Technical Program

Wednesday, June 01, 2022

Session 6: Emerging Modeling Including AI and Machine Learning
8:00 AM - 11:40 AM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Coral 5

Session Co-Chairs:

Przemyslaw Gromala
Robert Bosch GmbH
T +49-162-8514983
[email protected]
Nancy Iwamoto

[email protected]


1. Applied Modeling Framework in Integrated Circuit Design and Reliability
Papa Momar Souare - IBM Corporation
Cedrick Bouchard - IBM Corporation
Eric Duchesne - IBM Corporation
James Zaccardi - Viasat, Inc.
David Pettit - Viasat, Inc.
Francois Vachon - IBM Corporation

2. Co-Design of Thermal Management with System Architecture and Power Management for 3D ICs
Rishav Roy - Purdue University
Shidhartha Das - Arm, Inc.
Benoit Labbe - Arm, Inc.
Rahul Mathur - Arm, Inc.
Supreet Jeloka - Arm, Inc.

3. On-Chip Transient Hot Spot Detection with a Multiscale ROM in 3DIC Designs
David Geb - Ansys
Saeed Asgari - Ansys
Akhilesh Kumar - Ansys
Jimin Wen - Ansys
Norman Chang - Ansys
Stephen Pan - Ansys
Mehdi Abarham - Ansys
Haiyang He - Ansys
Viral Gandhi - Ansys

4. Implementation of Fully Coupled Electromigration Theory in COMSOL
Zhen Cui - Delft University of Technology
Xuejun Fan - Lamar University
Guoqi Zhang - Delft University of Technology

5. Peridynamic Modeling of Non-Fourier and Non-Fickian Diffusion in a Finite Element Framework
Sundaram Vinod Anicode - University of Arizona
Erdogan Madenci - University of Arizona

6. Feature Vector Based Remaining Useful-Life Assessment in Mechanical Shock and Vibration for Leadfree Electronics
Pradeep Lall - Auburn University
Tony Thomas - Auburn University
Ken Blecker - US Army CCDC-AC

7. Genetic Algorithm Assisted Design of RDL Vias for a Fan-Out Panel Level SiC MOSFET Power Module Packaging
Jiajie Fan - Fudan University
Yichen Qian - Hohai University
Jing Jiang - Fudan University
Zhuorui Tang - Fudan University
Xuejun Fan - Lamar University
Guoqi Zhang - Delft University of Technology