Technical Program

Program Sessions: Friday June 2nd 2:00 PM – 5:05 PM

Session 31: MEMS Sensor, Bio, and Advanced Interconnect Reliability
Committees: Packaging Technologies and Applied Reliability
Room: Palazzo D

Session Co-Chairs:

Young-Gon Kim
Renesas Electronics America
Email: [email protected]

Keith Newman
Advanced Micro Devices, Inc.
Email: [email protected]


1. Enabling Backside Processing for Perforated Microfluidic Devices
Jakob Visker – imec
Yang Han – imec
Evert Visker – imec
Chi Dang Thi Thuy – imec
Mateusz Gocyla – imec
Jan Ackaert – imec
Aurelie Humbert – imec
Serge Vanhaelemeersch – imec
Lan Peng – imec

2. Wafer Level Chip Scale Package Technology Applied to MEMS Pressure Sensor
Luca Maggi – STMicroelectronics
Marco Del Sarto – STMicroelectronics
Tiziano Chiarillo – STMicroelectronics
Enri Duqi – STMicroelectronics
Lorenzo Baldo – STMicroelectronics
Adriano Abbisogni – STMicroelectronics

3. A Novel FOWLP Method to Integrate Delicate MEMS Components
Markus Woehrmann – Fraunhofer IZM
Marc Dreissigacker – Technical University Berlin
Tanja Braun – Fraunhofer IZM
Michael Schiffer – Fraunhofer IZM
Martin Schneider-Ramelow – Fraunhofer IZM

4. Development of High Reliability 6 µm-Pitch Cu-Cu Connections Using over-400 mm²-Large Chip on Wafer Bonding Process
Takahiro Kamei – Sony Semiconductor Solutions Corporation
Hirotaka Yoshioka – Sony Semiconductor Solutions Corporation
Tatsumasa Hiratsuka – Sony Semiconductor Solutions Corporation
Akihisa Sakamoto – Sony Semiconductor Solutions Corporation
Kan Shimizu – Sony Semiconductor Solutions Corporation
Hayato Iwamoto – Sony Semiconductor Solutions Corporation

5. A Comprehensive Study of Solder Joint Reliability Dependent on Temperature Cycling Profiles and Material Selections with Emphasis on an Improved Solder Fatigue Lifetime Model
Bongchan Son – SK hynix, Inc.
Seung-Hyun Chae – SK hynix, Inc.
SeungKwon Noh – SK hynix, Inc.
KilJae Lee – SK hynix, Inc.
Sangdeok Kim – SK hynix, Inc.

6. Electromigration Performance of Fine-Line Cu Redistribution Layer (RDL) for High-Density Fan-Out Packaging
JiHye Kwon – Amkor Technology Korea
JeongMin Ju – Amkor Technology Korea
EunSook Sohn – Amkor Technology Korea
JinYoung Khim – Amkor Technology Korea

7. Simulation-Assisted Board Level Solder Joint Reliability Optimization for Large 80 mm+ 2.5D Devices
Omar Ahmed – Juniper Networks
Vishnu Shukla – University of Central Florida
Leif Hutchinson – Juniper Networks
Peng Su – Juniper Networks
Bernard Glasauer – Juniper Networks
Tengfei Jiang – University of Central Florida