconductor Engineering, Inc.

Student Innovation Challenges
Chairs: Przemyslaw Gromala, Robert Bosh Kft; Ibrahim Guven, Virginia Commonwealth University

Plenary Session on Data Centers Needs – Efficiency Is Not Enough: Are We Solving the Wrong in the Data Center Energy Use?
Chairs: Masha Gorchichko, Applied Materials, Inc.; Jan Vardaman, TechSearch International, Inc.
Speakers: David Lo, Google; Ankur Agarwal, Celestia AI; Raja Swaminathan, AMD; John Knickerbocker, IBM; Rich Bonner, Accelsius

Start-Up Challenge –The Light Age: Strategic Investment in Photonics to Power the Next Computing Era
Chairs: Rozalia Beica,Rapidus; Farhang Yazdani; Jason Rousse, Taiyo America

Quantum Infrastructure for AI Applications – Quantum Infrastructure for AI Applications: Packaging Challenges and Roadmap
Chairs: Rabindra N. Das, MIT Lincoln Laboratory, Pavel Roy Paladhi, NVIDIA
Speakers: Brian Maertz, Google Quantum; Mark Gouker, MIT Lincoln Lab; William Oliver, MIT; Luu Nguyen, PsiQuantum; Michael J. Manfra, Microsoft Quantum; Bart Machielse, IonQ

Advanced Substrates and Panel-Level Integration – Engineering Next Generation Packaging Technologies With Advanced Substrates and Panel-Level Integration
Chairs: Venkata Mokkapati, AT&S; Markus Leitgeb, AT&S
Speakers: Roger St. Amand, Amkor Technology; Hamid Eslampour, Lightmatter; Ravi Mahajan, Intel Corporation; Luu Ngyuen, PSI Quantum; Shang Y. Hou, TSMC

AI-Enabled EDA – AI-Enabled Electronic Design Automation for Multi-Physics Advanced Packaging
Chairs: Ian O’Connor, Ecole Centrale de Lyon, France; Jose Schutt-Aine, University of Illinois at Urbana-Champaign
Speakers: Christopher Bailey, Arizona State University; Madhavan Swaminathan, Pennsylvania State University; Hanzhi Ma, Zhejiang University; Nandish Mehta, NVIDIA Research; Jan Vardaman, TechSearch Intl.; David Atienza, EPFL; Norman Chang, Synopsys

Photonic-based Systems – Photonic-Based Systems for AI and Exascale Computing
Chairs: Stéphane Bernabé, CEA-LETI; Lars Brusberg, Corning Inc.
Speakers: Severine Cheramy, Scintil Photonics; Farnood Rezaie, Cisco Systems; Shang Y. Hou, TSMC; Darius Bunandar, Lightmatter

System Integration Challenges – System Integration Challenges of Large-Size and High-Power Components for High-Performance Computing and AI Applications
Chairs: Tae-Kyu Lee, Cisco Systems, Inc.; Peng Su, Hewlett Packard Enterprise (HPE)
Speakers: Hemanth Dhavaleswarapu, AMD; Mudasir Ahmad, Cisco: Richard Rao, Marvell; Dongji Xie, NVIDIA

Co-Design in High-Performance Packaging – Electrical-Thermal-Mechanical Co-Design in High-Performance Packaging
Chairs: Ning Ye, Sandisk; Tiwei Wei, University of California, Los Angeles
Speakers: Bill En, AMD; Gang Duan, Samsung Electro-Mechanics; Harrison Chang, ASE; Kathy Yan, TSMC; Kelly Morgan, Synopsys; Yu-Tao Yang, Mediatek

Wafer to Panel – Enabling Next-Generation Advanced Packaging Technology From Wafer to Panel
Chairs: Kuldip Johal, MKS Instruments; Beth Keser, Volantis Semiconductor; Liong Chao, ASE
Speakers: Deepak Kulkarni, AMD; Abe Hidenori, Resonac; CP HUng, ASE; Herbert Oetzlinger, LAM; Gang Duan, Samsung

Innovative Materials for Advanced Packaging – Innovative Materials for Advanced Packaging – Materials for Packaging, Integration, and Performance
Chairs: Zia Karim, Yield Engineering Systems; Ksenija Varga, EV Group
Speakers: Kathy Yan, TSMC; Rama Puligadda, Brewer Science; Zsolt Tokei, IMEC; Seiichiro Ohashi, Ajinomoto Fine-Techno Co., Inc.; Hidenori Abe, Resonac Holding Corporation

HIR Presentations

IEEE EPS Heterogeneous Integration Roadmap (HIR) Workshop
Four Technical Sessions, spanning morning and afternoon of Tuesday, May 26, 2026
Chairs: Ravi Mahajan, Intel Corporation and William Chen, ASE

Event & Session Videos

ECTC YouTube Channel

Media Coverage

Highlight Articles

Conference program preview: (Bold face are media sponsors)

Chip Scale Review: The 76th Electronics Packaging Technology Conference EPTC 2026.

Global Advanced Packaging: 2026 IEEE ECTC to Feature a Keynote Address by Dr. Tien Wu, CEO of ASE

Circuits Assembly: ASE CEO Tien Wu to Keynote IEEE ECTC 2026 in Orlando

Tipsheet coverage

Semiconductor Digest: 2026 IEEE Electronic Components and Technology Conference (ECTC) To Showcase the Latest Electronic Packaging Technologies

Electronics Weekly (UK): 76th ECTC May 26-29 Orlando – Tipsheet

EMSNow: 2026 IEEE Electronic Components and Technology Conference (ECTC) To Showcase the Latest Electronic Packaging Technologies

TimesTech.in: 2026 IEEE ECTC To Showcase the Latest Electronic Packaging Technologies

Overall program recap:

PC Watch (Japan): The main role of semiconductors is from wafers to packages. ECTC’s excitement shows R&D tectonic shift

Circuits Assembly: ECTC Focuses on Challenges for AI Data Center Packaging and Energy Use

SemiAnalysis: ECTC Focuses on Challenges for AI Data Center Packaging and Energy Use

Student competition:

Electronic Engineering Journal: 2026 IEEE Electronic Components and Technology Conference Announces Student Innovation Challenge; Result Reports Must be Submitted by January 19, 2026

Electronics Weekly: IEEE announces student challenge for semiconductor packaging

EMSNow: 2026 IEEE Electronic Components and Technology Conference Announces Student Innovation Challenge; Result Reports Must be Submitted by January 19, 2026

Microwave Journal: 2026 IEEE ECTC Extends Student Innovation Challenge Pre-registration Deadline to January 11, 2026

Circuits Assembly: 2026 IEEE Electronic Components and Technology Conference Student Innovation Challenge Pre-registration Deadline Extended to January 11, 2026

University News Network (Korea): Professor Kim Hak-Sung, Hanyang University, 3rd Gwanwang from the world’s leading semiconductor packaging society ‘ECTC 2026’

NATE (Korea): Hanyang University Professor Kim Hak-sung’s Team Wins Three Awards at ECTC 2026

E-News Today (Korea): Sungkyunkwan University Professor Eunho Lee, 2nd consecutive year of the world’s top semiconductor packaging society, 3rd crown, including the Best Paper Award

Glass interposer panel/TGV technology:
Electronic Times: ECTC 2026: ‘Glass Substrates’ Take Center Stage in AI Packaging—Spotlight on Glass Core and TGV Technologies

Naver Online (Korea): ECTC 2026: ‘Glass Substrates’ Take Center Stage in AI Packaging—Spotlight on Glass Core and TGV Technologies

Commercial Times (Taiwan): The next revolution in the AI chip is coming! TGV glass drilling into a key battlefield, who occupies the first machine

Taiwan News (Taiwan): Taiwan’s TGV supply chain takes shape as firms pursue glass-based chip packaging advances

HBM technology:
Semiconductor Engineering: HBM Leads The Way To Defect-Free Bumps

SemiVision: ECTC 2026: The Three HBM Battlegrounds Defining the Next AI Hardware Race

Hybrid bonding technology:
Semiconductor Engineering: Making Hybrid Bonding Better