Technical Program

Wednesday, May 29, 2019

Session 7: Advances in Flip Chip Packaging
1:30 PM - 5:10 PM
Committee: Packaging Technologies

Session Co-Chairs:

Mike Gallagher
DuPont Electronic and Imaging
T +1-508229-7681
michael.gallagher@dupont.com
Daniel Baldwin
H.B. Fuller Company
T +1-678-990-3320
dan.baldwin@hbfuller.com

Papers: