Technical Program

Friday June 2nd

10:00 AM - 12:00 PM

Session 41: Student Interactive Presentations
Committee: Interactive Presentations
Room: In front of Palazzo D & E

Session Co-Chairs:

Alan Huffman
SkyWater Technology
Email: [email protected]

Biao Cai
IBM Corporation
Email: [email protected]

Pavel Roy Paladhi
IBM Corporation
Email: [email protected]

Jin Yang
Intel Corporation
Email: [email protected]

Papers:

An Ultra-Fine Wiring Method for Polymer-Based Embedded Silicon Fan-Out Packaging (P-eSiFO)
Lang Chen — Peking University-Institute of Microelectronics
Bo Wen — Peking University-Institute of Microelectronics
Xiao Han — Peking University-Institute of Microelectronics
JinWen Zhang — Peking University-Institute of Microelectronics
Wei Wang — Peking University-Institute of Microelectronics
Chenxi Lin — Peking University-Institute of Microelectronics

Grain Orientation, Microstructure Evolution and Fatigue Life Prediction of Solder Joints Under Thermal Shock Test for Fan-Out Wafer Level Packaging
Shuye Zhang — Harbin Institute of Technology
Xinyi Jing — Harbin Institute of Technology
Peng He — Harbin Institute of Technology
Kyung-Wook Paik — Korea Advanced Institute of Science and Technology

Warpage Modeling and Optimization for Polymer-Based Embedded Silicon Fan-Out Packaging (P-eSiFO) During Thermal Process Loadings
Jianyu Du — Peking University
Lang Chen — Peking University
Han Xu — Peking University
jinwen Zhang — Peking University
Wei Wang — Peking University

Alternative Copper-to-Copper Direct Bonding Process Using Current-Induced Bonding Method
Byungkwan Kwak — Hanyang University
Jinhyun Lee — Hanyang University
Sanghwa Yoon — Hanyang University
Bongyoung Yoo — Hanyang University

Secure and Scalable Key Management for Waferscale Heterogeneous Integration
Yousef Safari — McGill University/University of California, Los Angeles
Pooya Aghanoury — University of California, Los Angeles
Subramanian S. Iyer — University of California, Los Angeles
Nader Sehatbakhsh — University of California, Los Angeles

A Method to Improve 3D Interconnections Resource Utilization and Reliability in Hybrid Bonding Process Considering the Effects on Signal Integrity
Ang Li — Shanghai Jiao Tong University
Jianfei Jiang — Shanghai Jiao Tong University
Qin Wang — Shanghai Jiao Tong University
Zizheng Dong — Shanghai Jiao Tong University
Shuya Ji — Shanghai Jiao Tong University
Xiulan Cheng — Shanghai Jiao Tong University
Yuhang Zhao — Shanghai Jiao Tong University

Wafer-Level Integration of Atomic Vapor Cell Chip With Thermal and RF Modules
Ziji Wang — Southeast University
Jintang Shang — Southeast University

Optimization of Embedded Manifold Cooling Characteristic Parameters for GaN HEMT
Dichen Lu — Chinese Academy of Science-Institute of Microelectronics
Yuxin Ye — Chinese Academy of Science-Institute of Microelectronics
Mei Wu — Chinese Academy of Science-Institute of Microelectronics
Ruiwen Liu — Chinese Academy of Science-Institute of Microelectronics
Xiangbin Du — Chinese Academy of Science-Institute of Microelectronics
Lihang Yu — Chinese Academy of Science-Institute of Microelectronics
jie Wang — Chinese Academy of Science-Institute of Microelectronics
Jingping Qiao — Chinese Academy of Science-Institute of Microelectronics
Ziyu Liu — Chinese Academy of Science-Institute of Microelectronics
Yulin Shi — Chinese Academy of Science-Institute of Microelectronics
Binbin Jiao — Chinese Academy of Science-Institute of Microelectronics
Yanmei Kong — Chinese Academy of Science-Institute of Microelectronics

Low-Stress TSVs for High-Density 3D Integration
Jingping Qiao — Chinese Academy of Science-Institute of Microelectronics
Binbin Jiao — Chinese Academy of Science-Institute of Microelectronics
Shiqi Jia — Chinese Academy of Science-Institute of Microelectronics
Ruiwen Liu — Chinese Academy of Science-Institute of Microelectronics
Shichang Yun — Chinese Academy of Science-Institute of Microelectronics
Yanmei Kong — Chinese Academy of Science-Institute of Microelectronics
Yuxin Ye — Chinese Academy of Science-Institute of Microelectronics
Xiangbin Du — Chinese Academy of Science-Institute of Microelectronics
Lihang Yu — Chinese Academy of Science-Institute of Microelectronics
Dichen Lu — Chinese Academy of Science-Institute of Microelectronics
Ziyu Liu — Chinese Academy of Science-Institute of Microelectronics
Jie Wang — Institute of Microelectronics, Chinese Academy of Science, Beijing, China

Low Dk/Df Thermosetting Siloxane Hybrid Material for Fabrication of Microwave Communication Printed Circuit Board
Seung-Mo Kang — Korea Advanced Institute of Science and Technology
Byeong-Soo Bae — Korea Advanced Institute of Science and Technology

Optimization of Si Phononic MEMS Nanowires for Ultra-Low Thermal Conductivity
Sunghyun Hwang — University of Florida
James D. Overmeyer — University of Florida
S. M. Enamul Hoque Yousuf — University of Florida
William N. Carr — Phononic MEMS, Inc.
Philip X.-L. Feng — University of Florida
Yong-Kyu Yoon — University of Florida

Rapid Formation of High-Strength Sintered Silver Joints With High Reliability
Xu Zhang — Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Pengli Zhu — Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Tao Zhao — Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Liang Xu — Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Rong Sun — Chinese Academy of Science-Shenzhen Institute of Advanced Technology

Reference Thermal Chips for 2D and 3D Co-Packaging Process Development
Parnika Gupta — Tyndall National Institute-Photonic Packaging
Robert Bernson — Tyndall National Institute-Photonic Packaging
Noreen Nudds — Tyndall National Institute-Photonic Packaging
Sean Collins — Tyndall National Institute-Photonic Packaging
Kamil Gradkowski — Tyndall National Institute-Photonic Packaging
Padraic E. Morrissey — Tyndall National Institute-Photonic Packaging
Peter O' Brien — Tyndall National Institute-Photonic Packaging

Wideband Circular Polarized FOWLP Antenna in Package for Satellite Communications
KaiBo Zheng — Institute of Microelectronics A*STAR
Mei Sun — Institute of Microelectronics A*STAR
Yongxin Guo — National University of Singapore

A High Precision Analysis Method Based on Thermal Test Chip for Thermal Characteristics of Thermal Interface Materials
Yulin Shi — Chinese Academy of Science-Institute of Microelectronics
Binbin Jiao — Chinese Academy of Science-Institute of Microelectronics
Qixing Hao — Chinese Academy of Science-Institute of Microelectronics
Yanmei Kong — Chinese Academy of Science-Institute of Microelectronics
Ruiwen Liu — Chinese Academy of Science-Institute of Microelectronics
Shichang Yun — Chinese Academy of Science-Institute of Microelectronics
Yuxin Ye — Chinese Academy of Science-Institute of Microelectronics
Lihang Yu — Chinese Academy of Science-Institute of Microelectronics
Xiangbin Du — Chinese Academy of Science-Institute of Microelectronics
Jie Wang — Chinese Academy of Science-Institute of Microelectronics
jingping Qiao — Chinese Academy of Science-Institute of Microelectronics
Dichen Lu — Chinese Academy of Science-Institute of Microelectronics

A Bionic Sweating Cooling Method for High Power Chip Based on Evaporation and Convection
Lihang Yu — Institute of Microelectronics Chinese Academy of Sciences
Binbin Jiao — Institute of Microelectronics Chinese Academy of Sciences
Yuxin Ye — Institute of Microelectronics Chinese Academy of Sciences
Xiangbin Du — Institute of Microelectronics Chinese Academy of Sciences
Yanmei Kong — Institute of Microelectronics Chinese Academy of Sciences
Ruiwen Liu — Institute of Microelectronics Chinese Academy of Sciences
Shichang Yun — Institute of Microelectronics Chinese Academy of Sciences
Yulin Shi — Institute of Microelectronics Chinese Academy of Sciences
Jie Wang — Institute of Microelectronics Chinese Academy of Sciences
Dichen Lu — Institute of Microelectronics Chinese Academy of Sciences
Ziyu Liu — Institute of Microelectronics Chinese Academy of Sciences
Jingping Qiao — Institute of Microelectronics Chinese Academy of Sciences

Generative Adversarial Network Based Adpative Transmitter Modeling
Priyank Kashyap — North Carolina State University
Prasanth Prabu Ravichandiran — North Carolina State University
Dror Baron — North Carolina State University
Chau-Wai Wong — North Carolina State University
Tianfu Wu — North Carolina State University
Paul Franzon — North Carolina State University

FISHI: Fault Injection Detection in Secure Heterogeneous Integration Via Power Noise Variation
Tao Zhang — University of Florida
Md Latifur Rahman — University of Florida
Hadi Mardani Kamali — University of Florida
Kimia Zamiri Azar — University of Florida
Mark Tehranipoor — University of Florida
Farimah Farahmandi — University of Florida

Wafer-Level Vacuum Packaging for Micro-Spherical Atomic Vapor Cell
Wenqi Li — Southeast University
Jintang Shang — Southeast University
Ziji Wang — Southeast University
Jin Zhang — Southeast University

Design and Fabrication of Manifold Microfluidic Cooling Package Structure Based on Embedded Silicon Fan-Out (eSiFO)
Yuchi Yang — Peking University
Zhou Yang — China University of Geosciences Beijing
Peijue Lyu — Peking University
Jianyu Du — Peking University
Lang Chen — Peking University

RFID Based Vehicular Positioning System for Safe Driving Under Adverse Weather Condititons
Bhargav Avireni — Michigan State University
Yihang Chu — Michigan State University
Ethan Kepros — Michigan State University
Premjeet Chahal — Michigan State University

Fingerprint Extrication With Near-Field Terahertz Time-Domain Spectroscopy (THz-TDS) for IC Hardware Assurance
Chengjie Xi — University of Florida
John True — University of Florida
Navid Asadizanjani — University of Florida

Additively Manufactured Near Chip Scale Interposers for DC and RF Applications
Emily Lamport — UMass Lowell
Andrew M. Luce — UMass Lowell
Yuri Piro — UMass Lowell
Susan Trulli — Raytheon Technologies
Alkim Akyurtlu — UMass Lowell

Evaluation of Electromechanical Performance of a Flexible Hybrid Electronics Temperature Monitor
Zhi Dou — Binghamton University
Dylan Richmond — Binghamton University
Mark Schadt — Binghamton University
Mohammed Alhendi — Binghamton University
Rafael Tudela — Tapecon, Inc.
Mark Poliks — Binghamton University

Comparative Mechanical Behavior of Sn-Bi based Low Temperature Solder Alloys Under Different Pad Surface Finish and Pretest Aging Conditions
Sukshitha Achar P L — Purdue University
Colin Greene — Purdue University
Sean Lai — Purdue University
Radu Radulescu — Purdue University
Hannah Fowler — Purdue University
Nilesh Badwe — Indian Institute of Technology Roorkee
Raiyo Aspandiyar — Intel Corporation
John Blendell — Purdue University
Corol Handwerker — Purdue University
Ganesh Subbarayan — Purdue University

New Concentrated Photovoltaic (CPV) Module Architecture
Konan Kouame — University of Sherbrooke
Maxime Darnon — University of Sherbrooke
Gwenaelle Hamon — University of Sherbrooke

Characterization of Packaging, Electronic, and Photonic Materials at Cryogenic Temperatures Using a Multi-Angle Backscattering Mueller-Matrix Ellipsometer
Christopher Lewis — Auburn University
Jacob Marchio — Auburn University
Drew Sellers — Auburn University
Michael Hamilton — Auburn University

A Comparison of Dual-Band Wearable Metasurfaces
Adria Kajenski — University of Massachusetts, Lowell
Shahriar Khushrushahi — Notch, Inc.
Guinevere Strack — University of Massachusetts, Lowell
Alkim Akyurtlu — University of Massachusetts, Lowell

TrueAdapt™ - AI Based Maskless Patterning to Compensate for Die-Shift in Fan-Out Wafer Level Packaging
Golam Sabbir — University of California, Los Angeles
Subramanian S. Iyer — University of California, Los Angeles
Lenny Wu — University of California, Los Angeles
Henry Sun — University of California, Los Angeles

Optimization of Copper Filled Through Package Via Geometry to Minimize Thermal Induced Stresses at Glass - TPV interface in Borosilicate Glass Interposer
Krishna Bhavana Sivaraju — University of Texas, Arlington
Akhil R. K. Kalapala — Intel Corporation
Viswanatham Puligandla — University of Texas, Arlington
Rabin Bhandari — University of Texas, Arlington
Dereje Agonafer — University of Texas, Arlington

Control of Solder Microstructure Stimulated by Interface Condition of the UBM/Solder and Enhancement of Electromigration Reliability
Hariram Mohanram — University of Texas, Arlington
Geng Ni — University of Texas, Arlington
Yi-Ram Kim — University of Texas, Arlington
Choong-Un Kim — University of Texas, Arlington
Q. Chen — Texas Instruments, Inc.
Pat Thompson — Texas Instruments, Inc.

Fabrication of Flexible and Stretchable Highly Conductive Ag-PDMS Tri-Layer Interconnect and Its Integration Into Li-ion Pouch Cells
Mayukh Nandy — Arizona State University
Siyang Liu — Arizona State University
Hongbin Yu — Arizona State University

High-Density Array of 50 µm-Pitch Compressible MicroInterconnects in a Replaceable Integrated Chiplet Assembly
Michael Nieves Calderon — Georgia Institute of Technology
Shengtao Yu — Georgia Institute of Technology
Muhannad S. Bakir — Georgia Institute of Technology

Die Embedded Glass Interposer With Minimum Warpage for 5G/6G Applications
Xingchen Li — Georgia Institute of Technology
Xiaofan Jia — Georgia Institute of Technology
Joon Woo Kim — Georgia Institute of Technology
Kyoung-Sik Moon — Georgia Institute of Technology
Matthew Jordan — Sandia National Laboratories
Madhavan Swaminathan — Georgia Institute of Technology