Technical Program
Thursday June 1st
Session 40: Interactive Presentations 4
Committee: Interactive Presentations
Room: In front of Palazzo D & E
Session Co-Chairs:
Mark Eblen
Kyocera International SC
Email: [email protected]
Kuo-Ning Chiang
National Tsing Hua University
Email: [email protected]
Jeffrey Lee
iST-Integrated Service Technology, Inc.
Email: [email protected]
Karan Bhangaonkar
Intel Corporation
Email: [email protected]
Papers:
Simulation of Solder Crack Phenomenon in Molding Process
Tzu Chieh Chien – Advanced Semiconductor Engineering, Inc.
Shih Kun Lo – Advanced Semiconductor Engineering, Inc.
Zong Yuan Li – Advanced Semiconductor Engineering, Inc.
Yen Hua Kuo – Advanced Semiconductor Engineering, Inc.
Ming Shaw Shy – Advanced Semiconductor Engineering, Inc.
Hui Chung Liu – Advanced Semiconductor Engineering, Inc.
Lu Ming Lai – Advanced Semiconductor Engineering, Inc.
Kuang Hsiung Chen – Advanced Semiconductor Engineering, Inc.
Automated Solder Joint Failure Mode Analysis Based on Dry and Pry Image Processing
Yinan Lu – Western Digital Corporation
Chun-Sean Lau – Western Digital Corporation
Zhi Zhang Koh – Western Digital Corporation
Chaolun Zheng – Western Digital Corporation
Bo Yang – Western Digital Corporation
Embedded Micro-Pin Fin Heat Sink of Two-Phase Liquid Cooling for High Heat Flux 3D ICs
Huicheng Feng – Institute of Microelectronics A*STAR
Gongyue Tang – Institute of Microelectronics A*STAR
Xiaowu Zhang – Institute of Microelectronics A*STAR
Boon Long Lau – Institute of Microelectronics A*STAR
Ming Chinq Jong – Institute of Microelectronics A*STAR
Keng Yuen Jason Au – Institute of Microelectronics A*STAR
King Jien Chui – Institute of Microelectronics A*STAR
Jing Lou – Institute of High Performance Computing A*STAR
Hongying Li – Institute of High Performance Computing A*STAR
Duc Vinh Le – Institute of High Performance Computing A*STAR
Effect of Conformal Coating on Solder Joint Reliability in Automotive Applications
Isaac Bower – Rivian Automotive, Inc.
Theo Frot – Rivian Automotive, Inc.
Sara Najafian – Rivian Automotive, Inc.
Ed Camacho – Rivian Automotive, Inc.
Michael Li – Rivian Automotive, Inc.
Bryan Neal – Rivian Automotive, Inc.
Miguel Pacheco – Rivian Automotive, Inc.
Warpage Estimation of Panel-Level Package from Panel to Strip by Using Multi-Scaling Sub-Modeling Technique
Chang-Chun Lee – National Tsing Hua University
Chi-Wei Wang – National Tsing Hua University
Che-Pei Chang – National Tsing Hua University
Jui-Chang Chuang – National Tsing Hua University
A Thermally Friendly Bonding Scheme for 3D System Integration
Gordon Kuo – Taiwan Semiconductor Manufacturing Company, Ltd.
J. Y. Chen – Taiwan Semiconductor Manufacturing Company, Ltd.
C. C. Hsieh – Taiwan Semiconductor Manufacturing Company, Ltd.
C. J. Lee – Taiwan Semiconductor Manufacturing Company, Ltd.
Jason Wu – Taiwan Semiconductor Manufacturing Company, Ltd.
James Cui – Taiwan Semiconductor Manufacturing Company, Ltd.
Y. L. Kuo – Taiwan Semiconductor Manufacturing Company, Ltd.
C. H. Tung – Taiwan Semiconductor Manufacturing Company, Ltd.
KC Yee – Taiwan Semiconductor Manufacturing Company, Ltd.
Doug Yu – Taiwan Semiconductor Manufacturing Company, Ltd.
Effects of Twin Boundary and Precipitates on Board Level Reliability in Sn-Ag-Cu (SAC) Solder Joints Through EBSD Analysis
DalJin Yoon – SK Hynix, Inc.
Byoungdo Lee – SK Hynix, Inc.
Jihye Kim – SK Hynix, Inc.
Sungho Hyun – SK Hynix, Inc.
Gyujei Lee – SK Hynix, Inc.
Kangwook Lee – SK Hynix, Inc.
Optimization of 2.2D Underfill Process by Novel Methodology and Direct Observation of Capillary Underfill Process
Chia-Peng Sun – CoreTech System (Moldex3D)
Yu-En Liang – CoreTech System (Moldex3D)
Dyi-Chung Hu – SiPlus Co., Ltd.
Er-Hao Chen – SiPlus Co., Ltd.
Jeffrey ChangBing Lee – iST-Integrated Service Technology, Inc.
Srikar Vallury – Moldex3D Northern America, Inc.
Reliability in Selective Thinning Technology of Solder Resist for New IC Substrate Architecture
Yuya Suzuki – Taiyo Ink Mfg. Co., Ltd.
Yuji Toyoda – Mitsubishi Paper Mills Ltd.
Simulation, Verification, and Prediction of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-Attach Applications
Xinyue Wang – Fudan University
Zhoudong Yang – Fudan University
Guoqi Zhang – Delft University of Technology
Jing Zhang – Heraeus Materials Technology Shanghai Ltd.
Pan Liu – Fudan University
Thermal Characterization and Management of GaN-on-SiC High Power Amplifier MMIC
Yong Han – Institute of Microelectronics A*STAR
Gongyue Tang – Institute of Microelectronics A*STAR
Boon Long Lau – Institute of Microelectronics A*STAR
A Thin-Film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments
Romina Sattari – Delft University of Technology
Henk van Zeijl – Delft University of Technology
GuoQi Zhang – Delft University of Technology
Life-Prediction of SAC305/Bi-Based Hybrid Solder Joint Considering Bi-Diffused Layers With Gradual Bi Concentrations
Yongrae Jang – University of Maryland
Hak-Sung Kim – Hanyang University
Bongtae Han – University of Maryland
Thermal-Mechanical-Electrical Co-Design of Fan-Out Panel-Level SiC MOSFET Packaging With Multi-Objective Optimization Algorithm
Wei Chen – Fudan University
Xuyang Yan – Fudan University
Mesfin S. Ibrahim – Hong Kong Polytechnic University
Jing Jiang – Sky Chip Interconnection Technology Co., Ltd.
Xuejun Fan – Lamar University
Guoqi Zhang – Delft University of Technology
Jiajie Fan – Fudan University
SU8 Out of Plane Stress Control Via Design of Experiment and Machine Learning
Ziqi Jia – University of Florida
Shuyu Shi – University of Florida
Yong-Kyu Yoon – University of Florida
Mold Flow Simulation on Wire Sweep for Two-Stack NAND BGA Package
Hengxu Yu – Western Digital Corporation
Yangming Liu – Western Digital Corporation
Shenghua Huang – Western Digital Corporation
Bo Yang – Western Digital Corporation
Ning Ye – Western Digital Corporation
Assessment Methods for the Characterization of Flux Material Systems Toward Water Absorption
Quang-Duc Pham – Robert Bosch GmbH
Norbert Holle – Robert Bosch GmbH
Juergen Wilde – University of Freiburg
Optimization of the Cu Microstructure to Improve Cu-to-Cu Direct Bonding for 3D Integration
Ralf Schmidt – Atotech (MKS Instruments)
Christian Schwarz – Atotech (MKS Instruments)
Addressing Sub-Micron Thermal Warpage: Industrial Application
Safia Benkoula – STMicroelectronics
Rodolfo Cruz – INSIDIX
Pierre Vernhes – INSIDIX
Long-Term Reliability Evaluation on Single-Phase Immersion Cooling Based Server With Electronic Fluorinated Liquid
Yangfan Zhong – Alibaba Group
Fangzhi Wen – Alibaba Group
Haifeng Gong – Intel Corporation
Rui Guo – Alibaba Group
XiaoPeng Li – Alibaba Group
Dan Liu – Alibaba Group
YongBao He – Alibaba Group
Effect of Ceramic Filler in Epoxy Mold Compound on Thermomechanical Property of FOWLP
Taejoon Noh – Sungkyunkwan University
Haksan Jeong – Sungkyunkwan University
Seung-boo Jung – Sungkyunkwan University
ARTSim: A Robust Thermal Simulator for Heterogeneous Integration Platforms
Yousef Safari – McGill University
Adam Corbier – McGill University
Dima Al Saleh – McGill University
Boris Vaisband – McGill University
Atomistic Simulation Analysis of Plasma Surface Activation in Wafer-to-Wafer Oxide Fusion Bonding
Hojin Kim – TEL Technology Center, America, LLC
Yu-Hao Tsai – TEL Technology Center, America, LLC
Satohiko Hoshino – TEL Technology Center, America, LLC
Ilseok Son – TEL Technology Center, America, LLC
Kaoru Maekawa – TEL Technology Center, America, LLC
Peter Biolsi – TEL Technology Center, America, LLC
Sitaram Arkalgud – TEL Technology Center, America, LLC
Inorganic Capping Layers in Advanced Photosensitive Polymer Based RDL Processes: Processing and Reliability
Nelson Pinho – imec
Emmanuel Chery – imec
Ritwik Bhatia – Veeco
Ganesh Sundaram – Veeco
John Slabbekoorn – imec
Mikhail Krishtab – imec
Andy Miller – imec
Eric Beyne – imec
A Combined Simulation and Experimental Study on Cracking and Delamination Behavior at the Cu/Polyimide Interface of RDLs in Chiplet Package Subjected to Thermos-Mechanical Loads
Bin Chen – South China University of Technology
Guang-Chao Lyu – South China University of Technology
Hong-Guang Wang – South China University of Technology
Long Zheng – South China University of Technology
Yun-Kai Deng – South China University of Technology
Xin-Ping Zhang – South China University of Technology
Evolution of the Creep Response of SAC+Bi Lead Free Solders Subjected to Various Thermal Exposures
Mohammad Al Ahsan – Auburn University
S. M. Kamrul Hasan – Auburn University
Jeffrey Suhling – Auburn University
Pradeep Lall – Auburn University
Modeling Grain Size Effects on Deformation Behavior of SAC Solder Joints
Debabrata Mondal – Auburn University
Jeffrey Suhling – Auburn University
Pradeep Lall – Auburn University
Reliability Study on High Performance Photo Imageable Dielectric for Advanced Package
Okseon Yoon – Samsung Electronics Co., Ltd.
Jinyoung Kim – Samsung Electronics Co., Ltd.
Kiseok Kim – Samsung Electronics Co., Ltd.
Seonghyun Yoo – Samsung Electronics Co., Ltd.
Jihye Shim – Samsung Electronics Co., Ltd.
Suchang Lee – Samsung Electronics Co., Ltd.
Hyoeun Lee – Samsung Electronics Co., Ltd.
Sueryeon Kim – Samsung Electronics Co., Ltd.
A Novel Indium Metal Thermal Interface Material and Package Design Configuration to Enhance High-Power Advanced Si Package Thermal Performance
Kuo-Chin Chang – Taiwan Semiconductor Manufacturing Company, Ltd.
Mirng-Ji Lii – Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Min Wang – Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Chang Wang – Taiwan Semiconductor Manufacturing Company, Ltd.
Bang-Li Wu – Taiwan Semiconductor Manufacturing Company, Ltd.
High Temperature Storage of Cu-Cu Joints Fabricated by Highly (111)-Oriented Nanotwinned Cu
Shih-Chi Yang – National Yang Ming Chiao Tung University
Chih Chen – National Yang Ming Chiao Tung University
Ionic Sensor Package Design for the Survivability in Drop-Impact During Deployment
Pengcheng Yin – Binghamton University
Jong Hwan Ha – Binghamton University
Junbo Yang – Binghamton University
Yangyang Lai – Binghamton University
Seungbae Park – Binghamton University
Biju Jacob – GE Research
Arun Gowda – GE Research
Time-Dependent Bulk Behavior of Partially Cured Epoxy Molding Compound
Sukrut Prashant Phansalkar – University of Maryland, College Park
Bongtae Han – University of Maryland, College Park
High-Performance, Multilayer Copper-Graphene Micro-Foam Wicks for Vapor Chambers
James Moss – Georgia Institute of Technology
Vanessa Smet – Georgia Institute of Technology
Antonia Antoniou – Georgia Institute of Technology
Module, Antenna, and Package Design Considerations for mm-Scale IoT devices
Arun Paidimarri – IBM Research
Duixian Liu – IBM Research
Christian Baks – IBM Research
Bodhisatwa Sadhu – IBM Research
Alberto Valdes-Garcia – IBM Research
9W/cm²/K Heat Transfer Coefficient Vapor Chamber for HPC Server Cooling Applications
Takashi Funakoshi – Fujikin, Inc.
Hiroyoki Ryoson – Tokyo Institute of Technology
Kosuke Suzuki – Tokyo Institute of Technology
Katsunori Komehana – Fujikin, Inc.
Tomoji Nakamura – Tokyo Institute of Technology
Takayuki Ohba – Tokyo Institute of Technology
