About ECTC

A Premier Event....

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The 2020 ECTC will be held at the Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA, during May 26 – 29, 2020,  featuring about 40 technical sessions (oral presentations, interactive presentations, and student posters), 16 professional development courses, a panel discussion, a plenary session, an EPS Seminar, and a technology corner for exhibitors. ECTC 2020 is co-located with ITherm 2020, an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards.

The Professional Development Courses offer state-of-the-art technology reviews and updates in a condensed half-day format. Topics cover a wide range of technologies.

The Panel Discussion, Plenary Session, and CPMT Seminar in the evenings offer a format that allows for ample exchange and dialogue between the presenters and audience. They provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.

The Technology Corner complements the Technical Program by providing companies the opportunity to exhibit their products and services in an environment that enables discussion and interaction with the managers and engineers attending ECTC.

The ECTC would not be possible without the sponsorship of the IEEE Electronics Packaging Society (formerly CPMT), numerous corporate participants and sponsors, and the time and energy of the more than 200 engineers and scientists on the ECTC Executive and Program Committees.