Technical Program

Friday, June 03, 2022

Session 33: Advanced Reliability Modeling and Characterization
1:30 PM - 5:10 PM
Committee: Thermal/Mechanical Simulation & Characterization
joint with Applied Reliability
Room: Silver Pearl 3

Session Co-Chairs:

Wei Wang
Qualcomm Technologies, Inc.
[email protected]
Tz-Cheng Chiu
National Cheng Kung University
[email protected]


1. In-Situ Monitoring of Thermo-Mechanical Induced Stresses in Electronic Control Unit – From the Assembly to Use in the Field
Przemyslaw Gromala - Robert Bosch GmbH
Daniel Riegel - Robert Bosch GmbH
Georg Konstantin - Robert Bosch GmbH
Alexander Kabakchiev - Robert Bosch GmbH

2. Reliability Challenges of High-Density Fan-Out Packaging for High-Performance Computing Applications
Laurene Yip - MediaTek, Inc.
Charles Lai - MediaTek, Inc.
Rosa Lin - MediaTek, Inc.
Cooper Peng - MediaTek, Inc.

3. A Comprehensive Study of Crack Initiation and Delamination Propagation at the Cu/Polyimide Interface in Fan-Out Wafer Level Package during Reflow Process
Hong-Guang Wang - South China University of Technology
Guang-Chao Lyu - South China University of Technology
Yun-Kai Deng - South China University of Technology
Wei-Lin Hu - South China University of Technology
Bing-Xian Yang - South China University of Technology
Min-Bo Zhou - South China University of Technology
Xin-Ping Zhang - South China University of Technology

4. Observation of Fatigue and Creep Ratcheting Failure in Solder Joints Under Pulsed Direct Current Electromigration Testing
Allison Osmanson - University of Texas at Arlington
Yi Ram Kim - University of Texas at Arlington
Choong-Un Kim - University of Texas at Arlington
Patrick Thompson - Texas Instruments
Qiao Chen - Texas Instruments
Sylvester Ankamah-Kusi - Texas Instruments

5. Evolution of SAC305 Mechanical Behavior Due to Damage Accumulation during Cycling
Mohammad Ashraful Haq - Auburn University
Mohd Aminul Hoque - Auburn University
Golam Rakib Mazumder - Auburn University
Jeffrey C. Suhling - Auburn University
Pradeep Lall - Auburn University

6. Board-Level Solder Joint Reliability of QFN Packages with Enclosure and Placement Effects in Various Form Factors
Chun-Sean Lau - Western Digital Corporation
Ahmad Faridzul Hilmi - Western Digital Corporation
Ning Ye - Western Digital Corporation
Yang Bo - Western Digital Corporation

7. Shape Dependency of Fatigue Life in Solder Joints of Chip Resistors
Jonghwan Ha - Binghamton University
Chongyang Cai - Binghamton University
Pengcheng Yin - Binghamton University
Yangyang Lai - Binghamton University
Ke Pan - Binghamton University
Junbo Yang - Binghamton University
Seungbae Park - Binghamton University