Technical Program

Wednesday, June 01, 2022

Session 8: Hybrid and Direct Bonding Development and Characterization
1:30 PM - 5:10 PM
Committee: Interconnections
Room: Silver Pearl 2

Session Co-Chairs:

Wei-Chung Lo
ITRI, Industrial Technology Research Institute
T +886-3-591-7024
[email protected]
C. Key Chung
TongFu Microelectronics Co. Ltd.
T +86-15365568052
[email protected]


1. Development of Face-to-Face and Face-to-Back Ultra-Fine Pitch Cu-Cu Hybrid Bonding
Yoshihisa Kagawa - Sony Semiconductor Solutions Corporation
Takumi Kamibayashi - Sony Semiconductor Solutions Corporation
Kenya Nishio - Sony Semiconductor Solutions Corporation
Taichi Yamada - Sony Semiconductor Solutions Corporation
Yuriko Yamano - Sony Semiconductor Solutions Corporation
Akihisa Sakamoto - Sony Semiconductor Solutions Corporation
Kan Shimizu - Sony Semiconductor Solutions Corporation
Tomoyuki Hirano - Sony Semiconductor Solutions Corporation
Hayato Iwamoto - Sony Semiconductor Solutions Corporation

2. Surface Energy Characterization for Die-Level Cu Hybrid Bonding
Katsuyuki Sakuma - IBM Corporation
Roy Yu - IBM Corporation
Michael Belyansky - IBM Corporation
Marc Bergendahl - IBM Corporation
Dale McHerron - IBM Corporation
Ming Li - ASM Pacific Technologies, Ltd.
Yiu Ming Cheung - ASM Pacific Technologies, Ltd.
Siu Cheung So - ASM Pacific Technologies, Ltd.
So Ying Kwok - ASM Pacific Technologies, Ltd.
Siu WIng Lau - ASM Pacific Technologies, Ltd.

3. Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems
Toshiaki Shirasaka - Showa Denko Materials Co., Ltd.
Tadashi Okuda - Showa Denko Materials Co., Ltd.
Tomoaki Shibata - Showa Denko Materials Co., Ltd.
Satoshi Yoneda - HD MicroSystems, Ltd.
Daisaku Matsukawa - HD MicroSystems, Ltd.
Mariappan Murugesan - Tohoku University
Mitsumasa Koyanagi - Tohoku University
Takafumi Fukushima - Tohoku University

4. Two-Step Ar/N2 Plasma-Activated Al Surface for Al-Al Direct Bonding
Liangxing Hu - Nanyang Technological University
Yu Dian Lim - Nanyang Technological University
Peng Zhao - Nanyang Technological University
Michael Joo Zhong Lim - Nanyang Technological University
Chuan Seng Tan - Nanyang Technological University

5. Novel Ga Assisted Low Temperature Bonding for Fine Pitch Interconnects
Shan-Bo Wang - ASE Group
An-Hsuan Hsu - ASE Group
Chin-Li Kao - ASE Group
David Tarng - ASE Group
Chien-Lung Liang - National Cheng Kung University
Kwang-Lung Lin - National Cheng Kung University

6. Characterization of Die-to-Wafer Hybrid Bonding Using Heterogeneous Dielectrics
MINKI KIM - Samsung Electronics Co., Ltd.
Soojeoung Park - Samsung Electronics Co., Ltd.
Aeni Jang - Samsung Electronics Co., Ltd.
Hyuekjae Lee - Samsung Electronics Co., Ltd.
Seungduk Baek - Samsung Electronics Co., Ltd.
ChungSun Lee - Samsung Electronics Co., Ltd.
Ilhwan Kim - Samsung Electronics Co., Ltd.
Jumyong Park - Samsung Electronics Co., Ltd.
Youngkun Jee - Samsung Electronics Co., Ltd.
Dae-Woo Kim - Samsung Electronics Co., Ltd.
Un-Byoung Kang - Samsung Electronics Co., Ltd.

7. Solder and Organic Adhesive Hybrid Bonding Technology with Non-Strip Type Photosensitive Resin and Injection Molded Solder (IMS)
Keiji Matsumoto - IBM Corporation
Takahito Watanabe - IBM Corporation
Risa Miyazawa - IBM Corporation
Toyohiro Aoki - IBM Corporation
Takashi Hisada - IBM Corporation
Yuzo Nakamura - Mitsui Chemicals, Inc.
Yasuhisa Kayaba - Mitsui Chemicals, Inc.
Jun Kamada - Mitsui Chemicals, Inc.
Kazuo Kohmura - Mitsui Chemicals, Inc.