Technical Program

Wednesday, May 29, 2019

Session 7: Advances in Flip Chip Packaging
1:30 PM - 5:10 PM
Committee: Packaging Technologies

Session Co-Chairs:

Mike Gallagher
Dow Electronic Materials
T +1-508229-7681
MikeGallagher@dow.com
Daniel Baldwin
H.B. Fuller Company
T +1-678-990-3320
dan.baldwin@hbfuller.com

Papers:

1. 1:30 PM - 7nm Chip-Package Interaction Study on a Fine-Pitch Flip Chip Package With Laser Assisted Bonding and Mass Reflow Technology
Ming-Che Hsieh - STATS ChipPAC Pte. Ltd.
Ian Hsu - MediaTek, Inc.
Chi-Yuan Chen - MediaTek, Inc.
Stanley Lin - MediaTek, Inc.
Ta-Jen Yu - MediaTek, Inc.
NamJu Cho - STATS ChipPAC Ptd. Ltd.

2. 1:55 PM - Ultra Large Area SIPs and Integrated mmW Antenna Array Module for 5G mmWave Outdoor Applications
Pouya Talebbeydokhti - Intel Corporation
Sidharth Dalmia - Intel Corporation
Trang Thai - Intel Corporation
Sharon Tal - Intel Corporation
Raanan Sover - Intel Corporation

3. 2:20 PM - Hybrid Approach for Large Size FC-BGA to Enhance Thermal and Electrical Performance Including Power Delivery
Heeseok Lee - Samsung Electronics Company, Ltd.
Yunheok Im - Samsung Electronics Company, Ltd.
Jisoo Hwang - Samsung Electronics Company, Ltd.
Junghwa Kim - Samsung Electronics Company, Ltd.
James Jeong - Samsung Electronics Company, Ltd.
Youngsang Cho - Samsung Electronics Company, Ltd.
Heejung Choi - Samsung Electronics Company, Ltd.
Youngmin Shin - Samsung Electronics Company, Ltd.

4. 3:30 PM - Package-on-Package Micro-BGA Microstructure Interaction With Bond and Assembly Parameters
Pascale Gagnon - IBM Corporation
Clément Fortin - IBM Corporation
Tom Weiss - IBM Corporation

5. 3:55 PM - Low-Cost Flip-Chip Stack for Partitioning Processing and Memory
Andy Heinig - Fraunhofer IIS/EAS
Fabian Hopsch - Fraunhofer IIS/EAS

6. 4:20 PM - High-Density Ultra-Thin Organic Substrate for Advanced Flip-Chip Package
Nokibul Islam - STATS ChipPAC Pte. Ltd.
Seung Wook Yoon - STATS ChipPAC Pte. Ltd.
KH Tan - STATS ChipPAC Pte. Ltd.
Tony Chen - STATS ChipPAC Pte. Ltd.

7. 4:45 PM - Impact of Low Temperature Solder on Electronic Package Dynamic Warpage Behavior and Requirement
Wei Keat Loh - Intel Corporation
Chih Chung Hsu - CoreTech System (Moldex3D)
Ron Kulterman - Flex, Ltd.
Haley Fu - iNEMI