Technical Program

Wednesday, May 31, 2017

Session 9: Fine Pitch Flip Chip Process Technologies
1:30 PM - 5:10 PM
Committee: Interconnections
Room: Southern Hemisphere I

Session Co-Chairs:

David Danovitch
University of Sherbrooke
T 450-534-8000 X-1400
David.Danovitch@USherbrooke.ca
Li Li
Cisco Systems, Inc.
T +1-408-527-0801
LiLi2@cisco.com

Papers:

1. 1:30 PM - Cu-SnAg Interconnects Evaluation for the Assembly at 10µm and 5µm Pitch
Divya Taneja - CEA-LETI
Marion Volpert - CEA-LETI
Gilles Lasfargues - CEA-LETI
Boris Bouillard - CEA-LETI
Aurelie Vandeneynde - CEA-LETI
Tarik Chaira - CEA-LETI
Yannick Goiran - CEA-LETI
David Henry - CEA-LETI
Fiqiri Hodaj - University Grenople Alps, SIMAP
Bertrand Chambion - CEA-LETI
Sylvie Jarjayes - CEA-LETI

2. 1:55 PM - Scaling Cu Pillars to 20µm Pitch and Below: Strategic Role of Surface Finish and Barrier Layers
Ting-Chia Huang - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology
Pulugurtha Markondeya Raj - Georgia Institute of Technology
Robin Taylor - Atotech
Gustavo Ramos - Atotech
Rick Nichols - Atotech
Arnd Kilian - Atotech
Rao Tummala - Georgia Institute of Technology
Maja Tomic - Atotech

3. 2:20 PM - Thermal Compression Bonding: Understanding Heat Transfer by in situ Measurements and Modeling
Pieter Bex - IMEC
Teng Wang - IMEC
Vladimir Cherman - IMEC
Melina Lofrano - IMEC
Giovanni Capuz - IMEC
Erik Sleeckx - IMEC
Eric Beyne - IMEC

4. 3:30 PM - A Study on Nano-sized Silica Content and Size Effect in Non Conductive Films (NCFs) for Ultra Fine-pitch Cu-pillar/Sn-Ag Micro-Bump Interconnection
HanMin Lee - KAIST
SeYong Lee - KAIST
SeMin Cho - KAIST
YoungHyun Yu - KAIST
Jong-Ho Park - KAIST
Kyung-Wook Paik - KAIST

5. 3:55 PM - Accelerated SLID Bonding for Fine-Pitch Interconnects with Porous Microstructure
Jörg Meyer - Technical University Dresden
Iuliana Panchenko - Technical University Dresden
Wieland Wahrmund - Fraunhofer IZM, ASSID
Steffen Bickel - Technical University Dresden
M. Jürgen Wolf - Fraunhofer IZM, ASSID
Laura Wambera - Technical University Dresden

6. 4:20 PM - Low Temperature Ni/Sn/Ni Transient Liquid Phase Bonding for High Temperature Packaging Application by Imposing Temperature Gradient
Yi Zhong - Dalian University of Technology
Wei Dong - Dalian University of Technology
Mingliang Huang - Dalian University of Technology
Haitao Ma - Dalian University of Technology
C.P. Wong - Georgia Institute of Technology
Ning Zhao - Dalian University of Technology

7. 4:45 PM - Interfacial Reaction and Microstructural Evolution between Au-Ge Solder and Electroless Ni-W-P Metallisation in High Temperature Electronics Interconnects
Li Liu - Wuhan University of Technology, Wuhan, China
Jinzi Cui - Auburn University
Jing Wang - Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University
Zhaoxia Zhou - Loughborough University
R. Wayne Johnson - Tennessee Tech University
Changqing Liu - Loughborough University