Technical Program
Program Sessions: Wednesday May 31st 9:30 AM – 12:35 PM
Session 6: Co-packaged Optical Assembly
Committee: Photonics
Room: Palazzo E
Session Co-Chairs:
Ajey Jacob
University of Southern California
Email: [email protected]
Takaaki Ishigure
Keio University
Email: [email protected]
Papers:
1. A Heterogeneously Integrated Wafer-Level Processed Co-Packaged Optical Engine for Hyper-Scale Data Centres
Sajay Bhuvanendran Nair Gourikutty – Institute of Microelectronics A*STAR
Boon Long Lau – Institute of Microelectronics A*STAR
Wen Wei Seit – Institute of Microelectronics A*STAR
Ming Chinq Jong – Institute of Microelectronics A*STAR
David Ho Soon Wee – Institute of Microelectronics A*STAR
Jiaqi Wu – Institute of Microelectronics A*STAR
Teck Guan Lim – Institute of Microelectronics A*STAR
Rathin Mandal – Institute of Microelectronics A*STAR
Ser Choong Chong – Institute of Microelectronics A*STAR
Lai Yee Chia – Institute of Microelectronics A*STAR
Li Xin – Rain Tree Photonics Pte. Ltd.
Tsung-Yang Liow – Rain Tree Photonics Pte. Ltd.
Surya Bhattacharya – Institute of Microelectronics A*STAR
2. High Density Integration Technologies for SiPh Based Optical I/Os
Karlheinz Muth – Broadcom, Inc.
Hari Potluri – Broadcom, Inc.
Sukesh Kannan – Broadcom, Inc.
3. Photonic System Integration by Applying Microelectronic Packaging Approaches Using Glass Substrates
Henning Schroeder – Fraunhofer IZM
Oliver Kirsch – Fraunhofer IZM
Daniel Weber – Technical University Berlin
Hendrick Thiem – TOPTICA eagleyard
4. Co-Packaged Optics on Glass Substrates for 102.4 Tb/s Data Center Switches
Lucas Yeary – Corning, Inc.
Lars Brusberg – Corning, Inc.
Seong-ho Seok – Corning, Inc.
Jung-Hyun Noh – Corning, Inc.
Alon Rozenvax – Corning, Inc.
Cheolbok Kim – Corning, Inc.
5. Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics
Jay Li – Siliconware Precision Industries Co., Ltd.
Sam Lin – Siliconware Precision Industries Co., Ltd.
Teny Shih – Siliconware Precision Industries Co., Ltd.
Nicholas Kao – Siliconware Precision Industries Co., Ltd.
Yu-Po Wang – Siliconware Precision Industries Co., Ltd.
6. AIM Photonics Demonstration of a 300 mm Si Photonics Interposer
Colin McDonough – SUNY Research Foundation/SUNY Polytechnic Institute/AIM Photonics
Seth Kruger – SUNY Research Foundation/SUNY Polytechnic Institute/AIM Photonics
Tat Ngai – SUNY Research Foundation/SUNY Polytechnic Institute/AIM Photonics
Sarah Baranowski – SUNY Research Foundation/SUNY Polytechnic Institute/AIM Photonics
Hao Yang – Analog Photonics
Skylar Deckoff-Jones – Analog Photonics
Christopher V. Poulton – Analog Photonics
Michael R. Watts – Analog Photonics
David L. Harame – SUNY Research Foundation/SUNY Polytechnic Institute/AIM Photonics
7. Advanced 3D Integration TSV and Flip Chip Technologies Evaluation for the Packaging of a Mobile LiDAR 256 Channels Beam Steering Device Designed for Autonomous Driving Application
Thierry Mourier – CEA-LETI
Nadia Miloud-Ali – CEA-LETI
Natacha Raphoz – CEA-LETI
Yacoub Sahouane – CEA-LETI
Patrick Peray – CEA-LETI
Damien Saint-Patrice – CEA-LETI
Edouard Deschaseaux – CEA-LETI
Francois Simoens – Steerlight
