Technical Program

Wednesday, May 29, 2019

Session 9: Wearables and Thin-Package Reliability and Chip Package Interaction
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Przemyslaw Gromala
Robert Bosch GmbH
T +49-162-8514983
Przemyslawjakub.gromala@de.bosch.com
Yong Liu
ON Semiconductor
T +1-207-761-3155
Yong.Liu@onsemi.com

Papers:

1. 1:30 PM - Effect of Charging Cycle Elevated Temperature Storage and Thermal Cycling on Thin Flexible Batteries in Wearable Applications
Pradeep Lall - Auburn University
Amrit Abrol - Auburn University
Ben Leever - US AFRL
Scott Miller - NextFlex Manufacturing Institute

2. 1:55 PM - Bladder Inflation Stretch Test Method for Reliability Characterization of Wearable Electronics
Benjamin G. Stewart - Georgia Institute of Technology
Suresh K. Sitaraman - Georgia Institute of Technology

3. 2:20 PM - Study of BEOL Failure Mode in Flip-Chip Packages at High-Temperature Conditions
Wei Wang - Qualcomm Technologies, Inc.
Yangyang Sun - Qualcomm Technologies, Inc.
Xuefeng Zhang - Qualcomm Technologies, Inc.
Lejun Wang - Qualcomm Technologies, Inc.
Lily Zhao - Qualcomm Technologies, Inc.
Mark Schwarz - Qualcomm Technologies, Inc.
Bill Stone - Qualcomm Technologies, Inc.
Ahmer Syed - Qualcomm Technologies, Inc.

4. 3:30 PM - A Novel Metal Scheme and Bump Array Design Configuration to Enhance Advanced Si Packages CPI Reliability Performance by Using Finite Element Modeling Technique
Kuo-Chin Chang - Taiwan Semiconductor Manufacturing Company Ltd.
Mirng-Ji Lii - Taiwan Semiconductor Manufacturing Company Ltd.
Steven Hsu - Taiwan Semiconductor Manufacturing Company Ltd.
Hao-Chun Liu - Taiwan Semiconductor Manufacturing Company Ltd.
Yen-Kun Lai - Taiwan Semiconductor Manufacturing Company Ltd.
Sheng-Han Tsai - Taiwan Semiconductor Manufacturing Company Ltd.
Chieh-Hao Hsu - Taiwan Semiconductor Manufacturing Company Ltd.

5. 3:55 PM - Assessment of CMP Fill Pattern Effect on the Thermal Performance of Interconnects in Integrated Circuits BEOL
Assaad Helou - Southern Methodist University
Peter Raad - Southern Methodist University
Archana Venugopal - Texas Instruments, Inc.

6. 4:20 PM - Three-Dimensional Simulation of the Thermo-Mechanical Interaction Between the Micro-Bump Joints and Cu Protrusion in Cu-Filled TSVs of the High Bandwidth Memory (HBM) Structure
Jie-Ying Zhou - South China University of Technology
Shui-Bao Liang - South China University of Technology
Cheng Wei - South China University of Technology
Wen-Kai Le - South China University of Technology
Chang-Bo Ke - South China University of Technology
Min-Bo Zhou - South China University of Technology
Xiao Ma - South China University of Technology
Xin-Ping Zhang - South China University of Technology

7. 4:45 PM - Study of Design Optimization Method for Ultra-Low Power Micro Gas Sensor
Eiji Nakamura - IBM Research
Keiji Matsumoto - IBM Research
Andrea Fasoli - IBM Research
Luisa Bozano - IBM Research
Hiroyuki Mori - IBM Research