Technical Program

Thursday, May 30, 2019

Session 22: Advanced Substrates and Interconnect Technology
1:30 PM - 5:10 PM
Committee: Materials & Processing

Session Co-Chairs:

Kimberly Yess
Brewer Science
T +1-573-201-8669
kyess@brewerscience.com
Mikel Miller
EMD Performance Materials
T +1-951-514-4574
mikel.miller@emdgroup.com

Papers:

1. 1:30 PM - Temporary SiC-SiC Wafer Bonding Compatible With High Temperature Annealing
Fengwen Mu - The University of Tokyo
Tadatomo Suga - The University of Tokyo
Miyuki Uomoto - Tohoku University
Takehito Shimatsu - Tohoku University

2. 1:55 PM - Ultrathin Glass to Ultrathin Glass Bonding Using Laser Sealing Approach
Messaoud Bedjaoui - CEA-LETI
Jean Brun - CEA-LETI
Johnny Amiran - CEA-LETI

3. 2:20 PM - Development of Resins for Bumpless Interconnects and Wafer-on-Wafer (WOW) Integration
Naoko Araki - Daicel Corporation
Shinji Maetani - Daicel Corporation
Young Suk Kim - Disco Corporation
Shoichi Kodama - Disco Corporation
Takayuki Ohba - Tokyo Institute of Technology

4. 3:30 PM - Development of Novel Photosensitive Dielectric Material for Reliable 2.1D Package
Yune Kumazawa - Mitsubishi Gas Chemical Company, Inc.
Seiji Shika - Mitsubishi Gas Chemical Company, Inc.
Shunsuke Katagiri - Mitsubishi Gas Chemical Company, Inc.
Takuya Suzuki - Mitsubishi Gas Chemical Company, Inc.
Tsuyoshi Kida - Mitsubishi Gas Chemical Company, Inc.
Shu Yoshida - Mitsubishi Gas Chemical Company, Inc.

5. 3:55 PM - High Reliability Solder Resist With Strong Adhesion and High Resolution for High Density Packaging
Sawako Shimada - Taiyo Ink Mfg. Co., Ltd.
Kazuya Okada - Taiyo Ink Mfg. Co., Ltd.
Tomoya Kudo - Taiyo Ink Mfg. Co., Ltd.
Chiho Ueta - Taiyo Ink Mfg. Co., Ltd.
Yuya Suzuki - Taiyo America, inc.

6. 4:20 PM - Method for Mitigating the Warpage of Ultra-thin FC-CSPs by Controlling of EMC Properties
Chika Arayama - Panasonic Corporation
Takahiro Akashi - Panasonic Corporation
Yasunari Tomita - Panasonic Corporation
Naoki Kanagawa - Panasonic Corporation

7. 4:45 PM - Innovative Socketable and Surface-Mountable BGA Interconnections
Omkar Gupte - Georgia Institute of Technology
Kristie Teoh - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology
Gregorio Murtagian - Intel Corporation