Technical Program

Wednesday, May 29, 2019

Session 9: Wearables and Thin-Package Reliability and Chip Package Interaction
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Przemyslaw Gromala
Robert Bosch GmbH
T +49-162-8514983
Przemyslawjakub.gromala@de.bosch.com
Yong Liu
ON Semiconductor
T +1-207-761-3155
Yong.Liu@onsemi.com

Papers: