Technical Program

Friday, June 03, 2022

Session 36: Modeling and Characterization of Interfaces and Interconnects
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
Room: Coral 5

Session Co-Chairs:

Tieyu Zheng
Microsoft Corporation
[email protected]
Xuejun Fan
Lamar University
[email protected]


1. Sustained High Temperature Fracture Toughness Evolution of Chip-UF and Substrate-UF Interfaces in FCBGAs for Automotive Applications
Pradeep Lall - Auburn University
Padmanava Choudhury - Auburn University
Aathi Pandurangan - Auburn University

2. Nonlinear Finite Element Analysis of an Automotive High-Power Module Under Impact Loading
Liangbiao Chen - ON Semiconductor
Yong Liu - ON Semiconductor
Alex Yao - ON Semiconductor
Sam Lin - ON Semiconductor
CH Chew - ON Semiconductor

3. Magnetic-Based Interfacial Adhesion Measurement Technique with Environmental Conditions
Rui Chen - Georgia Institute of Technology
Nicholas Ginga - University of Alabama in Huntsville
Suresh Sitaraman - Georgia Institute of Technology

4. Fracture Simulation of Redistribution Layer in Fan-Out Wafer-Level Package Based on Fatigue Crack Growth Characteristics of Insulating Polymer
Koichi Nagase - Asahi Kasei Corporation
Atsushi Fujii - Asahi Kasei Corporation
Kaiwen Zhong - Shibaura Institute of Technology
Yoshiharu Kariya - Shibaura Institute of Technology

5. Development on Fatigue Life Model of Lead-Free Solder for First Failure Prediction
Faxing Che - Micron Semiconductor Asia Operations Pte. Ltd.
Yeow Chon Ong - Micron Semiconductor Asia Operations Pte. Ltd.
Hong Wan Ng - Micron Semiconductor Asia Operations Pte. Ltd.
Ling Pan - Micron Semiconductor Asia Operations Pte. Ltd.
Christopher Glancey - Micron Technology, Inc.
Koustav Sinha - Micron Technology, Inc.
Richard Fan - Micron Memory Taiwan Co., Ltd.

6. An Extensive Simulation Study of the Interfacial Delamination in Molded Underfill Flip-Chip Packages by Finite Element Method Based on Virtual Crack Closure Technique
Guang-Chao Lyu - South China University of Technology
Hong-Guang Wang - South China University of Technology
Min-Bo Zhou - South China University of Technology
Xin-Ping Zhang - South China University of Technology

7. Mechanical Simulation and Modeling for Reliability of 6-in-1 Power Module
Rathin Mandal - Institute of Microelectronics (IME), A*STAR
Kazunori Yamamoto - Institute of Microelectronics (IME), A*STAR
Gongyue Tang - Institute of Microelectronics (IME), A*STAR