Technical Program

The Technical Program for the 67th ECTC features over 300 technical papers covering all aspects of electronic packaging and interconnect technology.

Advanced Packaging
Session 2: Advances in Wafer and Panel Level Fan-Out Packaging
Session 3: 3D Design, Assembly and Additive Manufacturing
Session 8: Fan-Out packaging-Applications and Architectures
Session 14: Advanced Substrates and Flip Chip Applications
Session 20: MEMS, Sensor, IoT and Flex
Session 26: Wafer Level Packaging Fan-In and Fan-Out Key Developments
Session 27: Automotive and Power Electronics
Session 32: Heterogeneous Integration
High-Speed, Wireless & Components
Session 5: Antenna-in-Package for RF and mm-Wave Systems
Session 23: RF and THz Module Components
Session 28: High Speed and High Bandwidth Packaging
Session 36: Power Delivery Solutions for Components and Systems
Emerging Technologies
Session 3: 3D Design, Assembly and Additive Manufacturing
Session 11: Emerging Packaging Technologies for 5G and Advanced Computing
Session 17: Technology Advanes in Nano, Biochemical, Thermal and Flexible Applications
Session 7: Low Temperature Metallic Interconnection Technologies
Session 13: Fan-Out and Interposer Interconnections
Session 19: Interconnect Reliability
Session 25: Fabrication and Characterizarion of TSV
Session 31: Advanced Wirebond and Interconnect Technologies
Assembly & Manufacturing Technology
Session 9: Flip Chip Manufacturing Challenges
Session 15: Warpage Control in Assembly Processes
Session 26: Wafer Level Packaging Fan-In and Fan-Out Key Developments
Materials & Processing
Session 1: Flexible Electronics, Substrate for High Frequency Applications
Session 12: Sintering Pastes, Transient Liquid Phase and Direct Bonding
Session 21: Materials and Process trends for Fan-Out Wafer Level Packaging
Session 30: Emerging Materials and Technologies
Session 33: Next Generation Materials and Processes for Through Vias and 3D Interconnects
Thermal/Mechanical Simulation & Characterization
Session 6: Warpage and Moisture Characterization
Session 22: Thermal Mechanical Modeling and Characterization
Session 29: Thermal/Mechanical Simulation and Characterization
Session 35: Multiphysics and Solder Joint Reliability
Session 18: Silicon Photonics
Session 24: Optical Module Integration
Applied Reliability
Session 4: Automotive and Harsh Environment Reliability
Session 10: Innovative Design, Modeling and Predictions for Reliability
Session 16: Advances in Interconnect Reliability and Techniques
Session 19: Interconnect Reliability
Session 34: Fan-Out Wafer Level Package Reliability
Interactive Presentations
Session 37: Interactive Presentations 1
Session 38: Interactive Presentations 2
Session 39: Interactive Presentations 3
Session 40: Interactive Presentations 4
Session 41: Student Interactive Presentations