Best Paper 75th ECTC will be awarded at next ECTC
Best Papers 75th ECTC
1) Best Session Paper
Direct-to-Silicon Liquid Cooling Integrated on CoWoS® Platform
Co-authored by Yu-Jen Lien, Sing-Da Jiang, Cheng-Chieh Hsieh, Han-Jong Chia, Tsunyen Wu, Chien-Chih Lin,Ke-Han Shen, Szu-Wei Lu, Kathy Yan, Kuo-Chung Yee, Douglas C.H. Yu, Taiwan Semiconductor, Manufacturing Company, Ltd., Hsinchu, Taiwan, R.O.C.
2) Best Interactive Presentation Paper
An Effective 3D Thermal Network Integrated With Deep Learning for Improved Prediction of the 3D Thermal Properties of Complex Packaging Patterns
Co-authored by Jeong-Hyeon Park, Jaechoon Kim, Sukwon Jang, Sungho Mun, Eun-Ho Lee, Samsung Electronics Co. Ltd, Yongin-Si, Republic of Korea
3) Outstanding Session Paper
Development of Glass Core Build-up Substrate With TGV
Co-authored by Masahiro Sunohara, Jun Yoshiike, Hiroshi Taneda, Yoko Nakabayashi, Noriyoshi Shimizu, Shinko Electric Industries Co., Ltd, Nagano, Japan
4) Outstanding Interactive Presentation Paper
Novel Packaging Platform Based on Bridge Dies With Top and Bottom I/O Connections on Standard Substrates
Co-authored by Jae-Sung Lim, Sangkyu Jang, Yong Gyu Jang, Yongnam Koh, Jin-Wook Jang, R&D Center, HANA Micron Inc., Republic of Korea, Jayden Donghyun Kim, HANA Micron Inc., Asan, Korea
5) Intel Best Student Paper
Physics-Informed Neural Networks for SAM Image Enhancement with a Novel Physics-Constrained Metric for Advanced Semiconductor Packaging Inspection
Co-authored by Shajib Ghosh, Nitin Varshney, Antika Roy, Patrick Craig, Md Mahfuz Al Hasan, Sanjeev J. Koppal, Navid Asadizanjani; ECE Department, University of Florida, Rayhane Ghane-Motlagh, ficonTEC Service USA Inc.; Nelly Elsayed, University of Cincinnati
6) Intel Outstanding Student Paper Award
Packaging and Integration of Multifunctional Brain Computer Interface
Co-authored by Ziqi Jia, Ariel David Cerpa, Gloria J. Kim, Yong-Kyu Yoon, University of Florida, Gainesville, United States
7) TI Best IP Student Award
Parasitic Extraction and Signal Integrity Analysis of Memristor-Based Crossbar Arrays for Neuromorphic Computing
Co-authored by Tahsin Binte Shameem, Hanzhi Ma, Yi Zhou, Zohreh Salehi, José E. Schutt-Ainé, Urbana-Champaign, University of Illinois, Urbana, IL, USA
Special Events Presentations
1) Ultra High Density Interconnect Technologies and Supply Chain Readiness for AI & HPC
Chairs: Rozalia Beica (Rapidus Design Solutions), Habib Hichri (Ajinomoto Fine-Techno USA Corporation)
Speakers: Yu-Hua Chen (Unimicron Technology Corp.), Niranjan Khasgiwale (Applied Materials, Inc.), Kuldip Johal (MKS Instruments), Yoshio Nishimura (Ajinomoto Co., Inc), Monita Pau (Onto Innovation), Yoshio Takatsu (ORC Manufacturing Co., Ltd)
2) Hybrid Bonding (HB): to B, or not to B? Needs and challenges for the next decade
Chairs: Benson Chan (Binghamton University), Masha Gorchichko (Applied Materials, Inc.), Dishit Parekh (AMD Inc.)
Speakers: Su Jin Ahn (Samsung Electronics), Brett Wilkerson (AMD), Chet Lenox (KLA Corporation), Anne Jourdain (imec), Masao Tomikawa (Toray Industries, Inc.), Laura W. Mirkarimi (Adeia)
3) Quantum Photonics Advanced Packaging
Chairs: Ajey Jacob (University of Southern California), Richard Pitwon (Resolute Photonics, Ltd.)
Speakers: Andrew Meek (Senko Advanced Components), Takahiro Kashiwazaki (NTT), Ilaria Di Luch (Xanadu Quantum Technologies Inc; Inna Krasnokutska, Xanadu Quantum Technologies Inc)
4) Glass Core vs. RDL Interposers: Ready for Prime-Time?
Chairs: Thom M. Gregorich (Zeiss), Zia Karim (Yield Engineering Systems), Jan Vardaman (TechSearch International, Inc.)
Speakers: Brett Wilkerson (AMD), Kathy Wei Yan (Taiwan Semiconductor Manufacturing Company, Ltd.), Gang Duan (Intel Corporation), Richard Bae (Samsung), Akira Tamura (FICT), Makoto Kouzuma (Toppan)
5) Advanced Materials for Enabling Co-Packaged Optics Integration
Chairs: Karan Bhangaonkar (Google), Vidya Jayaram (Chipletz)
Speakers: Christopher Striemer (AIM Photonics), Padraic Morrissey (Tyndall National Institute), Mark Gerber (Advanced Semiconductor Engineering, Inc. (US)), Kumar Abhishek Singh (Intel Corporation), Z. Rena Huang (Rensselaer Polytechnic Institute)
6) Advances in Chiplets: Tackling Fault Isolation and Failure Analysis in Heterogeneous Integration
Chairs: Tae-Kyu Lee (Cisco Systems, Inc.), Yan Li (Samsung Semiconductor, Inc.), Zhi Yang (Groq)
Speakers: Lihong Cao (Advanced Semiconductor Engineering, Inc. (US)), Wenbing Yun (Sigray), Bernice Zee (Advanced Micro Devices (Singapore) Pte Ltd), Navid Asadi (University of Florida), Martin M. Igarashi (TeraView), Thomas Rodgers (ZEISS Microscopy)
7) Advancements in mmWave and Sub-THz Packaging for Communication and Radar Applications
Chairs: Ivan Ndip (Brandenburg University of Technology/Fraunhofer IZM), Maciej Wojnowski (Infineon Technologies AG)
Speakers: Madhavan Swaminathan (Pennsylvania State University), Xiao Sun (imec), Atom Watanabe (IBM Research), Chih-Pin Hung (Advanced Semiconductor Engineering, Inc.)
8) Thermal Management Solutions for Next-Generation Backside Power Delivery
Chairs: Dwayne R. Shirley (Marvell Semiconductor, Inc.), Tiwei Wei (UCLA)
Speakers: Muhannad Bakir (Georgia Institute of Technology), Herman Oprins (imec), Dureseti Chidambarrao (IBM Research), Tiwei Wei (UCLA)
9) EEE EPS Seminar: User Perspective of Chiplet Technology
Chairs: Takashi Hisada (Rapidus Corporation), Yasumitsu Orii (Rapidus Corporation)
Speakers: Raja Swaminathan (AMD), Takao Iwaki (MIRISE Technologies Corporation), Takashi Saida (NTT Corporation), Omar Bchir (Qualcomm Technologies, Inc.), Carlos Macian (Marvell)
10) 2025 IEEE EPS President’s Panel: ECTC at 75: Celebrating the Past, Innovating for the Future
Chair: Patrick Thompson (Texas Instruments, Inc.)
Speakers: Rao R. Tummala (Georgia Tech), John H. Lau (Unimicron Technology Corp.), William Chen (ASE Group), Kitty Pearsall (Capstan Technologies, Inc.)
Special Sessions
2025 ECTC Keynote Talk: Achieving Efficient Zettascale Compute in the AI Era | Watch the keynote talk
Chair: Florian Herrault (PseudolithIC, Inc.)
Speaker: Samuel Naffziger (Advanced Micro Devices)
Plenary Session: Emerging Advanced Power Delivery for the AI Computing Era
Chairs: Eric O.L. Beyne (imec) and Dongming He (Qualcomm)
Speakers: Kaladhar Radhakrishnan (Intel Corp.), Harrison Chang (ASE Global), PR. Chidi Chidambaram (Qualcomm), Raja Swaminathan (AMD) Chuei-Tang Wang (TSMC)
HIR Presentations
2025 IEEE EPS Heterogeneous Integration Roadmap (HIR) Workshop
Chairs: William Chen (ASE Group) and Ravi V. Mahajan (Intel Corporation)
Event & Session Videos
Media Coverage
Boldfaced media sites are ECTC sponsors.
3D Incites: ECTC at 75: Pioneers Reflect on Packaging’s Past and Future
Podcast recorded on-site at ECTC 2025 with Florian, Przemek and Pat Thompson.
3D InCites: The AI Revolution: Energy, Ethics, and Advanced Packaging
Podcast recorded on-site at ECTC 2025 with keynote speaker Sam Naffziger from AMD
IEEE Spectrum: The Top 10 Semiconductor Stories of 2024
#8 in this Top Ten list is an article about the 20+ hybrid bonding papers at ECTC 2024
Chip Scale Review (May-June issue, pp. 50-52): 2025 IEEE ECTC: Record attendance shows growing importance of advanced packaging
Florian Harrault’s bylined article, giving a comprehensive summary of this year’s conference.
Chip Scale Review: ECTC 2025 – Leading-Edge Packaging and Component Breakthroughs Pushing the Scale of Connectivity (pp.59-60)
Comprehensive preview article bylined by Przemek Gromala; March-April issue, pp. 59-60
Semiconductor Engineering: On The Ground At ECTC 2025
A podcast giving an overview of the ECTC highlights by Laura Peters, who attended. She mentions that the hybrid bonding special session was standing-room only.
3D InCites: ECTC 2025 Celebrates Seventy-five Years of Pushing the Connectivity Scale
A comprehensive report on the highlights of this year’s ECTC – Francoise even mentions the drone show!
Printed Circuit Design & Fabrication: Storms Outside, Breakthroughs Inside: High-Performance Packaging Dominates ECTC (6/30)
This article by Jan Vardaman is a comprehensive overview of the conference.
Semiconductor Engineering: Novel Assembly Approaches For 3D Device Stacks (6/30)
Written by Laura Peters who attended ECTC, this lengthy article features an interview with keynote speaker Sam Naffziger, and gives detailed descriptions of several papers.
EEPW, or EE Products World (China): New assembly method for 3D device stacking (7/4)
Coverage of the keynote and various ECTC papers on enabling technologies including cooled chiplets, 1μm hybrid bonding, RDL build-up, and co-packaged optics.
The very same article appeared on Sina.com on 7/4 as well.
Nikkei XTech: Photonics-electronics convergence surges at ECTC, with TSMC playing a key role
OF Week (China): 3D AI chips for artificial intelligence: How to package and dissipate heat? (7/7)
A lengthy article discussing ECTC papers from ASE, Georgia Tech, Intel, ITRI/Brewer Science, Samsung and TSMC.
Laser Focus World: Can single-mode fiber arrays drive down cost and complexity of copackaged optics?
IEEE Spectrum: Intel Upgrades Chip Packaging for Bigger AI
SemiVision (Taiwan): The 2025 ECTC Semiconductor Summit is about to begin
Features the ECTC promotional video
3D InCites: 2025 IEEE Electronic Components and Technology Conference Announces Student Paper Competition
Article describes the competition, the submission deadlines, and other relevant information
Circuits Assembly: Student Engagement and Involvement is a Major Focus of the Upcoming 75th Annual IEEE Electronic Components and Technology Conference
Article describes the student engagement opportunities at ECTC 2025
Semiecosystem: AI Packaging, CPO, Hybrid Bonding Featured At ECTC
Article highlights numerous papers to be given at ECTC.
Elektroniknet (Germany): ECTC selects best papers 2024
News announcement of the best & outstanding papers from ECTC 2024
EMS Now: 2025 IEEE Electronic Components and Technology Conference May 27-30 Highlights Microelectronics Packaging and Component Breakthroughs
Article announces the program highlights of ECTC 2025
Electronics Weekly (U.K.): ECTC Announces Call for Papers
News announcement of the 2025 Call for Papers
Laser Focus World: 2024 in review: Laser Focus World’s top-10 most-read stories (12/24/24)
The interview with ECTC 2024 keynote speaker Keren Bergman on co-packaged optics/electronics was the second-most-read story in this magazine last year!
See full ECTC 2025 Media coverage here.
