Technical Program

Friday, June 02, 2017

Session 35: Thermomechanical and Thermal Characterization
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Southern Hemisphere IV

Session Co-Chairs:

Pradeep Lall
Auburn University
T +1-334-844-3424
Przemyslaw Gromala
Robert Bosch GmbH
T +4971213539126


1. 1:30 PM - The Combined Effect of Mechanical Package Stress and Humidity on Chip Corrosion Probability
Georg Lorenz - Fraunhofer IMWS
Michél Simon-Najasek - Fraunhofer IMWS
Achim Lindner - TDK-Micronas GmbH

2. 1:55 PM - Mechanical Characterization of Anodic Bonding Using Chevron Microchannel
David C. Woodrum - Georgia Institute of Technology
Mohammed Nasr - Georgia Institute of Technology
Xuchen Zhang - Georgia Institute of Technology
Muhannad S. Bakir - Georgia Institute of Technology
Suresh K. Sitaraman - Georgia Institute of Technology

3. 2:20 PM - Package-Level Si Micro-Fluid Cooler with Enhanced Jet Array for High Performance 3D Systems
Yong Han - Institute of Microelectronics, A*STAR
Boon Long Lau - Institute of Microelectronics, A*STAR
Gongyue Tang - Institute of Microelectronics, A*STAR
Seow Meng Low - BeCe Pte. Ltd.
Jason Goh - BeCe Pte. Ltd.

4. 3:30 PM - A Unified and Versatile Model Study for Moisture Diffusion
Liangbiao Chen - Lamar University
Jenny Zhou - Lamar University
Hsing-wei Chu - Lamar University
Xuejun Fan - Lamar University

5. 3:55 PM - Microstructure Simulation and Thermo-Mechanical Behavior Analysis of Copper Filled through Silicon Vias Using Coupled Phase Field and Finite Element Methods
Shui-Bao Liang - South China University of Technology
Chang-Bo Ke - South China University of Technology
Han Jiang - South China University of Technology
Min-Bo Zhou - South China University of Technology
Xin-Ping Zhang - South China University of Technology

6. 4:20 PM - On the Process/History Dependence of Package Mechanical Performance
Mingji Wang - Amkor Technology, Inc.
Lou Nicholls - Amkor Technology, Inc.
MiNa Mo - Amkor Technology, Inc.
MinJae Lee - Amkor Technology, Inc.
Quan Pham - Amkor Technology, Inc.
Yong Song - Amkor Technology, Inc.

7. 4:45 PM - Systematic Approach to Design High Power FPGA Package for Current-Carrying Capability
Hong Shi - Xilinx, Inc.
Siow Chek Tan - Xilinx, Inc.
Jae-Gyung Ahn - Xilinx, Inc.
Gamal Refai-Ahmed - Xilinx, Inc.
Suresh Ramalingam - Xilinx, Inc.