Technical Program

Friday, June 03, 2022

Session 31: Fan-Out Packaging Technologies and Applications
1:30 PM - 5:10 PM
Committee: Packaging Technologies
Room: Silver Pearl 1

Session Co-Chairs:

Sam Karikalan
Broadcom Inc.
[email protected]
Kuo-Chung Yee
Taiwan Semiconductor Manufacturing Corporation, Inc.
[email protected]

Papers:

1. Fan-Out Wafer Level Package for Memory Applications
Ho-Young Son - SK Hynix
Ki-Jun Sung - SK Hynix
Bok-Kyu Choi - SK Hynix
Jong-Hoon Kim - SK Hynix
Kangwook Lee - SK Hynix

2. Substrate Silicon Wafer Integrated Fan-Out Technology (S-SWIFT) Packaging with Fine Pitch Embedded Trace RDL
SangHyun Jin - Amkor Technology
WonChul Do - Amkor Technology
JinSuk Seong - Amkor Technology
HyunGoo Cha - Amkor Technology
YunKyung Jeong - Amkor Technology
JinYoung Khim - Amkor Technology

3. Advanced Fan-Out Packaging Technology for Hybrid Substrate Integration
Lihong Cao - ASE Group
Teck Chong Lee - ASE Group
Rick Chen - ASE Group
Yung-Shun Chang - ASE Group
Hsingfu Lu - ASE Group
Nicholas Chao - ASE Group
Yen-Liang Huang - ASE Group
Chen-Chao Wang - ASE Group
Chih-Yi Huang - ASE Group

4. Advanced Chip Last Process Integration for Fan-Out Wafer Level Packaging (WLP)
Taewon Yoo - Samsung Electronics Co., Ltd.
Seok Hyun Lee - Samsung Electronics Co., Ltd.
Kyoung Lim Suk - Samsung Electronics Co., Ltd.
Eung Kyu Kim - Samsung Electronics Co., Ltd.
Won Kyoung Choi - Samsung Electronics Co., Ltd.
Dae-Woo Kim - Samsung Electronics Co., Ltd.
Dong Wook Kim - Samsung Electronics Co., Ltd.

5. Development of Two-Tier FO-WLP AiPs for Automotive Radar Application
Soon Wee Ho - Institute of Microelectronics (IME), A*STAR
Hsiang-Yao Hsiao - Institute of Microelectronics (IME), A*STAR
Boon Long Lau - Institute of Microelectronics (IME), A*STAR
Sharon Pei Siang Lim - Institute of Microelectronics (IME), A*STAR
Teck Guan Lim - Institute of Microelectronics (IME), A*STAR
Tai Chong Chai - Institute of Microelectronics (IME), A*STAR

6. Chip-Last FOWLP Based Antenna-in-Package (FO-AiP) for 5G mmWave Application
Klaus Ahn - nepes Corporation
Jade Park - nepes Corporation
Bruce Lee - nepes Corporation
Lewis Kang - nepes Corporation
Jay Kim - nepes Corporation
Kyeongrok Shin - nepes Corporation
Sung Hyuk Kim - nepes Corporation
Jea-Duck Lee - nepes Corporation
Myoung Kee Kim - nepes Corporation
Ho-Seon Lee - RFcore, Ltd.
Byeong-Gyu Park - RFcore, Ltd.

7. A Heterogeneously Integrated and Flexible Inorganic Micro-Display on FlexTRATE(TM) Using Fan-Out Wafer-Level Packaging and Color Conversion Layers
Henry Sun - University of California, Los Angeles
Goutham Ezhilarasu - University of California, Los Angeles
Guangqi Ouyang - University of California, Los Angeles
Randall Irwin - University of California, Los Angeles
Subramanian S. Iyer - University of California, Los Angeles