Technical Program

Wednesday, May 30, 2018

Session 7: Advances in Flip Chip Packaging
1:30 PM - 5:10 PM
Committee: Packaging Technologies

Session Co-Chairs:

Mike Gallagher
Dow Electronic Materials
T +1-508229-7681
Daniel Baldwin
H.B. Fuller Company
T +1-678-990-3320


1. 1:30 PM - 7nm Chip-Package Interaction Study on a Fine Pitch Flip Chip Package With Laser Assist Bonding and Mass Reflow Technology
Ming-Che Hsieh - STATS ChipPAC, Inc.
Ian Hsu - MediaTek, Inc.
Chi-Yuan Chen - MediaTek, Inc.
Stanley Lin - MediaTek, Inc.
Ta-Jen Yu - MediaTek, Inc.
NamJu Cho - STATS ChipPAC, Inc.

2. 1:55 PM - Ultra Large Area SIPs and Integrated mmW Antenna Array Module for 5G mmW outdoor applications
Pouya Talebbeydokhti - Intel Corporation
Sidharth Dalmia - Intel Corporation
Trang Thai - Intel Corporation
Sharon Tal - Intel Corporation
Raanan Sover - Intel Corporation

3. 2:20 PM - Hybrid approach for large size FC-BGA to enhance thermal and electrical performance including power delivery
Heeseok Lee - Samsung Electronics Company, Ltd.
Younheok Im - Samsung Electronics Company, Ltd.
Jisoo Hwang - Samsung Electronics Company, Ltd.
Junghwa Kim - Samsung Electronics Company, Ltd.
James Jeong - Samsung Electronics Company, Ltd.
Youngsang Cho - Samsung Electronics Company, Ltd.
Heejung Choi - Samsung Electronics Company, Ltd.
Youngmin Shin - Samsung Electronics Company, Ltd.

4. 3:30 PM - Package-on-Package micro-BGA microstructure interaction with bond and assembly parameters
Pascale Gagnon - IBM Corporation
Clément Fortin - IBM Corporation
Tom Weiss - IBM Corporation

5. 3:55 PM - Low Cost Flip-chip Stack for Partitioning Processing and Memory
Fabian Hopsch - Fraunhofer IIS/EAS
Andy Heinig - Fraunhofer IIS/EAS

6. 4:20 PM - High Density, Large Area Indium Bump Bonding Process Development for CMOS Camera Integration
Matthew B. Jordan - Sandia National Laboratories
John Mudrick - Sandia National Laboratories
Lauren Rohwer - Sandia National Laboratories
T. A. Friedmann - Sandia National Laboratories
M. David Henry - Sandia National Laboratories

7. 4:45 PM - Understanding Mold Compound Behavior on Flip Chip QFN Packages
Richard Sumalinog - Texas Instruments, Inc.