Technical Program

Thursday, May 30, 2019

Session 22: Advanced Substrates and Interconnect Technology
1:30 PM - 5:10 PM
Committee: Materials & Processing

Session Co-Chairs:

Kimberly Yess
Brewer Science
T +1-573-201-8669
kyess@brewerscience.com
Mikel Miller
EMD Performance Materials
T +1-951-514-4574
mikel.miller@emdgroup.com

Papers: