Technical Program

Thursday, June 01, 2017

Session 22: Solder Joint & Interconnect Reliability, Characterization and Modeling
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Americas Seminar

Session Co-Chairs:

Yong Liu
ON Semiconductor
T +1-207-761-3155
Yong.Liu@onsemi.com
Erkan Oterkus
University of Strathclyde
T +44 (0)141 548 3876
erkan.oterkus@strath.ac.uk

Papers: