Technical Program

Friday, May 31, 2019

Session 35: New Interconnects for Package Scaling
1:30 PM - 5:10 PM
Committee: Interconnections

Session Co-Chairs:

David Danovitch
University of Sherbrooke
T +1-450-534-8000 X-1400
David.Danovitch@USherbrooke.ca
Katsuyuki Sakuma
IBM Corporation
T +1-914-945-2080
ksakuma@us.ibm.com

Papers:

1. 1:30 PM - Development of 2.3D High Density Organic Package Using Low Temperature Bonding Process With Sn-Bi Solder
Shota Miki - Shinko Electric Industries Co. Ltd.
Hiroshi Taneda - Shinko Electric Industries Co. Ltd.
Naoki Kobayashi - Shinko Electric Industries Co. Ltd.
Kiyoshi Oi - Shinko Electric Industries Co. Ltd.
Koji Nagai - Shinko Electric Industries Co. Ltd.
Toshinori Koyama - Shinko Electric Industries Co. Ltd.

2. 1:55 PM - PowerTherm Attach Process for Power Delivery and Heat Extraction in the Silicon-Interconnect Fabric Using Thermocompression Bonding
Pranav Ambhore - University of California, Los Angeles
Boris Vaisband - University of California, Los Angeles
Umesha Mogera - University of California, Los Angeles
Ujash Shah - University of California, Los Angeles
Timothy Fisher - University of California, Los Angeles
Mark Goorsky - University of California, Los Angeles
Subramaniam S. Iyer - University of California, Los Angeles

3. 2:20 PM - Interconnect Scheme for Die-to-Die and Die-to-Wafer Level Heterogeneous Integration for High-Performance Computing
Rabindra N. Das - MIT Lincoln Laboratory
Vladimir Bolkhovsky - MIT Lincoln Laboratory
Christopher Galbraith - MIT Lincoln Laboratory
Daniel Oates - MIT Lincoln Laboratory
Jason J. Plant - MIT Lincoln Laboratory
Renée Lambert - MIT Lincoln Laboratory
Scott Zarr - MIT Lincoln Laboratory
Ravi Rastogi - MIT Lincoln Laboratory
Dmitri Shapiro - MIT Lincoln Laboratory
Manuel Docanto - MIT Lincoln Laboratory
Terence Weir - MIT Lincoln Laboratory

4. 3:30 PM - Ultra-Wide Micro Bumps Interconnection Matrix for Particle Detection: Process and Assembly
Jean Charbonnier - CEA-LETI
Myriam Assous - CEA-LETI
Thierry Mourier - CEA-LETI
Celine Ribière - CEA-LETI
Stéphane Minoret - CEA-LETI
Sophie Verrun - CEA-LETI
Pierre Tissier - CEA-LETI
Remi Coquand - CEA-LETI
Mehmet Bicer - CEA-LETI
Fabienne Allain - CEA-LETI
Rémi Franiatte - CEA-LETI

5. 3:55 PM - Growth Behavior and Orientation Evolution of Cu6Sn5 Grains in Micro Interconnect During Isothermal Reflow
Shi Chen - Dalian University of Technology
Ning Zhao - Dalian University of Technology
Yuanyuan Qiao - Dalian University of Technology
Yunpeng Wang - Dalian University of Technology
Haitao Ma - Dalian University of Technology
C.M.L. Wu - City University of Hong Kong

6. 4:20 PM - Development of a No Reflow Cu Pillar Bump to Improve Chip/Package Interactions (CPI) Process and Reliability Performance
Kuei Hsiao (Frank) Kuo - Siliconware Precision Industries Co., Ltd.
Yen Neng Wang - Siliconware Precision Industries Co., Ltd.
Feng Lung Chien - Siliconware Precision Industries Co., Ltd.
Rick Lee - Siliconware Precision Industries Co., Ltd.
Jiunn Jie Wang - Siliconware Precision Industries Co., Ltd.

7. 4:45 PM - A Novel Interconnection Technology Using Ultra-Thin Under Barrier Metal for Multiple Chip-on-Chip Stacking Structure
Takuya Nakamura - Sony Semiconductor Solutions Corporation
Kan Shimizu - Sony Semiconductor Solutions Corporation
Masataka Maehara - Sony Semiconductor Solutions Corporation
Toshihiko Hayashi - Sony Semiconductor Solutions Corporation
Kentaro Akiyama - Sony Semiconductor Solutions Corporation
Junichiro Fujimagari - Sony Semiconductor Solutions Corporation
Tomohiro Ohkubo - Sony Semiconductor Manufacturing
Atsushi Fujiwara - Sony Semiconductor Manufacturing
Hayato Iwamoto - Sony Semiconductor Manufacturing