Technical Program
Program Sessions: Wednesday May 31st 2:00 PM – 5:05 PM
Session 8: Novel Reliability Test Methods
Committee: Applied Reliability
Room: Palazzo A & B
Session Co-Chairs:
S. B. Park
Binghamton University
Email: [email protected]
Sandy Klengel
Fraunhofer IMWS
Email: [email protected]
Papers:
1. A New Vibration Test Method for Automotive and Consumer Electronic Devices: Calibration and Fatigue Test
Dongji Xie – Nvidia Corporation
Andy Zhang – Texas Instruments, Inc.
Jeffrey Lee – iST-Integrated Service Technology, Inc.
Romuald Roucou – NXP Semiconductor, Inc.
Xue Shi – Bosch Automotive Products Co., Ltd.
Sushil Doranga – Lamar University
Valeriy Khaldarov – ASONIKA, LLC
Joe Hai – Nvidia Corporation
2. Magnetic Force-Based Measurement Technique to Investigation the Effect of Lead-Free Solder Intermetallic Compounds (IMC) on Interconnect Reliability
Rui Chen – Georgia Institute of Technology
Nicholas Ginga – University of Alabama in Huntsville
Suresh Sitaraman – Georgia Institute of Technology
3. Residual Stress Measurement of Build-Up Layer in Silicon Wafers
Junbo Yang – Binghamton University
Chongyang Cai – Binghamton University
Yangyang Lai – Binghamton University
Jong Hwan Ha – Binghamton University
Seungbae Park – Binghamton University
Huayan Wang – Advanced Micro Devices, Inc.
Suresh Ramalingam – Advanced Micro Devices, Inc.
Gamal Refai-Ahmed – Advanced Micro Devices, Inc.
4. Chip Level Evaluation of Wafer-to-Wafer Direct Bonding Strength With Bending Test
Juno Kim – Samsung Electronics Co., Ltd.-Mechatronics Research
Kyungmin Baek – Samsung Electronics Co., Ltd.-Mechatronics Research
Min-soo Han – Samsung Electronics Co., Ltd.-Mechatronics Research
Kyeongbin Lim – Samsung Electronics Co., Ltd.-Mechatronics Research
Minwoo Daniel Rhee – Samsung Electronics Co., Ltd.-Mechatronics Research
5. In-Situ Observation of Microscale Crack-Tip Strain Field Evolution in Underfill With Different Toughening Agents and Temperatures Via SEM-DIC Coupled Method
Xuecheng Yu – Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Gang Li – Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Yixuan Fan – Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Rong sun – Chinese Academy of Science-Shenzhen Institute of Advanced Technology
6. Experimental Identification of the Failure Modes and Failure Mechanisms of Fiber Arrays Under Cyclic Tensile Loading
Assane Dione – University of Sherbrooke
Jean-Francois Morissette – University of Sherbrooke
Julien Sylvestre – University of Sherbrooke
Richard Langlois – IBM Canada, Ltd.
Papa Momar Souare – IBM Canada, Ltd.
Patrick Jacques – University of Sherbrooke
7. A Predictive Metallographic Means to Identify the Relative Risk of Failure for Plated Micro Vias
Roger Massey – MKS Atotech
Tobias Bernhard – MKS Atotech
Kilian Klaeden – MKS Atotech
Sebastian Zarwell – MKS Atotech
Edith Steinhaeuser – MKS Atotech
Sascha Dieter – MKS Atotech
Stefan Kempa – MKS Atotech
Frank Bruening – MKS Atotech
