61st ECTC Highlights


Event Presentations

1.) Keynote Speaker (Luncheon Presentation): Dr. Nasser Grayeli: Challenges and Opportunities Ahead… Are we ready for the future digital world?

2.) ECTC Panel Session: ECTC Spotlight on China, opening Speech, Prof. Keyun Bi:


   1. China’s Impact on the Semiconductor Industry - 2010 Update, C.E. (Ed) Pausa, PwC, USA
   2. Perspectives on Semiconductor Assembly Manufacturing in China, Bill Chen, ASE Group, USA
   3. An Overview of Electronic Packaging R&D in China, Ricky Lee, Hong Kong University of Science and Technology
   4. Innovation and Technology Development of the Chinese IC Packaging Industry, Bill Li, Jiangsu Changjiang Electronics Technology Co., Ltd., China
   5. Western China: Opportunities for Electronic Packaging Industry, Wenhui Zhu, TianShuiHuaTian Technology Co., Ltd, China

 

3.) ECTC Plenary Session: Power Efficiency Challenges and Solutions: From Outer Space to Inside the Human Body

  1. Space Exploration, Greg Cardell, Power Systems Engineering Group Supervisor, JPL
   2. Supercomputing, Hans Jacobson, Research Staff Member, IBM Corporation
   3. Datacenters; Randy Mooney, Intel Fellow & Director I/O Research, Intel Corporation
   4. Consumer Electronics, R aj Master, General Manager, IC Packaging, Quality and Reliability, Microsoft Corporation
   5. Medical Implants, Sayfe Kiaei, Associate Dean of Research, School of  ECEE, Arizona State University

 

4.) CPMT Seminar: Printed Devices and Large Area Interconnect Technologies for New Electronics

   1. Printed Electronics: Low Temperature and Stretchable Wiring with Ag Inks, Katsuaki Suganuma, Osaka University
   2. Active-Matrix Backplane on Flexible Substrates for Printed Electronics, Hiroki Maeda, Dai Nippon Printing Co., Ltd.
   3. Printed Organic Transistors for Ultraflexible and Stretchable  Electronics, T suyoshi Sekitani, The University of Tokyo
   4. Low Temperature Printing Techniques for High-performance Flexible Device Fabrication, Tatsuo Hasegawa, National Institute of Advanced Industrial Science and Technology
   5. Carbon Nanotube Thin Film Transistors on Plastic Films for Printed Electronics, Shinichi Yorozu, NEC Corporation

 

5.) Special Session


The Impact of Manufacturing Limitations on Electronic Packaging Performance and Reliability
   1. Manufacturing Limitations for 3D Electronic Die Stacking and Packaging using Through-Silicon-Vias (TSV), John Knickerbocker, IBM Corporation
   2. Organic Package Evolution for High Performance Substrate Application,  Koichi Nonomura, Kyocera Corporation
   3. PWB Technology/Materials Demands for Super Computing, Voya Markovich, Endicott Interconnect Technologies, Inc.
   4. Strategies for High Density Interconnect for Increasing Data Rates/Frequencies, T om McCarthy, Taconic Advanced Dielectric Division
   5. Managing Fields in Complex Transmissions Structures, Rich Benson, Molex Connector Corporation