Technical Program

Thursday, May 31, 2018

Session 22: Advanced Substrates and Interconnect Technology
1:30 PM - 5:10 PM
Committee: Materials & Processing

Session Co-Chairs:

Kimberly Yess
Brewer Science
T +1-573-201-8669
kyess@brewerscience.com
Mikel Miller
EMD Performance Materials
T +1-951-514-4574
mikel.miller@emdgroup.com

Papers:

1. 1:30 PM - Temporary SiC-SiC wafer bonding compatible with high temperature annealing
Fengwen Mu - The University of Tokyo
Tadatomo Suga - The University of Tokyo
Miyuki Uomoto - Tohoku University
Takehito Shimatsu - Tohoku University

2. 1:55 PM - Ultrathin glass to ultrathin glass bonding using Laser sealing approach
messaoud bedjaoui - CEA-LETI
jean Brun - CEA-LETI
johnny amiran - CEA-LETI

3. 2:20 PM - Development of Resins for Bumpless Interconnects and Wafer-On-Wafer (WOW) Integration
Naoko Araki - Daicel Corporation
Shinji Maetani - Daicel Corporation
Young Suk Kim - Disco Corporation
Shoichi Kodama - Disco Corporation
C. Hsiao - Industrial Technology Research Institute
H. Chang - Industrial Technology Research Institute
C. Lin - Industrial Technology Research Institute
Takayuki Ohba - Tokyo Institute of Technology

4. 3:30 PM - Development of novel photosensitive dielectric material for reliable 2.1D package
Yune Kumazawa - Mitsubishi Gas Chemical Company, Inc.
Seiji shika - Mitsubishi Gas Chemical Company, Inc.
Shunsuke Katagiri - Mitsubishi Gas Chemical Company, Inc.
Takuya Suzuki - Mitsubishi Gas Chemical Company, Inc.
Tsuyoshi Kida - Mitsubishi Gas Chemical Company, Inc.
Shu Yoshida - Mitsubishi Gas Chemical Company, Inc.

5. 3:55 PM - An Advanced Solder Resist with Strong Adhesion and High Resolution for High Density Packaging
Sawako Shimada - TAIYO INK MFG.CO.,LTD.
Kazuya Okada - TAIYO INK MFG.CO.,LTD.
Tomoya Kudo - TAIYO INK MFG.CO.,LTD.
Chiho Ueta - TAIYO INK MFG.CO.,LTD.
Yuya Suzuki - TAIYO AMERICA, INC.

6. 4:20 PM - Solution method of warpage behavior for ultra-thin FC-CSP by control of EMC properties
Chika Arayama - Panasonic
Takahiro Akashi - Panasonic
Yasunari Tomita - Panasonic
Naoki Kanagawa - Panasonic

7. 4:45 PM - Innovative Socketable and Surface-Mountable BGA Interconnections
Omkar Gupte - Georgia Institute of Technology
Kristie Teoh - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology