Technical Program

Thursday, June 01, 2017

Session 22: Solder Joint & Interconnect Reliability, Characterization and Modeling
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Americas Seminar

Session Co-Chairs:

Yong Liu
ON Semiconductor
T +1-207-761-3155
Yong.Liu@onsemi.com
Erkan Oterkus
University of Strathclyde
T +44 (0)141 548 3876
erkan.oterkus@strath.ac.uk

Papers:

1. 1:30 PM - Peridynamic Solution of Wetness Equation with Time Dependent Saturated Concentration in ANSYS Framework
Cagan Diyaroglu - University of Arizona
Erdogan Madenci - University of Arizona
Selda Oterkus - University of Strathclyde
Erkan Oterkus - University of Strathclyde
... .. - ..

2. 1:55 PM - A Modified Acceleration Factor Empirical Equation for BGA Type Package
Min-Hsuan Hsu - National Tsing Hua University
Chang-Chun Lee - National Chung Hsing University
Kuo-Ning Chiang - National Tsing Hua University

3. 2:20 PM - Effect of Mean Temperature on the Evolution of Strain-Amplitude in SAC Ball-Grid Arrays During Operation under Thermal Aging and Temperature Excursions
Pradeep Lall - Auburn University
Kazi Mirza - Auburn University
Jeff Suhling - Auburn University
David Locker - US ARMY AMRDEC

4. 3:30 PM - Characterization of Dual Side Molding SiP Module
Jin-Yuan Lai - ASE
Tang-Yuan Chen - ASE
Ming-Han Wang - ASE
Meng-Kai Shih - ASE
David Tarng - ASE
Chih-Pin Hung - ASE

5. 3:55 PM - Bump Layout Impact Trends on Chip-Package Interaction Risk in an Advanced Node Chip in Flip Chip Packages
Fahad Mirza - GLOBALFOUNDRIES
Thiagarajan Raman - GLOBALFOUNDRIES
Scott Pozder - GLOBALFOUNDRIES
Jae Kyu Cho - GLOBALFOUNDRIES
Premachandran C S - GLOBALFOUNDRIES
Carole Graas - GLOBALFOUNDRIES
Patrick Justison - GLOBALFOUNDRIES

6. 4:20 PM - Anisotropic and Multiscale Constitutive Framework for the Reliability of Microscale Interconnects Based on Damage Mechanics
Zhengfang Qian - Shenzhen University
Hongtao Chen - Harbin Institute of Tech.

7. 4:45 PM - SACQ Solder Board Level Reliability Evaluation and Life Prediction Model for Wafer Level Packages
Wei Lin - Amkor
Quan Pham - Amkor
Bora Baloglu - Amkor
Michael Johnson - Amkor