Technical Program

Wednesday, May 31, 2017

Session 9: Fine Pitch Flip Chip Process Technologies
1:30 PM - 5:10 PM
Committee: Interconnections
Room: Southern Hemisphere I

Session Co-Chairs:

David Danovitch
University of Sherbrooke
T 450-534-8000 X-1400
David.Danovitch@USherbrooke.ca
Li Li
Cisco Systems, Inc.
T +1-408-527-0801
LiLi2@cisco.com

Papers: