Technical Program
Friday June 2nd
Session 41: Student Interactive Presentations
Committee: Interactive Presentations
Room: Palazzo Foyer
Session Co-Chairs:
Alan Huffman
SkyWater Technology
Email: [email protected]
Biao Cai
IBM Corporation
Email: [email protected]
Pavel Roy Paladhi
IBM Corporation
Email: [email protected]
Jin Yang
Intel Corporation
Email: [email protected]
Papers:
Grain Orientation and Prediction of Thermal Shock Fatigue of Sn-3Ag-0.5Cu Solder Joints for Fan-Out Wafer Level Packaging
Shuye Zhang – Harbin Institute of Technology
Xinyi Jing – Harbin Institute of Technology
Peng He – Harbin Institute of Technology
Kyung-Wook Paik – Korea Advanced Institute of Science and Technology
Copper-to-Copper Direct Bonding Process Using Current-Induced Enhancement Method
Byungkwan Kwak – Hanyang University
Jinhyun Lee – Hanyang University
Sanghwa Yoon – Hanyang University
Bongyoung Yoo – Hanyang University
Secure and Scalable Key Management for Waferscale Heterogeneous Integration
Yousef Safari – McGill University/University of California, Los Angeles
Pooya Aghanoury – University of California, Los Angeles
Subramanian S. Iyer – University of California, Los Angeles
Nader Sehatbakhsh – University of California, Los Angeles
A Method to Improve 3D Interconnections Resource Utilization and Reliability in Hybrid Bonding Process Considering the Effects on Signal Integrity
Ang Li – Shanghai Jiao Tong University
Jianfei Jiang – Shanghai Jiao Tong University
Qin Wang – Shanghai Jiao Tong University
Zizheng Dong – Shanghai Jiao Tong University
Shuya Ji – Shanghai Jiao Tong University
Xiulan Cheng – Shanghai Jiao Tong University
Yuhang Zhao – Shanghai Jiao Tong University
Wafer-Level Integration of Atomic Vapor Cell Chip with Thermal and RF Modules
Ziji Wang – Southeast University
Jintang Shang – Southeast University
Optimization of Embedded Manifold Cooling Characteristic Parameters for GaN HEMT
Dichen Lu – Chinese Academy of Science-Institute of Microelectronics
Yuxin Ye – Chinese Academy of Science-Institute of Microelectronics
Mei Wu – Xidian University
Ruiwen Liu – Chinese Academy of Science-Institute of Microelectronics
Xiangbin Du – Chinese Academy of Science-Institute of Microelectronics
Lihang Yu – Chinese Academy of Science-Institute of Microelectronics
jie Wang – Chinese Academy of Science-Institute of Microelectronics
Jingping Qiao – Chinese Academy of Science-Institute of Microelectronics
Ziyu Liu – Chinese Academy of Science-Institute of Microelectronics
Yulin Shi – Chinese Academy of Science-Institute of Microelectronics
Binbin Jiao – Chinese Academy of Science-Institute of Microelectronics
Yanmei Kong – Chinese Academy of Science-Institute of Microelectronics
Low Dk/Df Thermosetting Siloxane Hybrid Material for Microwave Communication Printed Circuit Board
Seung-Mo Kang – Korea Advanced Institute of Science and Technology
Byeong-Soo Bae – Korea Advanced Institute of Science and Technology
Optimization of Si PnC MEMS Nanowires for Ultra-Low Thermal Conductivity
Sunghyun Hwang – University of Florida
James D. Overmeyer – University of Florida
S. M. Enamul Hoque Yousuf – University of Florida
William N. Carr – Phononic MEMS, Inc.
Philip X.-L. Feng – University of Florida
Yong-Kyu Yoon – University of Florida
Rapid Formation of High-Strength Sintered Silver Joints with High Reliability
Xu Zhang – Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Pengli Zhu – Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Tao Zhao – Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Liang Xu – Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Rong Sun – Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Reference Thermal Chips for 2D and 3D Co-Packaging Process Development
Parnika Gupta – Tyndall National Institute-Photonic Packaging
Robert Bernson – Tyndall National Institute-Photonic Packaging
Noreen Nudds – Tyndall National Institute-Photonic Packaging
Sean Collins – Tyndall National Institute-Photonic Packaging
Kamil Gradkowski – Tyndall National Institute-Photonic Packaging
Padraic E. Morrissey – Tyndall National Institute-Photonic Packaging
Peter O' Brien – Tyndall National Institute-Photonic Packaging
Wideband Circularly Polarized FOWLP Antenna in Package for Satellite Communications
KaiBo Zheng – Institute of Microelectronics A*STAR
Mei Sun – Institute of Microelectronics A*STAR
Yongxin Guo – National University of Singapore
A High Precision Analysis Method Based on Thermal Test Chip for Thermal Characteristics of Thermal Interface Materials
Yulin Shi – Chinese Academy of Science-Institute of Microelectronics
Binbin Jiao – Chinese Academy of Science-Institute of Microelectronics
Qixing Hao – Chinese Academy of Science-Institute of Microelectronics
Yanmei Kong – Chinese Academy of Science-Institute of Microelectronics
Ruiwen Liu – Chinese Academy of Science-Institute of Microelectronics
Shichang Yun – Chinese Academy of Science-Institute of Microelectronics
Yuxin Ye – Chinese Academy of Science-Institute of Microelectronics
Lihang Yu – Chinese Academy of Science-Institute of Microelectronics
Xiangbin Du – Chinese Academy of Science-Institute of Microelectronics
Jie Wang – Chinese Academy of Science-Institute of Microelectronics
jingping Qiao – Chinese Academy of Science-Institute of Microelectronics
Dichen Lu – Chinese Academy of Science-Institute of Microelectronics
A Bionic Sweating Cooling Method for High Power Chip Based on Evaporation and Convection
Lihang Yu – Chinese Academy of Science-Institute of Microelectronics
Binbin Jiao – Chinese Academy of Science-Institute of Microelectronics
Yuxin Ye – Chinese Academy of Science-Institute of Microelectronics
Xiangbin Du – Chinese Academy of Science-Institute of Microelectronics
Yanmei Kong – Chinese Academy of Science-Institute of Microelectronics
Ruiwen Liu – Chinese Academy of Science-Institute of Microelectronics
Shichang Yun – Chinese Academy of Science-Institute of Microelectronics
Yulin Shi – Chinese Academy of Science-Institute of Microelectronics
Jie Wang – Chinese Academy of Science-Institute of Microelectronics
Dichen Lu – Chinese Academy of Science-Institute of Microelectronics
Ziyu Liu – Chinese Academy of Science-Institute of Microelectronics
Jingping Qiao – Chinese Academy of Science-Institute of Microelectronics
Generative Adversarial Network Based Adaptive Transmitter Modeling
Priyank Kashyap – North Carolina State University
Prasanth Prabu Ravichandiran – North Carolina State University
Dror Baron – North Carolina State University
Chau-Wai Wong – North Carolina State University
Tianfu Wu – North Carolina State University
Paul Franzon – North Carolina State University
FISHI: Fault Injection Detection in Secure Heterogeneous Integration via Power Noise Variation
Tao Zhang – University of Florida
Md Latifur Rahman – University of Florida
Hadi Mardani Kamali – University of Florida
Kimia Zamiri Azar – University of Florida
Mark Tehranipoor – University of Florida
Farimah Farahmandi – University of Florida
Preparation of Bubble-in-Bubble Structures for Atomic Sensors
Wenqi Li – Southeast University
Ziji Wang – Southeast University
Jintang Shang – Southeast University
RFID Based Vehicular Positioning System for Safe Driving Under Adverse Weather Conditions
Bhargav Avireni – Michigan State University
Yihang Chu – Michigan State University
Ethan Kepros – Michigan State University
Mauro Ettorre – Michigan State University
Premjeet Chahal – Michigan State University
Fingerprint Extrication with Near-Field Terahertz Time-Domain Spectroscopy (THz-TDS) for IC Hardware Assurance
Chengjie Xi – University of Florida
John True – University of Florida
William Henry Mitchell – University of Florida
Aslam Khan – University of Florida
Navid Asadizanjani – University of Florida
Additively Manufactured Near Chip Scale Interposers for DC and RF Applications
Emily Lamport – UMass Lowell
Andrew M. Luce – UMass Lowell
Yuri Piro – UMass Lowell
Susan Trulli – Raytheon Technologies
Alkim Akyurtlu – UMass Lowell
Evaluation of Electromechanical Performance of a Flexible Hybrid Electronics Temperature Monitor
Zhi Dou – Binghamton University
Dylan Richmond – Binghamton University
Mark Schadt – Binghamton University
Mohammed Alhendi – Binghamton University
Rafael Tudela – Tapecon, Inc.
Mark Poliks – Binghamton University
Comparative Mechanical Behavior of Sn-Bi Based Low Temperature Solder Alloys Under Different Pretest Aging Conditions
Sukshitha Achar P L – Purdue University
Colin Greene – Purdue University
Sean Lai – Purdue University
Radu Radulescu – Purdue University
Hannah Fowler – Purdue University
Nilesh Badwe – Indian Institute of Technology Roorkee
John Blendell – Purdue University
Corol Handwerker – Purdue University
Ganesh Subbarayan – Purdue University
New Triple-Junction Solar Cell Assembly Process for Concentrator Photovoltaic Applications
Konan Kouame – University of Sherbrooke
Maxime Darnon – University of Sherbrooke
Gwenaelle Hamon – University of Sherbrooke
Characterization of Packaging, Electronic, and Photonic Materials at Cryogenic Temperatures Using a Multi-Angle Backscattering Mueller-Matrix Ellipsometer
Christopher Lewis – Auburn University
Jacob Marchio – Auburn University
Drew Sellers – Auburn University
Michael Hamilton – Auburn University
A Comparison of Wearable Metasurfaces
Adria Kajenski – University of Massachusetts, Lowell
Shahriar Khushrushahi – Notch, Inc.
Guinevere Strack – University of Massachusetts, Lowell
Alkim Akyurtlu – University of Massachusetts, Lowell
TrueAdapt™ - AI Based Maskless Patterning to Compensate for Die-Shift in Fan-Out Wafer Level Packaging
Golam Sabbir – University of California, Los Angeles
Subramanian S. Iyer – University of California, Los Angeles
Lenny Wu – University of California, Los Angeles
Henry Sun – University of California, Los Angeles
Krutikesh Sahoo – University of California, Los Angeles
Guangqi Ouyang – University of California, Los Angeles
Die Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications
Xingchen Li – Georgia Institute of Technology
Xiaofan Jia – Georgia Institute of Technology
Joon Woo Kim – Georgia Institute of Technology
Kyoung-Sik Moon – Georgia Institute of Technology
Matthew Jordan – Sandia National Laboratories
Madhavan Swaminathan – Georgia Institute of Technology
