Technical Program

Wednesday, May 30, 2018

Session 9: Wearables and Thin-Package Reliability and Chip Package Interaction
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization

Session Co-Chairs:

Przemyslaw Gromala
Robert Bosch GmbH
T +49-162-8514983
Przemyslawjakub.gromala@de.bosch.com
Karsten Meier
Technische Universit├Ąt Dresden
T +49 351 463 - 36 594
karsten.meier@tu-dresden.de

Papers:

1. 1:30 PM - Effect of Charging Cycle Elevated Temperature Storage and Thermal Cycling on Thin Flexible Batteries in Wearable Applications
Pradeep Lall - Auburn University
Amrit Abrol - Auburn University
Jason Marsh - NextFlex Manufacturing Institute
Ben Leever - US AFRL

2. 1:55 PM - Bladder Inflation Stretch Test Method for Reliability Characterization of Wearable Electronics
Benjamin Stewart - Georgia Institute of Technology
Suresh Sitaraman - Georgia Institute of Technology

3. 2:20 PM - Study of BEOL Failure Mode in Flip Chip Packages at High Temperature Conditions
Wei Wang - Qualcomm Technologies, Inc.
Yangyang Sun - Qualcomm Technologies, Inc.
Xuefeng Zhang - Qualcomm Technologies, Inc.
Lejun Wang - Qualcomm Technologies, Inc.
Lily Zhao - Qualcomm Technologies, Inc.
Mark Schwarz - Qualcomm Technologies, Inc.
Bill Stone - Qualcomm Technologies, Inc.
Ahmer Syed - Qualcomm Technologies, Inc.

4. 3:30 PM - A Novel Metal Scheme and Bump Array Design Configuration to Enhance Advanced Si Packages CPI Reliability Performance by Using Finite Element Modeling Technique
Kuo-Chin Chang - Taiwan Semiconductor Manufacturing Company, Ltd.
Mirng-Ji Lii - Taiwan Semiconductor Manufacturing Company, Ltd.
Steven Hsu - Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Chun Liu - Taiwan Semiconductor Manufacturing Company, Ltd.
Yen-Kun Lai - Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-Han Tsai - Taiwan Semiconductor Manufacturing Company, Ltd.
Chieh-Hao Hsu - Taiwan Semiconductor Manufacturing Company, Ltd.

5. 3:55 PM - Stress Analysis of Low-k Reliability for Fine Pitch Flip Chip Packages
Chih-Yen Su - Powertech Technology Inc. (PTI)
Chun-Te Lin - Powertech Technology Inc. (PTI)
Ji-Cheng Lin - Powertech Technology Inc. (PTI)
Li-Chih Fang - Powertech Technology Inc. (PTI)

6. 4:20 PM - Three-dimensional Simulation of the Thermo-Mechanical Interaction between the Micro-bump Joints and Cu Protrusion in Cu-filled TSVs of the High Bandwidth Memory (HBM) Structure
Jie-Ying Zhou - South China University of Technology
Shui-Bao Liang - South China University of Technology
Cheng Wei - South China University of Technology
Min-Bo Zhou - South China University of Technology
Xiao Ma - South China University of Technology
Xin-Ping Zhang - South China University of Technology

7. 4:45 PM - Study of Board Level Reliability of eWLB (embedded wafer level BGA) for 0.35mm Ball Pitch
Kang Hai Lee - Statschippac LTD
Yeow Kheng Lim - Statschippac LTD
Seng Guang Chow - Statschippac LTD
NW Liu - Mediatek Inc
Yenyao Chi - Mediatek Inc
Benson Lin - Mediatek Inc