Technical Program
Wednesday May 31st
Session 38: Interactive Presentations 2
Committee: Interactive Presentations
Room: In front of Palazzo D & E
Session Co-Chairs:
Rao Bonda
Amkor Technology, Inc.
Email: [email protected]
Mohammad Enamul Kabir
Intel Corporation
Email: [email protected]
Saikat Mondal
Intel Corporation
Email: [email protected]
Donna M. Noctor
Nokia Corporation
Email: [email protected]
Papers:
Advanced Overlay Metrology for CIS Bonding Applications
Florent Dettoni – STMicroelectronics
Yoav Grauer – KLA Corporation
Emilie DELOFFRE – STMicroelectronics
Shlomo Eisenbach – KLA Corporation
Motti Penia – KLA Corporation
Arkadi Simkin – KLA Corporation
Dror Elka – KLA Corporation
Avner Safrani – KLA Corporation
Marco Polli – KLA Corporation
Francesco De Paola – KLA Corporation
Implementation of New Robustness Assessment Methodology for Crack Stop Constructions by Using Dedicated Binning in Automated Optical Inspection
Maria Heidenblut – Infineon Technologies AG
Michael Goroll – Infineon Technologies AG
Comparable Study for Redistribution Layers in FO POP RDL First and Last (Fan-Out Package on Package)
Kuei Hsiao Kuo – SPIL
Derrick Tai – SPIL
Sam Peng – SPIL
Feng Lung Chien – SPIL
Hybrid Bonding Utilizing Molding Compound and Dielectric Systems
Yuki Imazu – Resonac Corporation
Kazuyuki Mitsukura – Resonac Corporation
A Short Time and N2-sinterable Cu Sinter Paste With Highly Dispersed Submicron Cu Particles
Takaaki Eyama – Kao Corporation
Shuichi Inaya – Kao Corporation
Ukyo Suzuki – Kao Corporation
Masafumi Takesue – Kao Corporation
A Novel and Simple Method of Low Temperature, Low Process Time, Pressureless Interconnection for 3D Packaging
Jeng-Hau Huang – National Taiwan University
Po-Shao Shih – National Taiwan University
Chang-Hsien Shen – National Taiwan University
Vengudusamy Renganathan – National Taiwan University
Simon Johannes Graefner – National Taiwan University
Yu-Chun Lin – National Taiwan University
Chin-Li Kao – Advanced Semiconductor Engineering, Inc.
Yung-Sheng Lin – Advanced Semiconductor Engineering, Inc.
Yun-Ching Hung – Advanced Semiconductor Engineering, Inc.
Chun-Wei Chiang – Advanced Semiconductor Engineering, Inc.
C. Robert Kao – National Taiwan University
50 nm Overlay Accuracy for Wafer-to-Wafer Bonding by High-Precision Alignment Technologies
Hajime Mitsuishi – Nikon Corporation
Hiroshi Mori – Nikon Corporation
Hidehiro Maeda – Nikon Corporation
Mikio Ushijima – Nikon Corporation
Atsushi Kamashita – Nikon Corporation
Masashi Okada – Nikon Corporation
Masanori Aramata – Nikon Corporation
Takashi Shiomi – Nikon Corporation
Shinya Sakamoto – Nikon Corporation
Kishou Takahata – Nikon Corporation
Tomohiro Chiba – Nikon Corporation
Minoru Fukuda – Nikon Corporation
Masahiro Kanbayashi – Nikon Corporation
Toshimasa Shimoda – Nikon Corporation
Isao Sugaya – Nikon Corporation
Multi-Stack Hybrid Cu Bonding Technology Development Using Ultra-Thin Chips
Min-Ki Kim – Samsung Electronics Co., Ltd.-Test and System Package
Hyuekjae Lee – Samsung Electronics Co., Ltd.-Test and System Package
Aeni Jang – Samsung Electronics Co., Ltd.-Test and System Package
Seungduk Baek – Samsung Electronics Co., Ltd.-Test and System Package
Ilhwan Kim – Samsung Electronics Co., Ltd.-Test and System Package
Youngkun Jee – Samsung Electronics Co., Ltd.-Test and System Package
Hyun-Chul Jung – Samsung Electronics Co., Ltd.-Test and System Package
Un-Byoung Kang – Samsung Electronics Co., Ltd.-Test and System Package
Dae-Woo Kim – Samsung Electronics Co., Ltd.-Test and System Package
An Investigation on Particle Embedding Capability of Wafer Level Spin-on Polymer Underfill Enabling Low Temperature Bonding of Hybrid Bonding System
Hiroto Noda – JSR Corporation
Akito Hiro – JSR Corporation
Naoki Nishiguchi – JSR Corporation
Jaber Derakhshandeh – imec
John Slabbekoorn – imec
Eric Beyne – imec
Effect of Chip Metallization and Process Parameters on the Die Attach Properties of Direct Bonded Power Devices
Michael Curkin – Hamm-Lippstadt University of Applied Sciences
Marius Koehler – Hamm-Lippstadt University of Applied Sciences
Silke Kraft – SEMIKRON Elektronik GmbH & Co. KG
Jens Mueller – SEMIKRON Elektronik GmbH & Co. KG
Kurt-Georg Besendoerfer – SEMIKRON Elektronik GmbH & Co. KG
Nicolas Heuck – Hamm-Lippstadt University of Applied Sciences
Full-IMC Interconnects Through Transient Liquid Phase Bonding Process of Ga/Cu System for Advanced Electronic Packaging
Yi Chen – Loughborough University
Zhaoxia Zhou – Loughborough University
Changqing Liu – Loughborough University
Selective Self-Assembled Monolayer for Copper Surface Protection During Plasma Activation of Hybrid-Bonded Wafers
Jack Rogers – TEL Technology Center, America, LLC
Development of a Heterogeneous Integration of GaN Power Device on Si-LSI
Shinei Miyasaka – Kyushu Institute of Technology
Yusuke Norihide – Kyushu Institute of Technology
Ayano Furue – Kyushu Institute of Technology
Satoko Shinkai – Kyushu Institute of Technology
Satoshi Matsumoto – Kyushu Institute of Technology
Seed Layer Etching, Thermal Reflow and Bonding of Cu-Sn Micro Bumps With 5 µm Diameters
Yunfan Shi – Tsinghua University
Zilin Wang – Tsinghua University
Zheyao Wang – Tsinghua University
Integrated pH and Strain Sensors Development for Nasogastric Tube Placement Application
Ruiqi Lim – Institute of Microelectronics A*STAR
Yu Chen – Institute of Microelectronics A*STAR
James Ven Wee Yap – Institute of Microelectronics A*STAR
Musafargani Sikkandhar – Institute of Microelectronics A*STAR
Ming-Yuan Cheng – Institute of Microelectronics A*STAR
Portable Multiple-Channel Ion-Selective Sensor
Yu Chen – Institute of Microelectronics A*STAR
Musafargani Sikkandhar – Institute of Microelectronics A*STAR
James Ven Wee Yap – Institute of Microelectronics A*STAR
Ming-Yuan Cheng – Institute of Microelectronics A*STAR
Application of Nickel Micro-Plating Bonding (NMPB) Technology to Crystalline Silicon Solar Cell Interconnection
Xinguang Yu – Waseda University
Zhi Fu – Waseda University
Isamu Morisako – Waseda University
Keiko Koshiba – Waseda University
Tomonori Iizuka – Waseda University
Kohei Tatsumi – Waseda University
Embedded Microchannel Cooling System Based on Flexible Manifold for High-Performance Computing ICs
Jie Wang – Institute of Microelectronics Chinese Academy of Sciences
Yanmei Kong – Institute of Microelectronics Chinese Academy of Sciences
Binbin Jiao – Institute of Microelectronics Chinese Academy of Sciences
Ruiwen Liu – Institute of Microelectronics Chinese Academy of Sciences
Yuxin Ye – Institute of Microelectronics Chinese Academy of Sciences
Xiangbin Du – Institute of Microelectronics Chinese Academy of Sciences
Lihang Yu – Institute of Microelectronics Chinese Academy of Sciences
Yulin Shi – Institute of Microelectronics Chinese Academy of Sciences
Shichang Yun – Institute of Microelectronics Chinese Academy of Sciences
Dichen Lu – Institute of Microelectronics Chinese Academy of Sciences
Ziyu Liu – Institute of Microelectronics Chinese Academy of Sciences
Jingping Qiao – Institute of Microelectronics Chinese Academy of Sciences
CMOS-Compatible Fine Pitch Aluminum to Aluminum Bonding
Hemanth Kumar Cheemalamarri – Institute of Microelectronics A*STAR
Binni Varghese – Institute of Microelectronics A*STAR
Sharma Jaibir – Institute of Microelectronics A*STAR
Hongyu Li – Institute of Microelectronics A*STAR
B. S. S. Chandra Rao – Institute of Microelectronics A*STAR
Navab Singh – Institute of Microelectronics A*STAR
Srinivasa Rao Vempati – Institute of Microelectronics A*STAR
King-Jien Chui – Institute of Microelectronics A*STAR
Forming of Advanced THT-Interconnects Using SB² Laser Solder Jetting Process
Matthias Fettke – Pac Tech GmbH
Anne Fisch – Pac Tech GmbH
Georg Friedrich – Pac Tech GmbH
Moshir Nasser – Pac Tech GmbH
Thorsten Teutsch – Pac Tech GmbH
Board Level FEA Reliability and Stress Modeling for Chip-to-Wafer Bonded Chiplet Package
Rathin Mandal – Institute of Microelectronics A*STAR
Chai Tai Chong – Institute of Microelectronics A*STAR
High Density VR Solution Using Immersion Cooling
Jesus G. Ruelas Flores – Intel Corporation
Arturo Sanchez Hernandez – Intel Corporation
Ernesto A Padilla Ramirez – Intel Corporation
Oscar A Del Rio Gonzalez – Intel Corporation
Carlos E Mora Flores – Intel Corporation
Andres Ramirez Macias – Intel Corporation
Demonstration of Eight Metal Layer Redistribution on Glass Substrate With Fine Features and Microvias
Christopher Blancher – Georgia Institute of Technology
Mohanalingam Kathaperumal – Georgia Institute of Technology
Fuhan Liu – Georgia Institute of Technology
Madhavan Swaminathan – Georgia Institute of Technology
Novel IR Laser Cleaving for Ultra-Thin Layer Transfer and 3D Stacked Devices
Thomas Uhrmann – EV Group, Inc.
Peter Urban – EV Group, Inc.
Boris Povazay – EV Group, Inc.
Michael Josef Gruber – EV Group, Inc.
Julian Bravin – EV Group, Inc.
Daniel Burgstaller – EV Group, Inc.
Markus Wimplinger – EV Group, Inc.
Bernd Thallner – EV Group, Inc.
Robust Edge Coupling Probe Applied in Wafer-Level Optical Testing
Sheng-Ho Huang – Industrial Technology Research Institute
Chen-Yu Lin – Industrial Technology Research Institute
Yi-Keng Fu – Industrial Technology Research Institute
Mei-Ju Lu – ASE Corporate R&D Center
Sin-Yuan Mu – ASE Corporate R&D Center
Chia-Sheng Cheng – ASE Corporate R&D Center
Jihan Chen – ASE Corporate R&D Center
An Intensive Study of Effects of Orientations of Single Crystal Cu Bumps on Cu-Cu Direct Bonding for 3D Integration by Molecular Dynamics Simulation
Deng-Wu Zheng – South China University of Technology
Min-Bo Zhou – South China University of Technology
Shuai Liu – South China University of Technology
Chang-Bo Ke – South China University of Technology
Xin-Ping Zhang – South China University of Technology
Reconstituted-SiO₂ Tier With Integrated Copper Heat Spreader
Ashita Victor – Georgia Institute of Technology
Madison Manley – Georgia Institute of Technology
Shane Oh – Georgia Institute of Technology
Muhannad S. Bakir – Georgia Institute of Technology
Reflow Oven Zone Temperature Advisor Using the AI-Driven Smart Recipe Generator
Yangyang Lai – Binghamton University
Junbo Yang – Binghamton University
Jong Hwan Ha – Binghamton University
Pengcheng Yin – Binghamton University
Karthik A. Deo – Binghamton University
Seungbae Park – Binghamton University
A Technical Review on State of the Art In-Plane and Out-of-Plane Deformation Measurement Techniques for Microelectronic Packages
Karthik Arun Deo – Binghamton University
Yangyang Lai – Binghamton University
Junbo Yang – Binghamton University
Jong Hwan Ha – Binghamton University
Pengcheng Yin – Binghamton University
Seungbae Park – Binghamton University
A Novel Polymer-Based Ultra-High Density Bonding Interconnection
Yu-Min Lin – Industrial Technology Research Institute
Tsung-Yu Ou Yang – Industrial Technology Research Institute
Ou-Hsiang Lee – Industrial Technology Research Institute
Ching- Kuan Lee – Industrial Technology Research Institute
Wei-Lan Chiu – Industrial Technology Research Institute
Tao-Chih Chang – Industrial Technology Research Institute
Hsiang-Hung Chang – Industrial Technology Research Institute
Michael Gallagher – DuPont Electronics and Industrial
Po-Yao Chuang – DuPont Electronics and Industrial
Po-Hao Tsai – DuPont Electronics and Industrial
Po-Chun Huang – DuPont Electronics and Industrial
Chang-Chun Lee – National Tsing Hua University
Comparison of Sintering Methodologies for 3D Printed High-Density Interconnects (2.3 µm L/S) on Organic Substrates for High-Performance Computing Applications
Shrivani Pandiya – University of Sherbrooke
Christophe Sansregret – Centre de Collaboration MiQroInnovation (C2MI)
Isabel De Sousa – IBM Canada, Ltd.
Serge Ecoffey – University of Sherbrooke
Yann Beilliard – University of Sherbrooke
Dominique Drouin – University of Sherbrooke
Formation and 3D Stacking Process of CMOS Chips With Backside Buried Metal Power Distribution Networks
Naoya Watanabe – National Institute of Advanced Industrial Science and Technology
Yuuki Araga – National Institute of Advanced Industrial Science and Technology
Haruo Shimamoto – National Institute of Advanced Industrial Science and Technology
Makoto Nagata – Kobe University
Katsuya Kikuchi – National Institute of Advanced Industrial Science and Technology
Cu Pillar With Nanoporous Copper Cap: A Step Towards Chip-to-Substrate Hybrid Bonding
Ramon A. Sosa – Georgia Institute of Technology
Vanessa Smet – Georgia Institute of Technology
Antonia Antoniou – Georgia Institute of Technology
