Technical Program

Session 40: Interactive Presentations 4
Committee: Interactive Presentations

Session Co-Chairs:

Mark Poliks
Binghamton University
[email protected]
Rao Bonda
Amkor Technology
[email protected]
Kristina Young-Fisher
GLOBAL FOUNDRIES
[email protected]

Papers:

Ultra-High Conductivity Interconnects for 77K CMOS Using Heterogeneous Integration
Golam Sabbir - University of California, Los Angeles
Subramanian S. Iyer - University of California, Los Angeles

Functional Demonstration of < 0.4 pJ/bit, 9.8 µm Fine-Pitch Dielet-to-Dielet Links for Advanced Packaging Using Silicon Interconnect Fabric
Krutikesh Sahoo - University of California, Los Angeles
Uneeb Rathore - University of California, Los Angeles
SivaChandra Jangam - University of California, Los Angeles
Tri Nguyen - University of California, Los Angeles
Dejan Markovic - University of California, Los Angeles
Subramanian Iyer - University of California, Los Angeles

Integration of High Performance GaN LEDs for Communication Systems and Smart Society
Zeinab Shaban - Tyndall National Institute
Mehrdad Saei - Tyndall National Institute
Brian Corbett - Tyndall National Institute
Zhi Li - Tyndall National Institute

Low Temperature Metal-to-Metal Direct Bonding in Atmosphere Using Highly (111) Oriented Nanotwinned Silver Interconnects
Ching-Yao Cheng - National Tsing Hua University
Po-Hsien Wu - National Tsing Hua University
Leh-Ping Chang - National Tsing Hua University
Fan-Yi Ouyang - National Tsing Hua University

Scalable through Mold Interconnection Realization for Advanced Fan Out Wafer Level Packaging Applications
Aurélia Plihon - CEA-LETI
Edouard Déschaseaux - CEA-LETI
Rémi Franiatte - CEA-LETI
Jérome Dechamp - CEA-LETI
Simon Vaudaine - CEA-LETI
Jennifer Guillaume - CEA-LETI
Catherine Brunet-Manquat - CEA-LETI
Stéphane Moreau - CEA-LETI
Perceval Coudrain - CEA-LETI

A Hybrid Bonding Interconnection with a Novel Low Temperature Bonding Polymer System
Yu-Min Lin - Industrial Technology Research Institute
Po-Chih Chang - Industrial Technology Research Institute
Wei-Lan Chiu - Industrial Technology Research Institute
Tao-Chih Chang - Industrial Technology Research Institute
Hsiang-Hung Chang - Industrial Technology Research Institute
Baron Huang - Brewer Science, Inc.
Chia-Hsin Lee - Brewer Science, Inc.
Mei Dong - Brewer Science, Inc.
Duo Tsai - Brewer Science, Inc.
Chang-Chun Lee - National Tsing Hua University
Kuan-Neng Chen - National Yang Ming Chiao Tung University

Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
Frank Libsch - IBM Corporation
Hiroyuki Mori - IBM Corporation
Xiaoxiong Gu - IBM Corporation

Chiplets Integrated Solution with FO-EB Package in HPC and Networking Application
Po Yuan (James) Su - Siliconware Precision Industries Co., Ltd.
David Ho - Siliconware Precision Industries Co., Ltd.
Jacy Pu - Siliconware Precision Industries Co., Ltd.
Yu Po Wang - Siliconware Precision Industries Co., Ltd.

Effect of Isothermal Aging on the Properties of In-48Sn and In-Sn-8Cu Alloys
Duy Le Han - Osaka University
Hiroaki Tatsumi - Osaka University
Fupeng Huo - Osaka University
Hiroshi Nishikawa - Osaka University

Ag Die-Attach Paste Modified by WC Additive for High-Temperature Stability Enhancement
Yang Liu - Osaka University
Chuantong Chen - Osaka University
Minoru Ueshima - Daicel Corporation
Takeshi Sakamoto - Daicel Corporation
Takuya Naoe - Osaka University
Hiroshi Nishikawa - Osaka University
Katsuaki Suganuma - Osaka University

PSI Design Solutions for High-Speed Die-to-Die Interface in Chiplet Applications
Taeyun Kim - Samsung Electronics Co., Ltd.
Sungwook Moon - Samsung Electronics Co., Ltd.
Chanmin Jo - Samsung Electronics Co., Ltd.
Seungki Nam - Samsung Electronics Co., Ltd.
Yongho Lee - Samsung Electronics Co., Ltd.

Thermal Compression Cu-Cu Bonding Using Electroless Cu and the Evolution of Voids Within Bonding Interface
Ching-Han Huang - National Taiwan University
Po-Shao Shih - National Taiwan University
Jeng-Hau Huang - National Taiwan University
S.J. Gräfner - National Taiwan University
Yu-An Chen - National Taiwan University
C.R. Kao - National Taiwan University

Novel Zero Side-Etch Process for <1μm Package Redistribution Layers
Pratik Nimbalkar - Georgia Institute of Technology
Pragna Bhaskar - Georgia Institute of Technology
Christopher Blancher - Georgia Institute of Technology
Mohanalingam Kathaperumal - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

Printed Microwave Connector
Jotham Kasule - University of Massachusetts Lowell
Shokat GanjeheizadehRohani - University of Massachusetts Lowell
Mark Pothier - University of Massachusetts Lowell
Yuri Piro - University of Massachusetts Lowell
Alkim Akyurtlu - University of Massachusetts Lowell
Craig Armiento - University of Massachusetts Lowell

MaxQFP - A High Density QFP
Chu-Chung Stephen Lee - NXP Semiconductors
TuAnh Tran - NXP Semiconductors
Andrew Mawer - NXP Semiconductors
Glenn Daves - NXP Semiconductors
XS Pang - NXP Semiconductors
JZ Yao - NXP Semiconductors

Creep and Microstructure Evolutions in SAC305 Lead Free Solder Subjected to Different Thermal Exposure Profiles
S M Kamrul Hasan - Auburn University
Mohammad Al Ahsan - Auburn University
Jeffrey Suhling - Auburn University
Pradeep Lall - Auburn University

Modeling of Cu-Cu Thermal Compression Bonding
Kai-Cheng Shie - National Yang Ming Chiao Tung University
Dinh-Phuc Tran - National Yang Ming Chiao Tung University
A. M. Gusak - Cherkasy National University
K. N. Tu - City University of Hong Kong
Hung-Che Liu - National Yang Ming Chiao Tung University
Chih Chen - National Yang Ming Chiao Tung University

Mechanical Properties and Microstructures of Cu/In-48Sn Alloy/Cu with Low Temperature TLP Bonding
DongGil Kang - Sungkyunkwan University
KyungDeuk Min - Sungkyunkwan University
Kyung-Yeol Kim - Sungkyunkwan University
HakSan Jeong - Sungkyunkwan University
Eun Ha - Sungkyunkwan University
Seung-Boo Jung - Sungkyunkwan University

Novel Pressure-Assist and Pressure-Less Silver Sintering Paste for SiC Power Device Attachment on Lead Frame Based Package
Leong Ching Wai - Institute of Microelectronics (IME), A*STAR
Kazunori Yamamoto - Institute of Microelectronics (IME), A*STAR
Gongyue Tang - Institute of Microelectronics (IME), A*STAR
Jacob Jordan Soh - Institute of Microelectronics (IME), A*STAR

Modeling High-Frequency and DC Path of Embedded Discrete Capacitor Connected by Double-Side Terminals with Multi-layered Organic Substrate and RDL Based Fan-Out Package
Heeseok Lee - Samsung Electronics Co., Ltd.
Kyojin Hwang - Samsung Electronics Co., Ltd.
Henry Kwon - Samsung Electronics Co., Ltd.
Jisoo Hwang Jisoo Hwang - Samsung Electronics Co., Ltd.
Junso Pak - Samsung Electronics Co., Ltd.
Ju Yeon Choi - Samsung Electronics Co., Ltd.

Characterization of Low Loss Dielectric Materials for High-Speed and High-Frequency Applications
ZN Lee - Unimicron Technology Corporation
John Lau - Unimicron Technology Corporation
CT Ko - Unimicron Technology Corporation
Tim Xia - Unimicron Technology Corporation
Eagle Lin - Unimicron Technology Corporation
Henry Yang - Unimicron Technology Corporation
Bruce Lin - Unimicron Technology Corporation
Tony Peng - Unimicron Technology Corporation
Leo Chang - Unimicron Technology Corporation
Jia Chen - Unimicron Technology Corporation
Yi-Hsiu Fang - Unimicron Technology Corporation

Evaluation on Bonding Reliability of SAC305/Sn-57.5Bi-0.4Ag BGA Solder Joints with Drop Impact Test
Geunsik Oh - Sungkyunkwan University
Kyung Deuk Min - Sungkyunkwan University
Eun Ha - Sungkyunkwan University
Jun Ho Jang - Sungkyunkwan University
Seung-Boo Jung - Sungkyunkwan University

High Throughput Void-Free Soldering with Pneumatic Reflow Method in Lead-Free Solder Die Attach
Huan-Ping Su - Ableprint Technology Co., Ltd.
Chun-Cheng Lee - Shenmao Technology Co., Ltd.
Auger Horng - Ableprint Technology Co., Ltd.

Influence of Prepreg Material Properties on Printed Circuit Board (PCB) Stack-up
Tomin Liu - Western Digital
Mutharasu Devarajan - Western Digital