Technical Program

Wednesday, June 01, 2022

Session 5: Bonding Technology: Novel Assembly Methods and Processes
8:00 AM - 11:40 AM
Committee: Assembly & Manufacturing Technology
Room: Coral 3&4

Session Co-Chairs:

Valerie Oberson
IBM Canada Ltd
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[email protected]
Jan Vardaman
TechSearch International
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Papers:

1. The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding
Laura Mirkarimi - Xperi Corporation
Cyprian Uzoh - Xperi Corporation
Dominik Suwito - Xperi Corporation
Gill Fountain - Xperi Corporation
Thomas Workman - Xperi Corporation
Bongsub Lee - Xperi Corporation
Jeremy Theil - Xperi Corporation
Guilian Gao - Xperi Corporation
Bryan Buckalew - Lam Research, Inc.
Justin Oberst - Lam Research, Inc.
Thomas Ponnuswamy - Lam Research, Inc.

2. Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration
Alice Bond - CEA-LETI
Emilie Bourjot - CEA-LETI
Stéphan Borel - CEA-LETI
Thierry Enot - CEA-LETI
Pierre Montméat - CEA-LETI
Loïc Sanchez - CEA-LETI
Frank Fournel - CEA-LETI
Johanna Swan - Intel Corporation

3. Fine-Pitch 30 μm Cu-Cu Bonding by Using Low Temperature Microfluidic Electroless Interconnection
Yung-Sheng Lin - ASE Group
Yun-Ching Hung - ASE Group
Chin-Li Kao - ASE Group
Chung-Hung Lai - ASE Group
Po-Shao Shih - National Taiwan University
Jeng-Hau Huang - National Taiwan University
David Tarng - ASE Group
Robert C. Kao - National Taiwan University

4. Die Bonding Solution for Flip Chip-Chip Scale Package-DIC (Digital Image Correlation) and Shadow Moiré Application
Po Yu Liao - Siliconware Precision Industries Co., Ltd.
Ian Ho - Siliconware Precision Industries Co., Ltd.
David Lai - Siliconware Precision Industries Co., Ltd.
Yu-Po Wang - Siliconware Precision Industries Co., Ltd.
Karen Chen - ASE Group
Hsin-Chih Shih - ASE Group
Dao-Long Chen - ASE Group
David Tarng - ASE Group

5. Investigation of Low Temperature Co-Co Direct Bonding and Co-Passivated Cu-Cu Direct Bonding
Demin Liu - National Yang Ming Chiao Tung University
Kuan-Chun Mei - National Yang Ming Chiao Tung University
Han-Wen Hu - National Yang Ming Chiao Tung University
Yi-Chieh Tsai - National Yang Ming Chiao Tung University
Huang-Chung Cheng - National Yang Ming Chiao Tung University
Kuan-Neng Chen - National Yang Ming Chiao Tung University

6. Process and Design Optimization for Hybrid Cu Bonding Void
Hyoeun Kim - Samsung Electronics Co., Ltd.
Juhyeon Kim - Samsung Electronics Co., Ltd.
Yeongseon Kim - Samsung Electronics Co., Ltd.
Sun-Kyoung Seo - Samsung Electronics Co., Ltd.
Chajea Jo - Samsung Electronics Co., Ltd.
Dae-Woo Kim - Samsung Electronics Co., Ltd.

7. Laser-Assisted Bonding (LAB) Process and Its Bonding Materials as Technologies Enabling the Low-Carbon Era
Kwang-Seong Choi - Electronics and Telecommunications Research Institute
Jiho Joo - Electronics and Telecommunications Research Institute
Gwang-Mun Choi - Electronics and Telecommunications Research Institute
Ho-Gyeong Yun - Electronics and Telecommunications Research Institute
Seok Hwan Moon - Electronics and Telecommunications Research Institute
Ki-Seok Jang - Electronics and Telecommunications Research Institute
Chanmi Lee - Electronics and Telecommunications Research Institute
In-Seok Kye - Electronics and Telecommunications Research Institute
Yoon-Hwan Moon - Electronics and Telecommunications Research Institute
Yong-Sung Eom - Electronics and Telecommunications Research Institute