Technical Program
Wednesday May 31st
Session 37: Interactive Presentations 1
Committee: Interactive Presentations
Room: Palazzo Foyer
Session Co-Chairs:
Mark Poliks
Binghamton University
Email: [email protected]
Pradeep Lall
Auburn University
Email: [email protected]
Jae Kyu Cho
GlobalFoundries, Inc.
Email: [email protected]
Kristina Young
GlobalFoundries, Inc.
Email: [email protected]
Papers:
Investigation of Cu-to-Cu and Oxide-to-Oxide Bonding
Sangmin Lee – Seoul National University of Science and Technology
Gwangsik Oh – Seoul National University of Science and Technology
Junyoung Choi – Seoul National University of Science and Technology
Yoonho Kim – Seoul National University of Science and Technology
Sangwoo Park – Seoul National University of Science and Technology
Sarah Kim – Seoul National University of Science and Technology
Doping-Selective Etching of Silicon for Wafer Thinning in the Fabrication of Backside-Illuminated Stacked CMOS Image Sensors
Nandini Venkataraman – Institute of Microelectronics A*STAR
Benedikt Risse – Nexgen Wafer Systems GmbH
Gregorio Decierdo – Nexgen Wafer Systems Pte. Ltd.
Navab Singh – Institute of Microelectronics A*STAR
Darshini Senthilkumar – Institute of Microelectronics A*STAR
Deepthi Kandasamy – GlobalFoundries Singapore
Eng Huat Toh – GlobalFoundries Singapore
Louis Lim – GlobalFoundries Singapore
Study of Solder Resist Crack Resistance for Flip Chip Ball Grid Array Substrate
Eric Chen – Siliconware Precision Industries Co., Ltd.
Rick Ye – Siliconware Precision Industries Co., Ltd.
Wen-Yu Teng – Siliconware Precision Industries Co., Ltd.
Yu-Cheng Pei – Siliconware Precision Industries Co., Ltd.
Yu Po Wang – Siliconware Precision Industries Co., Ltd.
Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Devices with Various Frontside and Backside Interconnects
Dong Hu – Delft University of Technology
Ali Roshanghias – Silicon Austria Labs GmbH
Xing Liu – Chemnitz University of Technology
Xu Liu – Delft University of Technology
Emiel De Bruin – Boschman Advanced Packaging Technology B.V.
Sten Vollebregt – Delft University of Technology
Jiajie Fan – Delft University of Technology
Thomas Basler – Chemnitz University of Technology
Guoqi Zhang – Delft University of Technology
Impact of Process Parameters on Vacuum Fluxless Solder Reflow Performance in Backend Applications with Bump Pitch of 15 µm and Below
Lei Jing – Yield Engineering Systems
Vladimir Kudriavtsev – Yield Engineering Systems
Taylor Nguyen – Yield Engineering Systems
Jed Hsu – Yield Engineering Systems
Tapani Laaksonen – Yield Engineering Systems
Alvin Lin – Yield Engineering Systems
Xinxuan Tan – Yield Engineering Systems
Kay Song – Yield Engineering Systems
Alex Chow – Yield Engineering Systems
Chris Lane – Yield Engineering Systems
Zia Karim – Yield Engineering Systems
Surface Modification on Hydrophilicity Enhancement Using NH₄OH, NaOH and KOH on Fine-Pitch Low Temperature Cu/SiO₂ Hybrid Bonding
Jia-Juen Ong – National Chiao Tung University
Dinh-Phuc Tran – National Chiao Tung University
Wei-Lan Chiu – Industrial Technology Research Institute
Yu-An Chen – National Chiao Tung University
Ou-Hsiang Lee – Industrial Technology Research Institute
Hsiang-Hung Chang – Industrial Technology Research Institute
Chih Chen – National Chiao Tung University
Development and Demonstration of a Novel Immersion Two Phase Cooling High Power SiC Power Module
Gongyue Tang – Institute of Microelectronics A*STAR
Leong Ching Wai – Institute of Microelectronics A*STAR
Huicheng Feng – Institute of Microelectronics A*STAR
Haoran Chen – Institute of Microelectronics A*STAR
Electrochemical Deposition of Indium Bumps on Superconducting Interconnect and Thermo-Compression Bonding for Cryogenic and Quantum Computing
Kumin Kang – Hanyang University
Jaber Derakhshandeh – imec
6-Sided Die Protection for Chiplet Package with Multi-Layer RDL
ByungCheol Kim – nepes Corporation
Mary Maye Melgo – nepes Corporation
Rizi Gacho – nepes Corporation
Jacinta Aman Lim – nepes Corporation
Hee Yeoul Yoo – nepes Corporation
Kwan Sun Oh – nepes Corporation
Cliff Sandstrom – Deca Technologies, Inc.
Benedict San Jose – Deca Technologies, Inc.
Wafer Level Capping Technology for Vacuum Packaging of Microbolometers
Kai Zoschke – Fraunhofer IZM
Charles-Alix Manier – Fraunhofer IZM
Hermann Oppermann – Fraunhofer IZM
Dirk Meier – Integrated Detector Electronic AS
Nishant Malik – Integrated Detector Electronic AS
Elahe Zakizade – Fraunhofer IMS
Marvin Daniel Michel – Fraunhofer IMS
Avisek Roy – University of South-Eastern Norway
Hoang-Vu Nguyen – University of South-Eastern Norway
Hexin Xia – University of South-Eastern Norway
Scaling of Redistribution Layer for Heterogeneous Packaging in a Panel Level
Yoonyoung Jeon – Samsung Electronics Co., Ltd.
Youngmin Kim – Samsung Electronics Co., Ltd.
Hyundong Lee – Samsung Electronics Co., Ltd.
Minji Kim – Samsung Electronics Co., Ltd.
Woongkeon Lee – Samsung Electronics Co., Ltd.
Joonseok Oh – Samsung Electronics Co., Ltd.
Process Challenges During CVD Oxide Deposition on the Backside of 20 µm Thin 300-mm Wafers Temporarily Bonded to Glass Carriers
Koen Kennes – imec
Alice Guerrero – Brewer Science, Inc.
Abdellah Salahouelhadj – imec
Samuel Suhard – imec
Jaber Derakhshandeh – imec
Alain Phommahaxay – imec
Steven Brems – imec
Xiao Liu – Brewer Science, Inc.
Gerald Beyer – imec
Eric Beyne – imec
Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
Atom Watanabe – IBM Corporation
Hiroyuki Mori – IBM Corporation
Xiaoxiong Gu – IBM Corporation
Frank Libsch – IBM Corporation
Griselda Bonilla – IBM Corporation
Package Integrated Vapor Chamber Heat Spreaders
Cameron Nelson – Amkor Technology, Inc.
SangHyuk Kim – Amkor Technology Korea
Evaluation of Parylene-HT as Dielectric for Application in Advanced Package Substrates
Pratik Nimbalkar – Georgia Institute of Technology
Mohanalingam Kathaperumal – Georgia Institute of Technology
Madhavan Swaminathan – Georgia Institute of Technology
Rao Tummala – Georgia Institute of Technology
Bottom Side Cooling for Glass Interposer with Chip Embedding Using Double-Sided Release Process for 6G Wireless Applications
Joon Woo Kim – Georgia Institute of Technology
Xingchen Li – Georgia Institute of Technology
Xiaofan Jia – Georgia Institute of Technology
Kyoung-Sik Moon – Georgia Institute of Technology
Madhavan Swaminathan – Georgia Institute of Technology
Demonstration of a Power-Efficient and Cost-Effective Power Delivery Architecture for Heterogeneously Integrated Wafer-Scale Systems
Haoxiang Ren – University of California, Los Angeles
Subramanian S. Iyer – University of California, Los Angeles
Metal Additively Microfabricated SiPs with Embedded Microfluidic Cooling Towards Heterogeneous Integration with SoCs
Bhushan Lohani – University of Texas, El Paso
Sheikh Dobir Hossain – University of Texas, El Paso
Robert C. Roberts – University of Texas, El Paso
The Factors Influencing Underfill's Reliability in Large-Size Packages
Guolin Zhao – Central South University
Pengli Zhu – Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Wenhui Zhu – Central South University
Chingping Wong – Georgia Institute of Technology
Large Wafer GaN on Silicon Reconstitution with Gold-to-Gold Thermocompression Bonding
Ankit Kuchhangi – University of California, Los Angeles
Krutikesh Sahoo – University of California, Los Angeles
Haoxiang Ren – University of California, Los Angeles
Subramanian S. Iyer – University of California, Los Angeles
