Technical Program
Thursday June 1st
Session 39: Interactive Presentations 3
Committee: Interactive Presentations
Room: In front of Palazzo D & E
Session Co-Chairs:
Patrick Thompson
Texas Instruments, Inc.
Email: [email protected]
Amanpreet Kaur
Oakland University
Email: [email protected]
Frank Libsch
IBM Corporation
Email: [email protected]
Yoichi Taira
Keio University
Email: [email protected]
Papers:
Voltage Controlled Nanoscale Magnetic Devices for Non Volatile Memory and Scalable Quantum Computing
Jayasimha Atulasimha – Virginia Commonwealth University
Md Mahadi Rajib – Virginia Commonwealth University
Polymer Optical Waveguide Type 3-D MUX Device for Mode Division Multiplexing Links
Ryoto Ichinose – Keio University
Takumi Kowatari – Keio University
Takaaki Ishigure – Keio University
Extracting Anisotropic Permittivity of PCB Substrate From VNA Measurement on a Rectangular Stripline Resonator Loaded With a Via Array
Zhaoqing Chen – IBM Corporation
Hung Nguyen – IBM Corporation
Matteo Cocchini – IBM Corporation
Silicon Photonic Co-Packaging: Adhesive Dispense Challenge and Control
Paul Gond-Charton – IBM Corporation
Sebastien Gouin – IBM Corporation
Steve Pellerin – IBM Corporation
Richard Langlois – IBM Corporation
Patrick Jacques – IBM Corporation
Denis Blanchard – IBM Corporation
Eric Turcotte – IBM Corporation
Steve Whitehead – IBM Corporation
Elaine Cyr – IBM Corporation
Design of Single Miniaturized Dielectric Resonant Antenna for Millimeter Wave 5G Application
Chia-Chu Lai – Siliconware Precision Industries Co., Ltd.
Sam Lin – Siliconware Precision Industries Co., Ltd.
Teny Shih – Siliconware Precision Industries Co., Ltd.
Yu-Po Wang – Siliconware Precision Industries Co., Ltd.
Tom Tang – Siliconware Precision Industries Co., Ltd.
Mike Tsai – Siliconware Precision Industries Co., Ltd.
Ryan Chiu – Siliconware Precision Industries Co., Ltd.
Kevin Chang – Siliconware Precision Industries Co., Ltd.
Yu-Chang Dong – Siliconware Precision Industries Co., Ltd.
Inverse Prediction of Capacitor Multiphysics Dynamic Parameters Using Generative Model
Kart Leong Lim – Institute of Microelectronics A*STAR
Rahul Dutta – Institute of Microelectronics A*STAR
Mihai Rotaru – Institute of Microelectronics A*STAR
New Interconnection Technologies Based on Ni Nano-Particle and Ni Micro-Plating Bonding Method
Kohei Tatsumi – Waseda University
Keiko Koshiba – Waseda University
Yasunori Tanaka – Waseda University
Mayu Miyagawa – Waseda University
Xinguan Yu – Waseda University
Shun Furuya – Waseda University
Tomonori Iizuka – Waseda University
High-Performance Amplifier Package Design for Heterogeneous Integration on Si-Interposer
Teck Guan Lim – Institute of Microelectronics A*STAR
Lin Zhou – Institute of Microelectronics A*STAR
Haoran Chen – Institute of Microelectronics A*STAR
Eva Leong Ching Wai – Institute of Microelectronics A*STAR
Sasi Kumar Tippabhotla – Institute of Microelectronics A*STAR
Lin Ji – Institute of Microelectronics A*STAR
Gongyue Tang – Institute of Microelectronics A*STAR
Wei Jia Lu – DSO National Laboratories
Chee Heng Goh – DSO National Laboratories
Jun Wei Agnes Loh – DSO National Laboratories
Through-Silicon-Via Architecture of 3D Integration for Superconducting Quantum Computing Application
Jiexun Yu – Tsinghua University
Qian Wang – Tsinghua University
Yao Zheng – Tsinghua University
Changming Song – Tsinghua University
Junpeng Fang – Tsinghua University
Tiefu Li – Tsinghua University/Beijing Academy of Quantum Information Sciences
Haihua Wu – Beijing Academy of Quantum Information Sciences
Zheyao Wang – Tsinghua University
Jian Cai – Tsinghua University
Additive Manufacturing of Millimeter Wave Passive Circuits on Ultra-Thin Alumina Substrates
Ethan Kepros – Michigan State University
Yihang Chu – Michigan State University
Bhargav Avireni – Michigan State University
Brian Wright – Michigan State University
Premjeet Chahal – Michigan State University
Frequency Selective Surface (FSS) Based Antenna Array Design for Satellites Capable of All Four Polarizations
Lih-Tyng Hwang – National Sun Yat-Sen University
Ming-Yuan Huang – National Sun Yat-Sen University
Hung-Chih Lin – National Sun Yat-Sen University
Novel Low-Loss IC Substrate Material for 5G IC Packaging
Tomo Mugurma – Panasonic Industrial Devices Sales Company of America
Andy Behr – Panasonic Industrial Devices Sales Company of America
Tom Shin – Panasonic Industrial Devices Sales Company of America
Umehara Hiroaki – Panasonic Industry Co., Ltd.
Saeki Yuya – Panasonic Industry Co., Ltd.
Kishino Koji – Panasonic Industry Co., Ltd.
Deep Learning Based Refinement for Package Substrate Routing
Peng-Tai Huang – National Tsing Hua University
Tsubasa Koyama – National Tsing Hua University
Keng-Tuan Chang – Advanced Semiconductor Engineering, Inc.
Chih-Yi Huang – Advanced Semiconductor Engineering, Inc.
Chen-Chao Wang – Advanced Semiconductor Engineering, Inc.
Tsung-Yi Ho – National Tsing Hua University
Laser Integration on Photonic Integrated Circuit With High Alignment Accuracy for Data Transmission
Ting Ta Chi – Institute of Microelectronics A*STAR
Zhenyu Li – Institute of Microelectronics A*STAR
Nanxi Li – Institute of Microelectronics A*STAR
Hong Cai – Institute of Microelectronics A*STAR
Y. M. Tobing Landobasa – Institute of Microelectronics A*STAR
Haitao Yu – Institute of Microelectronics A*STAR
Senthilkumar Darshini – Institute of Microelectronics A*STAR
Jae Ok Yoo – Institute of Microelectronics A*STAR
Hwang Gilho – Institute of Microelectronics A*STAR
Jeroen Van Borkulo – Institute of Microelectronics A*STAR
Lennon Y. T. Lee – Institute of Microelectronics A*STAR
Wen Lee – Institute of Microelectronics A*STAR
Copper Nanowired Interconnection for Embedding Power Dies in PCB
Caio Cesar De Oliveira Mendes – Mitsubishi Electric R&D Centre Europe
Julien Morand – Mitsubishi Electric R&D Centre Europe
Vincent Bley – University of Toulouse-LAPLACE
Jean-Pascal Cambronne – University of Toulouse-LAPLACE
Guillaume Lefevre – Mitsubishi Electric R&D Centre Europe
High Density Photonic Reservoir Computing Using Optical Fiber and Polymer Waveguide
Hidetoshi Numata – IBM Research, Tokyo/IBM Corp., Japan
Toshiyuki Yamane – IBM Research, Tokyo/IBM Corp., Japan
Jean Heroux – IBM Systems/IBM Corp., Canada
Daiju Nakano – IBM Research, Tokyo/IBM Corp., Japan
Machine Learning Based PCB/Package Stack-Up Optimization for Signal Integrity
Wenchang Huang – Missouri University of Science and Technology
Jiahuan Huang – Missouri University of Science and Technology
Minseok Kim – Samsung Electronics Co., Ltd.
Bumhee Bae – Samsung Electronics Co., Ltd.
Subin Kim – Samsung Electronics Co., Ltd.
Chulsoon Hwang – Missouri University of Science and Technology
Self-Aligned Optical Connector Assembly on Polymer Waveguide Integrated Package Substrate for Co-Packaged Optics
Akihiro Noriki – National Institute of Advanced Industrial Science and Technology
Takeru Amano – National Institute of Advanced Industrial Science and Technology
Solder Paste Stamping Process Investigation for Heterogeneous Integration of III-V Lasers on a 300 mm Si Photonics Platform
Sarah Baranowski – SUNY Research Foundation
Javery Mann – SUNY Research Foundation
Lewis Carpenter – SUNY Research Foundation
Amit Dikshit – SUNY Research Foundation
Colin McDonough – SUNY Research Foundation
David Harame – SUNY Research Foundation
2.5D Silicon Photonics Interposer Flip Chip Attach
Pushkraj Tumne – Marvell Semiconductor, Inc.
Joseph Wang – Marvell Semiconductor, Inc.
Dwayne Shirley – Marvell Semiconductor, Inc.
Roberto Coccioli – Marvell Semiconductor, Inc.
A Study of the Design and Parameter Effects on System Level Characteristics of Advanced Fan-Out Wafer Level Package (FOWLP): Results from In-Situ Analysis
Kyoung-Lim Suk – Samsung Electronics Co., Ltd.
Jihwang Kim – Samsung Electronics Co., Ltd.
Suchang Lee – Samsung Electronics Co., Ltd.
Jaechoon Kim – Samsung Electronics Co., Ltd.
Wonkyung Choi – Samsung Electronics Co., Ltd.
Dongwook Kim – Samsung Electronics Co., Ltd.
Development of Electronic-Photonic 3D System in Package: Architecture, Integration, and Scaling
Jugal Kishore Bhandari – LightSpeed Photonics Pte Ltd
Venkata Ramana Pamidighantam – LightSpeed Photonics Pte Ltd
Divya Sri Rajeswari – LightSpeed Photonics Pte Ltd
Rohin Kumar Yeluripati – LightSpeed Photonics Pte Ltd
Additive Manufacturing of Strain Gages for High Temperature Application
Nicolas Delavault – CEA Tech Grand Est
Tanguy Lacondemine – CEA Tech Grand Est
Remy
Kalmar – CEA Tech Grand Est
Sofiane Achache – UTT LASMIS
Manuel Fendler – CEA Tech Grand Est
Frederic Sanchette – UTT LASMIS
Highly Compact and High Gain 2 x 2 Patch Array Antenna With Slotted Meanderline Loading
Hanna Jang – University of Florida
Payman Pahlavan – University of Florida
Yong-Kyu Yoon – University of Florida
Highly Energy Efficient and Electromagnetic Interference Immuned Coaxial Through-Substrate-Vias (cx-TSVs) for Millimeter Wave Applications
Saeyeong Jeon – University of Florida
Hae-In Kim – University of Florida
Yong-Kyu Yoon – University of Florida
Design of a Compact Size-Bridge Connected Multiband MIMO Antenna for Automotive 5G and DSRC Communications System
Mohammad Pervez – Oakland University
Amanpreet Kaur – Oakland University
A Fully Additive Fabrication Approach for Creating Small Microvia With Diameter < 10 µm Suitable for 3-D System-in-Package Integration
Roghayeh Imani – Lulea University of Technology
Sarthak Acharya – University of Oulu
Jussi Putaala – University of Oulu
Shailesh Chouhan – Lulea University of Technology
Juha Hagberg – University of Oulu
Sami Myllymaki – University of Oulu
Olli Nousiainen – University of Oulu
Heli Jantunen – University of Oulu
Jerker Delsing – Lulea University of Technology
The Performance and Reliability of Flexible Screen-Printed Multilayer Conductive Leads for Wearable Vital Sign Monitoring Devices
Kankanige Udara Somarathna – Binghamton University
Behnam Garakani – Binghamton University
Mohammed Alhendi – Binghamton University
Darshana Weerawarne – University of Colombo
Matthew Misner – GE Global Research
Andrew Burns – GE Global Research
Gurvinder Khinda – GE Global Research
Azar Alizadeh – GE Global Research
Mark Poliks – Binghamton University
First Demonstration of Die-Embedded Alumina Ribbon Ceramic (ARC) Packaging for 6G Wireless Applications
Joon Woo Kim – Georgia Institute of Technology
Nahid Aslani-Amoli – Georgia Institute of Technology
Fuhan Liu – Georgia Institute of Technology
Rajesh Vaddi – Corning, Inc.
Garima Nagar – Corning, Inc.
Madhavan Swaminathan – Georgia Institute of Technology
Security Robustness of Buried Power Rail Interconnect Technology: Modeling, Analysis and Countermeasures
Sirish Oruganti – University of Texas, Austin
Nishant Gupta – University of Texas, Austin
Sai Subrahmanya Teja Nibhanupudi – University of Texas, Austin
Meizhi Wang – University of Texas, Austin
Jaydeep Kulkarni – University of Texas, Austin
Intelligent Multi-Physics Design and Demonstration of Compact, Leadframe-Based SiC Power Modules for Transportation Electrification
Emanuel Torres Surillo – Georgia Institute of Technology
Christian Molina-Mangual – Georgia Institute of Technology
Vanessa Smet – Georgia Institute of Technology
