Technical Program

Program Sessions: Wednesday May 31st 9:30 AM – 12:35 PM

Session 4: Assembly and Manufacturing Process Enhancement
Committee: Assembly and Manufacturing Technology
Room: Mediterranean 1

Session Co-Chairs:

Habib Hichri
Ajinomoto Fine-Techno USA Corporation
Email: [email protected]

Ralph Zoberbier
Evatec AG
Email: [email protected]


1. Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application
Henry Antony Martin – Chip Integration Technology Center/Delft University of Technology
Marcia Reintjes – Mintres BV
Dave Reijs – Chip Integration Technology Center
Sander Dorrestein – Chip Integration Technology Center
Martien Kengen – Chip Integration Technology Center
Sebastien Libon – Chip Integration Technology Center
Edsger Smits – Chip Integration Technology Center
Xiao Tang – Mintres BV
Marco Koelink – Chip Integration Technology Center
Rene Poelma – Delft University of Technology
Willem Van Driel – Delft University of Technology
GuoQi Zhang – Delft University of Technology

2. Optimum Rc Control and Productivity Boost in Wafer-Level Packaging Enabled by High-Throughput UBM/RDL Technology
Carl Drechsel – Evatec AG
Patrik Carazzetti – Evatec AG
Carl Wang – Evatec AG, Taiwan
Kay Viehweger – Fraunhofer IZM
Juergen Weichart – Evatec AG
Ewald Strolz – Evatec AG

3. Assembly Challenges and Approaches for 2.5D Chiplet Based System
Sharon Pei Siang Lim – Institute of Microelectronics A*STAR
Mihai Dragos Rotaru – Institute of Microelectronics A*STAR
Wen Wei Seit – Institute of Microelectronics A*STAR
Hsiao Hsiang Yao – Institute of Microelectronics A*STAR

4. A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning
Sathya Raghavan – IBM Research
Aakrati Jain – IBM Research
Prabudhya Roy Chowdhury – IBM Research
Katsuyuki Sakuma – IBM Research
Roman Doll – ASMPT ALSI B.V.
Kees Biesheuvel – ASMPT ALSI B.V.
Faysal Boughorbel – ASMPT ALSI B.V.
Jeroen Van Borkulo – ASMPT ALSI B.V.
Mark Mueller – ASMPT ALSI B.V.

5. Maskless Lithography for High-Density Package Redistribution Layers
Prahalad Murali – Georgia Institute of Technology
Pratik Nimbalkar – Georgia Institute of Technology
Mohanalingam Kathaperumal – Georgia Institute of Technology
Mark D. Losego – Georgia Institute of Technology
Rao Tummala – Georgia Institute of Technology
Madhavan Swaminathan – Georgia Institute of Technology

6. An Additive Approach to Embed Chips in a Metallic Matrix Infused PCB
Roberto Aga – KBR, Inc./U.S. Air Force Research Laboratory
Fahima Ouchen – KBR, Inc./U.S. Air Force Research Laboratory
Rachel Aga – Wright State University
Carrie Batsch – AFRL
Emily Heckman – AFRL

7. Micro Transfer Printing Various Thickness Components Directly from Dicing Tape
Kevin Oswalt – X-Celeprint Ltd.
David Gomez – X-Celeprint Ltd.
Tanya Moore – X-Celeprint Ltd.
Prasanna Ramaswamy – X-Celeprint Ltd.
Alin Fecioru – X-Celeprint Ltd.