Technical Program

Wednesday, May 31, 2017

Session 10: Harsh Environment Interconnect Reliability
1:30 PM - 5:10 PM
Committee: Applied Reliability
Room: Southern Hemisphere V

Session Co-Chairs:

Tim Chaudhry
Amkor Technology, Inc.
T +1-949-981-2489
timchaudhry@gmail.com
René Rongen
NXP Semiconductors
T +31-(0)6-51171461
rene.rongen@nxp.com

Papers: