Technical Program

Session 39: Interactive Presentations 3
Committee: Interactive Presentations

Session Co-Chairs:

Patrick Thompson
Texas Instruments, Inc.
[email protected]
Pradeep Lall
Auburn University
[email protected]
Michael Mayer
University of Waterloo
[email protected]

Papers:

The Investigation of Dry Plasma Technology in Each Step for the Fabrication of High Performance Redistribution Layer
Daisuke Hironiwa - ULVAC, Inc.
Haw Wen Chen - ULVAC, Inc.
Yasuhiro Morikawa - ULVAC, Inc.
Takashi Kurimoto - ULVAC, Inc.
Ryuichiro Kamimura - ULVAC, Inc.

Chip Last Fan-Out Chip on Substrate (FOCoS) Solution for Chiplets Integration
Teck-Chong Lee - ASE Group
Shu-Han Yang - ASE Group
Hsin-Yi Wu - ASE Group
You-Jun Lin - ASE Group

Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications
Guilian Gao - Xperi Corporation
Laura Mirkarimi - Xperi Corporation
Gill Fountain - Xperi Corporation
Dominik Suwito - Xperi Corporation
Jeremy Theil - Xperi Corporation
Thomas Workman - Xperi Corporation
Cyprian Uzoh - Xperi Corporation
Bongsub Lee - Xperi Corporation
KM Bang - Xperi Corporation
Gabe Guevara - Xperi Corporation

Yield Improvement in Chip to Wafer Hybrid Bonding
Ser Choong Chong - Institute of Microelectronics (IME), A*STAR
Cereno Daniel Ismael - Institute of Microelectronics (IME), A*STAR
Pei Siang Lim - Institute of Microelectronics (IME), A*STAR
Cheng Yi Shim - Institute of Microelectronics (IME), A*STAR
Wai Song Lai - Institute of Microelectronics (IME), A*STAR
Woon Leng Loh - Institute of Microelectronics (IME), A*STAR

Study of Parameter Tuning for the Curing Condition on ABF Type for Large FCBGA Package
Rick Ye - Siliconware Precision Industries Co., Ltd.
Eric Chen - Siliconware Precision Industries Co., Ltd.
Wen-Yu Teng - Siliconware Precision Industries Co., Ltd.
Andrew Kang - Siliconware Precision Industries Co., Ltd.
Yu-Po Wang - Siliconware Precision Industries Co., Ltd.

Next Gen Laser-Assisted Bonding (LAB) Technology
SeokHo Na - Amkor Technology
MinHo Gim - Amkor Technology
ChoongHoe Kim - Amkor Technology
DongHyeon Park - Amkor Technology
DongSu Ryu - Amkor Technology
DongJoo Park - Amkor Technology
JinYoung Khim - Amkor Technology

Swelling Analysis of Negative-tone Photosensitive Dielectric Materials for Fine Pitch Redistribution Layers
Daiki Yukimori - TAIYO HOLDINGS Co., Ltd.
Go Inoue - TAIYO HOLDINGS Co., Ltd.
Nobuhiro Ishikawa - TAIYO HOLDINGS Co., Ltd.
Toshiyuki Ogata - TAIYO HOLDINGS Co., Ltd.

RF Characterization in Range of 18GHz in Fan-Out Package Structure Molded by Epoxy Molding Compound with EMI Shielding Property
Eun Ha - Sungkyunkwan University
Haksan Jeong - Sungkyunkwan University
Kyung Deuk Min - Sungkyunkwan University
Kyung-Yeol Kim - Sungkyunkwan University
Dong-Gil Kang - Sungkyunkwan University
Seung-Boo Jung - Sungkyunkwan University

Plasma Chamber Environment Control to Enhance Bonding Strength for Wafer-to-Wafer Bonding Processing
Wooyoung Kim - Samsung Electronics Co., Ltd.
Yongin Lee - Samsung Electronics Co., Ltd.
Wonyoung Choi - Samsung Electronics Co., Ltd.
Kyeongbin Lim - Samsung Electronics Co., Ltd.
Bumki Moon - Samsung Electronics Co., Ltd.
Minwoo Rhee - Samsung Electronics Co., Ltd.

Study of Large Exposure Field Lithography for Advanced Chiplet Packaging
Hiromi Suda - CANON
Douglas Shelton - CANON
Hiroki Takada - CANON
Yoshio Goto - CANON
Kosuke Urushihara - CANON
Ken-Ichiro Shindoa - CANON

Epoxy Resin with Metal Complex Additives for Improved Reliability of Epoxy-Copper Joint
Jiaxiong Li - Georgia Institute of Technology
John Wilson - Georgia Institute of Technology
Dylan Cheung - Georgia Institute of Technology
Zhijian Sun - Georgia Institute of Technology
Kyoung-sik Moon - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology
Ching-Ping Wong - Georgia Institute of Technology

Wirebonding Based 3-D SiC IC Stacks for High Temperature Applications
Feng Li - University of Idaho
Srividya Raveendran - University of Idaho

Electrical Design and Modeling of Silicon Carbide Power Modules for Inverter Application
Vignesh Shanmugam Bhaskar - Institute of Microelectronics (IME), A*STAR
Jong Ming Chinq - Institute of Microelectronics (IME), A*STAR
Kazunori Yamamoto - Institute of Microelectronics (IME), A*STAR
Gongyue Tang - Institute of Microelectronics (IME), A*STAR

Reliability of Component Attachment Using ECA and LTS on Flexible Additively Printed Ink-Jet Circuits for Signal-Filtering in Wearable Applications
Pradeep Lall - Auburn University
Kartik Goyal - Auburn University
Jinesh Narangaparambil - Auburn University
Scott Miller - NextFlex National Manufacturing Institute

Micro-Spray with Silver Ink for Maskless Selective-Area EMI Shielding
Kisu Joo - Ntrium, Inc.
Kyu Jae Lee - Ntrium, Inc.
Jung Yoon Moon - Ntrium, Inc.
Yoon-Hyun Kim - Ntrium, Inc.
Jinhwan Chung - Ntrium, Inc.
Se Young Jeong - Ntrium, Inc.
Seung Jae Lee - Ntrium, Inc.

Embedded-IC Package Using Si-Interposer for mmWave Applications
Hyun-Beom Lee - Korea Electronics Technology Institute
Young-Gon Kim - LIG Nex1 Corporation
Wansik Kim - LIG Nex1 Corporation
Sosu Kim - Agency for Defense Development
Byung-Wook Min - Yonsei University
Jong-Min Yook - Korea Electronics Technology Institute

Carrier Systems for Collective Die-to-Wafer Bonding
Koen Kennes - Imec
Alain Phommahaxay - Imec
Alice Guerrero - Brewer Science, Inc.
Samuel Suhard - Imec
Pieter Bex - Imec
Steven Brems - Imec
Xiao Liu - Imec
Sebastian Tussing - Imec
Gerald Beyer - Imec
Eric Beyne - Imec

Superb Sinterability of the Cu Paste Consisting of Bimodal Size Distribution Cu Nanoparticles for Low-Temperature and Pressureless Sintering of Large-Area Die Attachment and the Sintering Mechanism
Bin Hou - South China University of Technology
Hai-Jun Huang - South China University of Technology
Chun-Meng Wang - South China University of Technology
Min-Bo Zhou - South China University of Technology
Xin-Ping Zhang - South China University of Technology

Reliability of Ag Bonding Wires and iCoated Variants from the Perspective of IMC Degradation and Correlation to Wire and Epoxy Molding Compound Material Properties Under Corrosive Environment
Randolph Flauta - Nexperia
April Joy Garete - Nexperia
Mark Luke Farrugia - Nexperia
Sreetharan Sekaran - Nexperia
Haibin Chen - Hong Kong University of Science and Technology

Design and Simulation to Reduce the Crosstalk of Ultra-Fine Line Width/Space in the Redistribution Layer(RDL)
ziyu Liu - Fudan University
Long Bai - Southwest University
Ziyuan Zhu - Southwest University
Lin Chen - Fudan University
Qingqing Sun - Fudan University

Influence of Tribo-Mechanical Characteristics of Advanced EN Coating for Electronic Packaging Enclosures
Muralidharan Sundararajan - Western Digital Corporation
Mutharasu Devarajan - Western Digital Corporation

Analysis on Optimal Chip Floorplanning Considering Various Types of Decoupling Capacitors in Package PDN
Jisoo Hwang - Samsung Electronics Co., Ltd.
James Jeong - Samsung Electronics Co., Ltd.
Heejung Choi - Samsung Electronics Co., Ltd.
Jun So Pak - Samsung Electronics Co., Ltd.
Heeseok Lee - Samsung Electronics Co., Ltd.
Minkyu Mike Kim - Samsung Electronics Co., Ltd.
Ilryong Kim - Samsung Electronics Co., Ltd.

Novel Polymer Design for Ultra-Low Stress Dielectrics
Matthias Koch - Merck KGaA
Jens Pradella - Merck KGaA
Gregor Larbig - Merck KGaA