Technical Program

Thursday, June 01, 2017

Session 40: Interactive Presentations 4
2:00 PM - 4:00 PM
Committee: Interactive Presentations
Room: Northern Hemisphere Foyer

Session Co-Chairs:

Ibrahim Guven
Virginia Commonwealth University
T +1-804-827-3652
iguven@vcu.edu
Mark Poliks
Binghamton University
T +1-607-727-7104
mpoliks@binghamton.edu

Nancy Iwamoto
Honeywell
T +1-760-788-7109
nancy.iwamoto@honeywell.com

Jai Agrawal
Purdue University
T +1-408-772-6727
jaipagrawal@gmail.com

Papers:

Equivalent Thermal Conductivity Model Based Full Scale Numerical Simulation for Thermal Management in Fan-Out Packages
Ningyu Wang - Institute of Microelectronics, Peking University
Yudan Pi - Institute of Microelectronics, Peking University
Wei Wang - Institute of Microelectronics, Peking University
Yufeng Jin - Institute of Microelectronics, Peking University

Local Stress Analysis by XRD Single Crystal Method and Kossel Diffraction Applied to a Flip Chip Structure
Anne-Laure Lebaudy - CEA-Leti
Raphaël Pesci - Ecole Nationale Supérieure des Arts et Métiers
Manuel Fendler - CEA-Leti
Wiyao Kpobie - CEA-Leti

Study of Annular Copper Filled TSVs of Sensor and Interposer Chips for 3D Integration
Cao Li - Huazhong University of Science & Technology
Peng Fei - Huazhong University of Science & Technology
Sheng Liu - Wuhan University
Huai Zheng - Wuhan University

Investigations on the Pumping Behaviors of Copper Filler in Through-Silicon-vias (TSV)
Fei Su - Beijing University of Aeronautics and Astronautics
Ruixia Yao - Beijing University of Aeronautics and Astronautics
Tenghui Li - Beijing University of Aeronautics and Astronautics
Xiaoxu Pan - Beijing University of Aeronautics and Astronautics

Warpage Prediction Methodology of Extremely Thin Packages
Zhongli Ji - SanDisk
Yangming Liu - SanDisk
Anna Wu - SanDisk
Ning Ye - SanDisk
Hem Takiar - SanDisk
Peng Chen - SanDisk

A Design Study of 5G Antennas Optimized Using Genetic Algorithms
VIncens Gjokaj - Michigan State University
John Doroshewitz - Michigan State University
Jeffrey Nanzer - Michigan State University
Premjeet Chahal - Michigan State University

Cu-In-Microbumps for Low-Temperature Bonding of Fine-Pitch-Interconnects
Steffen Bickel - Technical University Dresden
Iuliana Panchenko - Technical University Dresden
Wieland Wahrmund - Fraunhofer IZM
Joerg Meyer - Technical University Dresden
Volker Neumann - Technical University Dresden
M. Juergen Wolf - Fraunhofer IZM

Via-in-Trench: A Revolutionary Panel-Based Package RDL Configuration Capable of 200-450 IO/mm/layer, an Innovation for More-than-Moore System Integration
Fuhan Liu - Georgia Institute of Technology
Chandrasekharan Nair - Georgia Institute of Technology
Atsushi Kubo - Tokyo Ohka Kogyo
Tomoyuki Ando - Tokyo Ohka Kogyo
Hao Lu - Georgia Institute of Technology
Rui Zhang - Georgia Institute of Technology
Hang Chen - Georgia Institute of Technology
Kwon Sang Lee - DISCO Corporation
Venky Sundaram - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

Simulation Analysis of a Conformal Patch Sensor for Skin Tension and Swelling Detection
Ruiqi Lim - Institute of Microelectronics, A*STAR
Ming-Yuan Cheng - Institute of Microelectronics, A*STAR
Ramona Damalerio - Institute of Microelectronics, A*STAR
Weiguo Chen - Institute of Microelectronics, A*STAR

Effect of Material Properties of Double Layer Non Conductive Films (D-NCFs) on the Reflow Reliability of Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro Bump Interconnection
SeYong Lee - Korea Advanced Institute of Science & Technology
Woojeong Kim - Doosan
Taejin Choi - Doosan
JiWon Shin - Korea Advanced Institute of Science & Technology
Kyung-Wook Paik - Korea Advanced Institute of Science & Technology

Wafer-Level Micro Alkali Vapor Cells with Anti-Relaxation Coating Compatible with MEMS Packaging for Chip-Scale Atomic Magnetometers
Yu Ji - Southeast University
Jintang Shang - Southeast University
Qi Gan - Southeast University
Lei Wu - Southeast University

Low-Temperature High-Throughput Assembly Technology for Transducer Array in Medical Imaging Applications
Hoang-Vu Nguyen - University College of Southeast Norway
Nu Bich Duyen Do - University College of Southeast Norway
Knut Aasmundtveit - University College of Southeast Norway

Highly Efficient and Stable Quantum Dot Light Emitting Diodes Optimized by Micro-Packaged Luminescent Microspheres
Kai Wang - Southern University of Science and Technology
Xiaobing Luo - Huazhong University of Science and Technology
Sheng Liu - Wuhan University
Xiaowei Sun - Southern University of Science and Technology