Technical Program

Program Sessions: Friday June 2nd 2:00 PM – 5:05 PM

Session 34: Bonding Assembly - Novel Packaging, Process, and Characterization
Committee: Assembly and Manufacturing Technology
Room: Mediterranean 1

Session Co-Chairs:

Jason Rouse
Taiyo America, Inc.
Email: [email protected]

Zia Karim
Yield Engineering Systems
Email: [email protected]

Papers:

1. Laser-Assisted Bonding With Compression (LABC) Based Tiling Bonding Process, Enabling Technology for Chiplet Integration
Kwang-Seong Choi – Electronics Telecommunications Research Institute
Jiho Joo – Electronics Telecommunications Research Institute
Gwang-Mun Choi – Electronics Telecommunications Research Institute
Chanmi Lee – Electronics Telecommunications Research Institute
Ho-Gyeong Yun – Electronics Telecommunications Research Institute
Seok Hwan Moon – Electronics Telecommunications Research Institute
Ki-Seok Jang – Electronics Telecommunications Research Institute
Jin-Hyuk Moon – Electronics Telecommunications Research Institute
Yoon-Hwan Moon – Electronics Telecommunications Research Institute
Yong-Sung Eom – Electronics Telecommunications Research Institute

2. Contamination-Free Cu/SiCN Hybrid Bonding Process Development for Sub-µm Pitch Devices With Enhanced Bonding Characteristics
Seung Ho Hahn – Samsung Electronics Co., Ltd.-Mechatronics Research
Wooyoung Kim – Samsung Electronics Co., Ltd.-Mechatronics Research
Donggap Shin – Samsung Electronics Co., Ltd.-Mechatronics Research
Yongin Lee – Samsung Electronics Co., Ltd.-Mechatronics Research
Sumin Kim – Samsung Electronics Co., Ltd.-Mechatronics Research
Wonyoung Choi – Samsung Electronics Co., Ltd.-Mechatronics Research
Kyeongbin Lim – Samsung Electronics Co., Ltd.-Mechatronics Research
Bumki Moon – Samsung Electronics Co., Ltd.-Mechatronics Research
Minwoo Rhee – Samsung Electronics Co., Ltd.-Mechatronics Research

3. Integration and Process Challenges of Self-Assembly Applied to Die-to-Wafer Hybrid Bonding
Emilie Bourjot – CEA-LETI
Alice Bond – CEA-LETI
Noura Nadi – CEA-LETI
Thierry Enot – CEA-LETI
Loic Sanchez – CEA-LETI
Pierre Montmeat – CEA-LETI
Benoit Martin – CEA-LETI
Alain Campo – CEA-LETI
Frank Fournel – CEA-LETI
Feras Eid – Intel Corporation
Johanna Swan – Intel Corporation

4. OCD Scatterometry as a Scalable Solution for Hybrid Bonding Pad Recess Metrology
Haris K. Niazi – Intel Corporation
Botao Zhang – Intel Corporation
Krishnan Shankar – KLA Corporation
Xavier F. Brun – Intel Corporation
Xavier F. Brun – Intel Corporation

5. A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
Serena Iacovo – imec
Oguzhan Orkut Okudur – imec
Koen D'Have – imec
Johan Meersschaut – imec
Liesbeth Witters – imec
Thierry Conard – imec
Thomas Uhrmann – EV Group, Inc.
Alain Phommahaxay – imec
Thomas Plach – EV Group, Inc.
Steven Brems – imec
Gerald Beyer – imec
Eric Beyne – imec

6. Optimization of Temperature Profile and Residual Stresses During Thermal Compression Bonding in 3D Packages
Prabudhya Roy Chowdhury – IBM Research
Sathya Raghavan – IBM Research
Luke Darling – IBM Research
Aakrati Jain – IBM Research
Promod R. Chowdhury – IBM Research
Mukta Ghate Farooq – IBM Research
Katsuyuki Sakuma – IBM Research

7. Impact of Thermal Annealing and Other Process Parameters on Hybrid Bonding Performance for 3D Advanced Assembly Technology
Taiwo Ajayi – Intel Corporation
Abhishek Bhat – Yield Engineering Systems
Kay Song – Yield Engineering Systems
Zia Karim – Yield Engineering Systems
Alvin Gatimu – Intel Corporation
Chris Woods – Intel Corporation
Charudatta Galande – Yield Engineering Systems
Phillip Le – Yield Engineering Systems
Xavier F. Brun – Intel Corporation