Technical Program

This is the preliminary technical program of the 73rd ECTC.

Packaging Technologies
Session 1: Heterogeneous Chiplet Integration
Session 7: Large Formfactor Dense System Integration by FanOut
Session 13: Wafer/Panel-Level and Advanced Substrate Technologies
Session 19: Advances in 3D Integration and Hybrid Bonding
Session 25: Next Generation High-Performance Computing Architectures
Session 31: MEMS Sensor, Bio, and Advanced Interconnect Reliability

Applied Reliability
Session 8: Novel Reliability Test Methods
Session 17: Advanced Reliability Modelling and Characterization
Session 20: Automotive/Board-Level Reliability
Session 26: Materials Reliability
Session 31: MEMS Sensor, Bio, and Advanced Interconnect Reliability

Assembly and Manufacturing Technology
Session 4: Assembly and Manufacturing Process Enhancement
Session 16: Sintering and Soldering for High-Power, High-Reliability, and RF Devices
Session 22: Large Substrate Process Integration Challenges
Session 34: Bonding Assembly - Novel Packaging, Process, and Characterization

RF, High-Speed Components & Systems
Session 12: mm Wave Antenna-in-Package and Arrays
Session 24: High-Speed Signal and Power Integrity
Session 36: RF, Heterogeneous, and Chiplet Modules

Emerging Technologies
Session 11: Additive Manufacturing and Packaging for Flexible Electronics
Session 23: Next Generation Quantum, AI, and Secure System Design
Session 35: Packaging and Materials for Flexible Medical Technologies

Interconnections
Session 3: Advancements in Copper/Silicon-Oxide Hybrid Bonding
Session 9: Innovations in Copper Chip-to-Wafer Bonding
Session 15: Innovative Interposer and Through-Via Technologies
Session 21: Fine-Pitch and Intermetallic Considerations in Advanced Solder Interconnections
Session 27: Next Generation Wafer-to-Wafer Copper Bonding
Session 33: Advances in RDL, Via, and TSV Technologies for Chiplet Integration

Materials & Processing
Session 2: High-Performance Packaging Materials
Session 14: Advances in Heterogeneous Integration Bonding Technology
Session 16: Sintering and Soldering for High-Power, High-Reliability, and RF Devices
Session 28: Process Enhancements in 3D, FOWLP, and TSV Technologies
Session 30: Trends in Encapsulants and Low Dk/Df Dielectrics

Thermal/Mechanical Simulation & Characterization
Session 5: Flexible Packaging and Chip-Package-Interaction
Session 10: Packaging Interconnects
Session 17: Advanced Reliability Modelling and Characterization
Session 29: AI-based Prediction for Heterogeneous Integration and Advanced Packaging
Session 32: Thermo-Mechanical Modelling and Characterization

Photonics
Session 6: Co-packaged Optical Assembly
Session 18: Advanced Photonic Packaging and Interconnect

Interactive Presentations
Session 37: Interactive Presentations 1
Session 38: Interactive Presentations 2
Session 39: Interactive Presentations 3
Session 40: Interactive Presentations 4
Session 41: Student Interactive Presentations