The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Subscribe to our mailing list | Abstract Submission is now open! See Author info.

Upcoming Dates

Abstract Submission Opens | August 15, 2022
Abstract Submission Deadline | October 10, 2022
Abstract Acceptance Decision | December 16, 2022

Location

Orlando, Florida
May 30- June 2, 2023

 

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