Technical Program

Program Sessions: Friday June 2nd 2:00 PM – 5:05 PM

Session 32: Thermo-Mechanical Modelling and Characterization
Committee: Thermal/Mechanical Simulation & Characterization
Room: Palazzo A & B

Session Co-Chairs:

Pradeep Lall
Auburn University
Email: [email protected]

Tieyu Zheng
Microsoft Corporation
Email: [email protected]


1. Mechanical Simulation and Characterization on Flexural Fracture of Stacked Die Memory Package
Yangming Liu – Western Digital Corporation
Ning Ye – Western Digital Corporation
Bo Yang – Western Digital Corporation
Siqi Zhang – Western Digital Corporation
Wei Wang – Western Digital Corporation
Xu Wang – Western Digital Corporation

2. Simulation of Device Structure Impacts on Bonding Wave and Strain in Wafer to Wafer Cu-Cu Hybrid Bonding
Takaaki Hirano – Sony Semiconductor Solutions Corporation
Taichi Yamada – Sony Semiconductor Solutions Corporation
Shoji Kobayashi – Sony Semiconductor Solutions Corporation
Yoshiya Hagimoto – Sony Semiconductor Solutions Corporation
Hayato Iwamoto – Sony Semiconductor Solutions Corporation

3. Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction
Ran Tao – National Institute of Standards and Technology
Sukrut Prashant Phansalkar – University of Maryland
Aaron M. Forster – National Institute of Standards and Technology
Bongtae Han – University of Maryland

4. Effect of Passivation and Mechanical Constraint on Electromigration in Interconnect
Xuejun Fan – Lamar University
Zhen Cui – Delft University of Technology
Guoqi Zhang – Delft University of Technology

5. Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology
Saskia Gesche Huber – Fraunhofer IZM
Andreas Stegmaier – Fraunhofer IZM
Marius van Dijk – Fraunhofer IZM
Nina Nguyen – Fraunhofer IZM
Ole Hoelck – Fraunhofer IZM
Olaf Wittler – Fraunhofer IZM
Martin Schneider-Ramelow – Fraunhofer IZM

6. Enhancement of Thermal Transient Prediction Accuracy for Mobile AP Package
Hwanjoo Park – Samsung Electronics Co., Ltd.
Jonggyu Lee – Samsung Electronics Co., Ltd.
Taehwan Kim – Samsung Electronics Co., Ltd.
Sunggu Kang – Samsung Electronics Co., Ltd.
Sungho Mun – Samsung Electronics Co., Ltd.
Jaechoon Kim – Samsung Electronics Co., Ltd.
Dan Oh – Samsung Electronics Co., Ltd.

7. FO-EB-T Package Characterization and Evaluation
Vito Lin – SPIL
Andrew Kang – SPIL
Yu-Po Wang – SPIL