Technical Program

Wednesday, May 30, 2018

Session 10: Dicing and Encapsulation Technologies
1:30 PM - 5:10 PM
Committee: Assembly & Manufacturing Technology

Session Co-Chairs:

Garry Cunningham
T +1-410-765-7859
Paul Tiner
Texas Instruments
T +1-469-471-3565


1. 1:30 PM - A More than Moore Enabling Wafer Dicing Technology
Jeroen van Borkulo - ASM Pacific Technology
Rogier Evertsen - ASM Pacific Technology
Richard van der Stam - ASM Pacific Technology

2. 1:55 PM - Plasma Dicing Integration Schemes for Scribe Lane Layout and the Impact on Die Strength
David Parker - ST Microelectronics

3. 2:20 PM - Advanced Dicing Technologies for Combination of Wafer to Wafer and Collective Die to Wafer Direct Bonding
Fumihiro Inoue - IMEC
Alain Phommahaxay - IMEC
Arnita Podpod - IMEC
Samuel Suhard - IMEC
Hitoshi Hoshino - Disco High-Tech Europe
Berthold Moeller - Disco High-Tech Europe
Erik Sleeckx - IMEC
Kenneth June Rebibis - IMEC
Andy Miller - IMEC
Eric Beyne - IMEC

4. 3:30 PM - Active control of NCF fillet shape for 3D CoW by multi beam lase bonder
Keiko Ueno - Hitachi Chemical, Co., Ltd.
Kazutaka Honda - Hitachi Chemical, Co., Ltd.
Tsuyoshi Ogawa - Hitachi Chemical, Co., Ltd.

5. 3:55 PM - Ultrafast Laser Scribe: An Improved Metal and ILD Ablation Process
Julia Chiu - Intel Corporation
Tyler Osborn - Intel Corporation
Aaron Gore - Intel Corporation
Daragh Finn - Electro Scientific Industries
David Lord - Electro Scientific Industries
Jon Mellen - Electro Scientific Industries

6. 4:20 PM - Reliability and Benchmark of 2.5D Non-molding and Molding Technologies
Yu-Hsiang Hsiao - Advanced Semiconductor Engineering
Che-Ming Hsu - Advanced Semiconductor Engineering
Yi-Sheng Lin - Advanced Semiconductor Engineering
Chien-Lin Chang Chien - Advanced Semiconductor Engineering

7. 4:45 PM - Laser-induced Trench Design, Optimisation and Validation for Restricting Capillary Underfill Spread in Advanced Packaging Configurations
Gul Zeb - Université de Sherbrooke
David Danovitch - Université de Sherbrooke
Eric Turcotte - IBM Canada Ltd.