Technical Program

Wednesday May 31st

10:00 AM - 12:00 PM

Session 37: Interactive Presentations 1
Committee: Interactive Presentations
Room: In front of Palazzo D & E

Session Co-Chairs:

Mark Poliks
Binghamton University
Email: [email protected]

Pradeep Lall
Auburn University
Email: [email protected]

Kristina Young
GlobalFoundries, Inc.
Email: [email protected]

Jae Kyu Cho
GlobalFoundries, Inc.
Email: [email protected]


Signal Integrity of 2-µm-Pitch RDL Interposer for High-Performance Signal Processing in Chiplet-Based System
Takamasa Takano – Dai Nippon Printing Co., Ltd.
Hiroshi Kudo – Dai Nippon Printing Co., Ltd.
Masaya Tanaka – Dai Nippon Printing Co., Ltd.
Satoru Kuramochi – Dai Nippon Printing Co., Ltd.
Tomoya Sasagawa – DNP America, LLC

Investigation of Cu-to-Cu and Oxide-to-Oxide Bonding
Sangmin Lee – Seoul National University of Science and Technology
Gwangsik Oh – Seoul National University of Science and Technology
Junyoung Choi – Seoul National University of Science and Technology
Yoonho Kim – Seoul National University of Science and Technology
Sangwoo Park – Seoul National University of Science and Technology
Sarah Kim – Seoul National University of Science and Technology

Doping-Selective Etching of Silicon for Wafer Thinning in the Fabrication of Backside-Illuminated Stacked CMOS Image Sensors
Nandini Venkataraman – Institute of Microelectronics A*STAR
Benedikt Risse – Nexgen Wafer Systems GmbH
Gregorio Decierdo – Nexgen Wafer Systems Pte. Ltd.
Navab Singh – Institute of Microelectronics A*STAR
Darshini Senthilkumar – Institute of Microelectronics A*STAR
Deepthi Kandasamy – GlobalFoundries Singapore
Eng Huat Toh – GlobalFoundries Singapore
Louis Lim – GlobalFoundries Singapore

Study of Solder Resist Crack Resistance for Flip Chip Ball Grid Array Substrate
Eric Chen – Siliconware Precision Industries Co., Ltd.
Rick Ye – Siliconware Precision Industries Co., Ltd.
Wen-Yu Teng – Siliconware Precision Industries Co., Ltd.
Yu-Cheng Pei – Siliconware Precision Industries Co., Ltd.
Yu Po Wang – Siliconware Precision Industries Co., Ltd.

Reliability Analysis on Ag and Cu Nanoparticles Sintered Discrete Power Device With Various Frontside and Backside Interconnect
Dong Hu – Delft University of Technology
Ali Roshanghias – Silicon Austria Labs GmbH
Xing Liu – Chemnitz University of Technology
Xu Liu – Delft University of Technology
Emiel De Bruin – Boschman Advanced Packaging Technology B.V.
Sten Vollebregt – Delft University of Technology
Jiajie Fan – Delft University of Technology
Thomas Basler – Chemnitz University of Technology
Guoqi Zhang – Delft University of Technology

Wafer Level Batch Fabrication of an MRI Compatible Neural Probe With Electrical, Optical, and Microfluidic Functions
Ziqi Jia – University of Florida
Shuyu Shi – University of Florida
Yong-Kyu Yoon – University of Florida

High Reliability Design of Ag Sinter Joining on a Softened Crackless Ni-P /Pt/Ag Metallization AMB Substrate During Aging and Harsh Thermal Cycling
Chuantong Chen – Osaka University
Yang Liu – Osaka University
Hupeng Huo – Osaka University
Minoru Ueshima – Daicel Corporation
Takeshi Sakamoto – Daicel Corporation
Yukinori Oda – C. Uyemura & Co., Ltd.
Katsuaki Suganuma – Osaka University

Impact of Process Parameters on Vacuum Fluxless Solder Reflow Performance in Backend Applications With Bump Pitch of 15 µm and Below
Lei Jing – Yield Engineering Systems
Vladimir Kudriavtsev – Yield Engineering Systems
Taylor Nguyen – Yield Engineering Systems
Jed Hsu – Yield Engineering Systems
Tapani Laaksonen – Yield Engineering Systems
Alvin Lin – Yield Engineering Systems
Xinxuan Tan – Yield Engineering Systems
Kay Song – Yield Engineering Systems
Alex Chow – Yield Engineering Systems
Chris Lane – Yield Engineering Systems
Zia Karim – Yield Engineering Systems

Reliability Performance Study of Molding Compounds on High Voltage Molded Leaded Package
April Joy Garete – Nexperia
Zhiwen Li – Nexperia
Yee Wai Fung – Nexperia
Wai Man Wong – Nexperia

Surface Modification on Hydrophilicity Enhancement Using NH₄OH, NaOH and KOH on Fine-Pitch Low Temperature Cu/SiO₂ Hybrid Bonding
Jia-Juen Ong – National Chiao Tung University
Dinh-Phuc Tran – National Chiao Tung University
Wei-Lan Chiu – Industrial Technology Research Institute
Yu-An Chen – National Chiao Tung University
Ou-Hsiang Lee – Industrial Technology Research Institute
Hsiang-Hung Chang – Industrial Technology Research Institute
Chih Chen – National Chiao Tung University

Development and Demonstration of a Novel Immersion Two Phase Cooling High Power SiC Power Module
Gongyue Tang – Institute of Microelectronics A*STAR
Leong Ching Wai – Institute of Microelectronics A*STAR
Huicheng Feng – Institute of Microelectronics A*STAR
Haoran Chen – Institute of Microelectronics A*STAR

Electrochemical Deposition of Indium Bumps on Superconducting Interconnect and Thermo-Compression Bonding for Cryogenic and Quantum Computing
Kumin Kang – Hanyang University
Jaber Derakhshandeh – imec

Ultra-Precise Deposition: Additive Manufacturing Process for Advanced Packaging and Heterogeneous Integration
Lukasz Witczak – XTPL SA
Jolanta Gadzalinska – XTPL SA
Iwona Gradzka-Kurzaj – XTPL SA
Mateusz Lysien – XTPL SA
Ludovic Schneider – XTPL SA
Aneta Wiatrowska – XTPL SA
Karolina Fiaczyk – XTPL SA
Piotr Kowalczewski – XTPL SA
Lukasz Kosior – XTPL SA
Filip Granek – XTPL SA

Influence of High Temperature Thermal Annealing on Silver-Based backside Metallization Stack for Power Electronic Die-Attach Packaging Applications
Goran Miskovic – Silicon Austria Labs GmbH
Mohamed Lamine Faycal Bellaredj – Silicon Austria Labs GmbH

6-Sided Die Protection for Chiplet Package With Multi-Layer RDL
ByungCheol Kim – nepes Corporation
Mary Maye Melgo – nepes Corporation
Rizi Gacho – nepes Corporation
Jacinta Aman Lim – nepes Corporation
Hee Yeoul Yoo – nepes Corporation
Kwan Sun Oh – nepes Corporation
Cliff Sandstrom – Deca Technologies, Inc.
Benedict San Jose – Deca Technologies, Inc.

Wafer Level Capping Technology for Vacuum Packaging of Microbolometers
Kai Zoschke – Fraunhofer IZM
Charles-Alix Manier – Fraunhofer IZM
Hermann Oppermann – Fraunhofer IZM
Dirk Meier – Integrated Detector Electronic AS
Nishant Malik – Integrated Detector Electronic AS
Elahe Zakizade – Fraunhofer IMS
Marvin Daniel Michel – Fraunhofer IMS
Avisek Roy – University of South-Eastern Norway
Hoang-Vu Nguyen – University of South-Eastern Norway
Hexin Xia – University of South-Eastern Norway

Artificial Intelligence (AI) Based Methodology to Minimize Asymmetric Bare Laminate Warpage
Sathya Raghavan – IBM Research
Hiroyuki Mori – IBM Research, Tokyo
Griselda Bonilla – IBM Research
Katsuyuki Sakuma – IBM Research

Scaling of Redistribution Layer for Heterogeneous Packaging in a Panel Level
Yoonyoung Jeon – Samsung Electronics Co., Ltd.
Youngmin Kim – Samsung Electronics Co., Ltd.
Hyundong Lee – Samsung Electronics Co., Ltd.
Minji Kim – Samsung Electronics Co., Ltd.
Woongkeon Lee – Samsung Electronics Co., Ltd.
Joonseok Oh – Samsung Electronics Co., Ltd.

Process Challenges During CVD Oxide Deposition on the Backside of 20-µm Thin 300-mm Wafers Temporarily Bonded to Glass Carriers
Koen Kennes – imec
Alice Guerrero – Brewer Science, Inc.
Abdellah Salahouelhadj – imec
Samuel Suhard – imec
Jaber Derakhshandeh – imec
Alain Phommahaxay – imec
Steven Brems – imec
Xiao Liu – Brewer Science, Inc.
Gerald Beyer – imec
Eric Beyne – imec

Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
Atom Watanabe – IBM Corporation
Hiroyuki Mori – IBM Corporation
Xiaoxiong Gu – IBM Corporation
Frank Libsch – IBM Corporation
Griselda Bonilla – IBM Corporation

Package Integrated Vapor Chamber Heat Spreaders
Cameron Nelson – Amkor Technology, Inc.
SangHyuk Kim – Amkor Technology Korea

Study on Single-Digit Micro Bump Patterning for 2.5D Silicon Interposer
Masaki Mizutani – Canon, Inc.
Douglas Shelton – Canon U.S.A., Inc.
Yusuke Tokuyama – Canon, Inc.
Hiromi Suda – Canon, Inc.
Ken-Ichiro Shinoda – Canon, Inc.
Ken-Ichiro Mori – Canon, Inc.

C2W Hybrid Bonding Interconnect Technology for High Density and Better Thermal Dissipation of HBM
Kibum Kim – SK Hynix, Inc.

Large 2.5D Package-to-System Interaction Analysis from Thermal Perspective Based on 3DFabric™ Platform
Po-Yao Lin – Taiwan Semiconductor Manufacturing Company, Ltd.
Kathy Yan – Taiwan Semiconductor Manufacturing Company, Ltd.
Jun He – Taiwan Semiconductor Manufacturing Company, Ltd.

Electrical and Thermo-Mechanical Analysis of TSVs With Air Gap-Isolation for RF/mmWave Applications
Shane Oh – Georgia Institute of Technology
Ting Zheng – Georgia Institute of Technology
Wanshu Zeng – Georgia Institute of Technology
Geyu Yan – Georgia Institute of Technology
Muhannad S. Bakir – Georgia Institute of Technology

Evaluation of Parylene-HT as Dielectric for Application in Advanced Package Substrates
Pratik Nimbalkar – Georgia Institute of Technology
Mohanalingam Kathaperumal – Georgia Institute of Technology
Madhavan Swaminathan – Georgia Institute of Technology
Rao Tummala – Georgia Institute of Technology

D2W Hybrid Bonding Using High Accuracy Carrier Solutions for 3D System Integration
Thomas Uhrmann – EV Group, Inc.
Mariana Pires – EV Group, Inc.
Juergen Burggraf – EV Group, Inc.
Julian Bravin – EV Group, Inc.
Markus Wimplinger – EV Group, Inc.
Chun Ho Fan – ASMPT Hong Kong, Ltd.
Hoi Ping Ng – ASMPT Hong Kong, Ltd.
Siu Cheung So – ASMPT Hong Kong, Ltd.
Ming Li – ASMPT Hong Kong, Ltd.
Siu Wing Lau – ASMPT Hong Kong, Ltd.

SiC Power Module Packaging and Interconnections Using Flexible Hybrid Electronics Materials and Processes
Riadh Al-Haidari – Binghamton University
Mohammed Alhendi – Binghamton University
Dylan Richmond – Binghamton University
El Mehdi Abbara – Binghamton University
Abdullah Obeidat – Binghamton University
Mark Poliks – Binghamton University
Mark Schadt – Binghamton University
Arun Gowda – GE Research
Jeffrey Erlbaum – GE Research
Han Xiong – GE Research
Collin Hitchcock – GE Research

Bottom Side Cooling for Glass Interposer With Chip Embedding Using Double-Sided Release Process for 6G Wireless Applications
Joon Woo Kim – Georgia Institute of Technology
Xingchen Li – Georgia Institute of Technology
Xiaofan Jia – Georgia Institute of Technology
Kyoung-Sik Moon – Georgia Institute of Technology
Madhavan Swaminathan – Georgia Institute of Technology

Demonstration of TSV-less Efficient and Cost-Effective Power Delivery for Large Interposers and Wafer-Scale Systems
Haoxiang Ren – University of California, Los Angeles
Subramanian S. Iyer – University of California, Los Angeles

Metal Additively Microfabricated SiPs With Embedded Microfluidic Cooling Towards Heterogeneous Integration With SoCs
Bhushan Lohani – University of Texas, El Paso
Sheikh Dobir Hossain – University of Texas, El Paso
Robert C. Roberts – University of Texas, El Paso

The Factors Influencing Underfill's Reliability in Large-Size Packages
Guolin Zhao – Central South University
Pengli Zhu – Chinese Academy of Science-Shenzhen Institute of Advanced Technology
Wenhui Zhu – Central South University
Chingping Wong – Georgia Institute of Technology

Wafer-Scale III-V on Silicon Reconstitution With Metal-Metal Thermocompression Bonding
Ankit Kuchhangi – University of California, Los Angeles
Krutikesh Sahoo – University of California, Los Angeles
Haoxiang Ren – University of California, Los Angeles
Subramanian S. Iyer – University of California, Los Angeles