Technical Program

Program Sessions: Friday June 2nd 2:00 PM – 5:05 PM

Session 36: RF, Heterogeneous, and Chiplet Modules
Committee: RF, High-Speed Components & Systems
Room: Mediterranean 7 & 8

Session Co-Chairs:

Amit Agrawal
Microchip Technology
Email: [email protected]

Craig Gaw
NXP Semiconductor, Inc.
Email: [email protected]


1. Heterogeneous Radio Chiplet Module for 5G Millimeter Wave Application
Agneta Ljungbro – Ericsson AB
Emil Nylander – Ericsson AB
Martin Hansson – Ericsson AB
Marcel Wieland – GlobalFoundries, Inc.
Selaka Bulumulla – GlobalFoundries, Inc.

2. Design and Analysis of 3D Heterogeneous Chiplet Stack for RF Front-End Module Miniaturization
Mihai Rotaru – Institute of Microelectronics A*STAR
Shashank Tiwari – GlobalFoundries, Inc.
Paul Castillou – Qorvo, Inc.
Chai Tai Chong – Institute of Microelectronics A*STAR
Chui King Jien – Institute of Microelectronics A*STAR

3. Embedded mm-Wave Chiplet Based Module Using Fused-Silica Stitch-Chip Technology: RF Characterization and Thermal Evaluation
Ting Zheng – Georgia Institute of Technology
Madison Manley – Georgia Institute of Technology
Muhannad S. Bakir – Georgia Institute of Technology

4. Surface Micromachined Integrable High Efficiency Ridge Gap Waveguide Bandpass Filter for G-Band 6G Applications
Alexander Wilcher – University of Florida
Hae-in Kim – University of Florida
Ziqi Jia – University of Florida
David Arnold – University of Florida
Jia Chieh – Naval Information Warfare Center Pacific
Alex Phipps – Naval Information Warfare Center Pacific
Yong-Kyu Yoon – University of Florida

5. Amplified and Filtered x2 Multiplier Chip
Elizabeth Kunkee – Northrop Grumman Corp.
Dah-Weih Duan – Northrop Grumman Corp.
Ricardo Medina – Northrop Grumman Corp.
Nancy Lin – Northrop Grumman Corp.
R. Yogi – Northrop Grumman Corp.
Chunbo Zhang – Northrop Grumman Corp.
Robert Mendoza – Northrop Grumman Corp.
Kevin Leong – Northrop Grumman Corp.
Alex Zamora – Northrop Grumman Corp.
Scott Sing – Northrop Grumman Corp.
David Miller – Northrop Grumman Corp.

6. Optimal Channel Design for Die-to-Die Interface in Multi-Die Integration Applications
Jiyoung Park – Samsung Electronics Co., Ltd.
Seungki Nam – Samsung Electronics Co., Ltd.
Sungwook Moon – Samsung Electronics Co., Ltd.
Jinho Kim – Samsung Electronics Co., Ltd.

7. 3D MIM Ultra-Small Silicon Capacitor Design for High Capacitance Density With Extremely Low ESR and ESL
Wisnu Murti – Elohim, Inc.
Jihoon Cha – Elohim, Inc.
Dongki Lee – Elohim, Inc.
Taedong Kim – Elohim, Inc.
Sarah Kim – Elohim, Inc.
Yeong Lyeol Park – Elohim, Inc.
Seunggu Lim – Elohim, Inc.
Willy Choi – Elohim, Inc.