Technical Program

Thursday, May 30, 2019

Session 40: Interactive Presentations 4
2:00 PM - 4:00 PM
Committee: Interactive Presentations

Session Co-Chairs:

Mark Eblen
Kyocera International SC
T +1-858-614-2537
Jeffrey Lee
iST-Integrated Service Technology Inc.
T +886-3-5799909 ext 3000


Die Thickness Optimization for Preventing Electro-Thermal Fails Induced by Solder Voids in Power Devices
Dario Vitello - STMicroelectronics
Andrea Albertinetti - STMicroelectronics
Marco Rovitto - STMicroelectronics

3-T (8-T) Decoupling Capacitors for Improved PDN in LPDDR4/4X/5 System
Sunil Gupta - Qualcomm Technologies, Inc.

Improved Correlation Between Accelerated Board Level Reliability (BLR) Testing and Customer BLR Results Using a Hybrid Closed-Form/Finite Element Methodology
Maxim Serebreni - DfR Solutions
Natalie Hernandez - DfR Solutions
Gil Sharon - DfR Solutions
Nathan Blattau - DfR Solutions
Craig Hillman - DfR Solutions
Ken Symonds - Western Digital Corporation

Fabrication and Reliability Demonstration of 3 µm Diameter Photo Vias at 15 µm Pitch in Thin Photosensitive Dielectric Dry Film for 2.5 D Glass Interposer Applications
Daichi Okamoto - Taiyo Ink Mfg. Co., Ltd.
Yoko Shibasaki - Taiyo Ink Mfg. Co., Ltd.
Daisuke Shibata - Taiyo Ink Mfg. Co., Ltd.
Tadahiko Hanada - Taiyo Ink Mfg. Co., Ltd.
Fuhan Liu - Georgia Institute of Technology
Mohanalingam Kathaperumal - Georgia Institute of Technology
Rao R Tummala - Georgia Institute of Technology

Pre-Cure Modification of Electrically Conductive Adhesive for Low Temperature Interconnection
Jinto George - University de Sherbrooke
David Danovitch - University de Sherbrooke
Alexandre Leblanc - IBM Corporation
Eric Savage - IBM Corporation
Michael Ayukawa - Redlen Technologies
Dexter Macaisa - Redlen Technologies

RDL-1st Fan-Out Panel Level Packaging (FOPLP) for Heterogeneous and Economical Packaging
Nagendra Sekhar Varsala - Institute of Microelectronics A*STAR
Vempati Srinivasa Rao - Institute of Microelectronics A*STAR
F. X Che - Institute of Microelectronics A*STAR
Chong Ser Choong - Institute of Microelectronics A*STAR
Kazunori Yamamoto - Institute of Microelectronics A*STAR

Epoxy Composites with Surface Modified Silicon Carbide Filler for High-Temperature Molding Compounds
Fan Wu - Georgia Institute of Technology
Nicholas C Mitchell - Georgia Institute of Technology
Bo Song - Georgia Institute of Technology
Kyoung-Sik Moon - Georgia Institute of Technology
CP Wong - Georgia Institute of Technology

Ultra Low Resistivity and High Electrical Stability Silo-Ag ECAs Produced from Curing Chemistry Optimization for Flexible Electronics
Xueqiao Wang - Georgia Institute of Technology
Kyoung-Sik Moon - Georgia Institute of Technology
Bo Song - Georgia Institute of Technology
C.P. Wong - Georgia Institute of Technology

Physics of Failure Based Simulation and Experimental Testing of Quad Flat No-Lead Package
Jia-Shen Lan - National Sun Yat-Sen University
Mei-Ling Wu - National Sun Yat-Sen University

An Assessment of Electromigration in 2.5D Packaging
Jiefeng Xu - Binghamton University
Scott McCann - Xilinx, Inc.
Huayan Wang - Binghamton University
Jing Wang - Binghamton University
VanLai Pham - Binghamton University
Stephen R. Cain - Binghamton University
Gamal Refai-Ahmed - Xilinx, Inc.
S.B. Park - Binghamton University

Diffusion Enhanced Drive Sub 100 ˚C Wafer Level Fine-Pitch Cu-Cu Thermocompression Bonding for 3D IC Integration
Asisa Kumar Panigrahy - Indian Institute of Technology, Hyderabad
Satish Bonam - Indian Institute of Technology, Hyderabad
Tamal Ghosh - Indian Institute of Technology, Hyderabad
Siva Rama Krishna Vanjari - Indian Institute of Technology, Hyderabad
Shiv Govind Singh - Indian Institute of Technology, Hyderabad

Development of Sheet Type Molding Compounds for Panel-Level Package
Kenichi Ueno - Sanyu Rec Co., Ltd.
Kazuhiro Dohi - Sanyu Rec Co., Ltd.
Yui Suzuki - Sanyu Rec Co., Ltd.
Masakazu Hirose - Sanyu Rec Co., Ltd.
Akira Nakao - Sanyu Rec Co., Ltd.

Defect Detection for the TSV Transmission Channel Using Machine Learning Approach
Huan Liu - Peking University
Runiu Fang - Peking University
Min Miao - Beijing Information Science & Technology University
Yufeng Jin - Peking University
Yang Yang - Peking University

Direct Printing of Heat Sinks, Cases and Power Connectors on Insulated Substrate Using Selective Laser Melting Techniques
Rabih Khazaka - Safran
Donatien Martineau - Safran
Toni Youssef - Safran
Thanh Long Le - Safran
Stephane Azzopardi - Safran

Server CPU Package Design Using PoINT Architecture
Arun Chandrasekhar - Intel Corporation
Vijaya Boddu - Intel Corporation
Erich Chuh - Intel Corporation
Krishna Bharath - Intel Corporation
Farzaneh Yahyaei-Moayyed - Intel Corporation
Srikrishnan Venkataraman - Intel Corporation
Sriram Srinivasan - Intel Corporation
Ram Viswanath - Intel Corporation
Ritesh Jain - Intel Corporation
Huthasana Kalyanam - Intel Corporation

Highly Reliable Die Attach Silver Joint with Pressure-Less Sintering Process
Sihai Chen - Indium Corporation
William Shambach - Rochester Institute of Technology
Jordan Palmer - Rochester Institute of Technology
Christine LaBarbera - Indium Corporation
Xuanyi Ding - Cornell University
Ning-Cheng Lee - Indium Corporation

3D Power Packaged Device Thermo-Mechanical Modeling and Stress Analysis after Reliability Trials
Lucrezia Guarino - STMicroelectronics
Lucia Zullino Luca Cecchetto Fiorella Pozzobon Antonio Andreini

Direct Bonding of Low-Temperature Heterogeneous Dielectrics
Serena Iacovo - IMEC
Ian Peng - IMEC
Alain Phommahaxay - IMEC
Fumihiro Inoue - IMEC
Patrick Verdonck - IMEC
Soon-Wook Kim - IMEC
Erik Sleeckx - IMEC
Andy Miller - IMEC
Gerald Beyer - IMEC
Eric Beyne - IMEC

Millimeter Wave Dual Polarization Design Using Frequency Selective Surface (FSS) for 5G Base-Station Applications
Lih-Tyng Hwang - National Sun Yat-Sen University
Chung-Yi Hsu - National Sun Yat-Sen University
Chi-Hau Yang - National Sun Yat-Sen University