The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
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Upcoming Dates
August 26, 2024 | Abstract submission opens
October 14, 2024 | Abstract submission closes
November 22, 2024 | PDC submissions deadline
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