Technical Program

Wednesday, June 01, 2022

Session 9: Millimeter-Wave Antenna-In-Package: Design, Manufacturing and Test
1:30 PM - 5:10 PM
Committee: RF, High-Speed Components & Systems
Room: Silver Pearl 3

Session Co-Chairs:

Xiaoxiong (Kevin) Gu
Metawave
T
[email protected]
P. Markondeya Raj
Florida International University
T +1-305 348 6249
[email protected]

Papers:

1. A 16 Element Antenna Integrated Package for 37-40GHz Operation
Selaka Bulumulla - GlobalFoundries
Syed Rahman - MixComm
Arun Natarajan - MixComm
Harish Krishnaswamy - MixComm

2. FOWLP AiP for SOTM Applications
Mei Sun - Institute of Microelectronics (IME), A*STAR
Teck Guan Lim - Institute of Microelectronics (IME), A*STAR
Yong Han - Institute of Microelectronics (IME), A*STAR

3. Characteristics of Glass-Embedded FOAiP with Antenna Arrays for 60GHz mmWave Applications
I-Hung Lin - Hon Hai Precision Industry Co., Ltd.
Cheng-Chen Lin - National Defense University
Ying-Chieh Pan - Hon Hai Precision Industry Co., Ltd.
Ben-Je Lwo - National Defense University
Tom Ni - Hon Hai Precision Industry Co., Ltd.

4. Multi-layer FCCSP organic packaging for D-band millimeter wave applications
Neelam Prabhu Gaunkar - Intel Corporation
Georgios Dogiamis - Intel Corporation
Telesphor Kamgaing - Intel Corporation
Adel Elsherbini - Intel Corporation
J. Swan - Intel Corporation

5. Slot Bow-Tie Antenna Integration in Flip-Chip and Embedded Die Enhanced QFN Package for WR8 and WR5 Frequency Band
Aditya Jogalekar - The University of Texas at Dallas
Oscar Medina - The University of Texas at Dallas
Andrew Blanchard - The University of Texas at Dallas
Rashaunda Henderson - The University of Texas at Dallas
Mahadevan Iyer - The University of Texas at Dallas
Tony Tang - Texas Instruments
Rajen Murugan - Texas Instruments
Hassan Ali - Texas Instruments

6. Antenna-Integrated, Die-Embedded Glass Package for 6G Wireless Applications
Xiaofan Jia - Georgia Institute of Technology
Xingchen Li - Georgia Institute of Technology
Kyoung-sik Moon - Georgia Institute of Technology
Joon Woo Kim - Georgia Institute of Technology
Kai-Qi Huang - Georgia Institute of Technology
Matthew B. Jordan - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology

7. Design and Testing of a WR28 Waveguide Blind Mating Interconnect for mmWave ATE OTA Applications
Shiota Natsuki - Advantest
Kikuchi Aritomo - Advantest
Yuchang Liu - Advantest
Daniel Lam - Advantest
Takasu Hiromitsu - Advantest
Mineo Hiroyuki - Advantest
Kato Yasuyuki - Advantest
Jose Moreira - Advantest