Technical Program

Friday, June 03, 2022

Session 30: High-Speed Challenges in Power and Signal Integrity
8:00 AM - 11:40 AM
Committee: RF, High-Speed Components & Systems
Room: Coral 5

Session Co-Chairs:

Amit Agrawal
Microchip Technologies
[email protected]
Chuei-Tang Wang
Taiwan Semiconductor Manufacturing Company (TSMC)
[email protected]

Papers:

1. Novel Power Delivery Network Design and Pre-Silicon Validation Supporting Heterogeneous Dies on a Single Package
Judy Amanor-Boadu - Intel Coorporation
Rishik Bazaz - Intel Corporation
Priyanka Bakliwal - Intel Corporation

2. Integration of Foundry MIM Capacitor and OSAT Fan-Out RDL for High Performance RF Filters
Pao-Nan Lee - ASE Group
Yu-Chang Hsieh - ASE Group
Hung-Lun Lo - WIN Semiconductors Corp.
Chang Ho Li - WIN Semiconductors Corp.
Fan-Hsiu Huang - WIN Semiconductors Corp.
James Lin - WIN Semiconductors Corp.
Wei-Chu Hsu - ASE Group
Chen-Chao Wang - ASE Group

3. Optimization of 2.5D Organic Interposer Channel for Die and Chiplets
Srikrishna Sitaraman - Applied Materials, Inc.
Steven Verhaverbeke - Applied Materials, Inc.
Samer Banna - Applied Materials, Inc.
Mukhles Sowwan - Applied Materials, Inc.
Liu Jiang - Applied Materials, Inc.
El Mehdi Bazizi - Applied Materials, Inc.
Blessy Alexander - Applied Materials, Inc.
Buvna Ayyagari-Sangamalli - Applied Materials, Inc.

4. Reference Clock Assessment Techniques for PCIe Gen5 and Beyond
Matt Doyle - IBM Corporation
Matteo Cocchini - IBM Corporation
Layne Berge - IBM Corporation
Dale Becker - IBM Corporation
Matteo Cocchini - IBM Corporation
Jason Bjorgaard - IBM Corporation

5. Co-Design and Signal-Power Integrity/EMI Co-Analysis of a Switchable High-Speed Inter-Chiplet Serial Link on an Active Interposer
Min Miao - Beijing Information Science & Technology University
Xiaolong Duan - Beijing Information Science & Technology University
Liang Sun - Beijing Information Science & Technology University
Tao Li - Beijing Information Science & Technology University
Shiliang Zhu - Beijing Information Science & Technology University
Zhuanzhuan Zhang - Beijing Information Science & Technology University
Jin Li - Beijing Information Science & Technology University
Danya Zhang - Beijing Information Science & Technology University
Hao Wen - Beijing Information Science & Technology University
Xuena Liu - Beijing Information Science & Technology University
Zhensong Li - Beijing Information Science & Technology University

6. Fast Channel Analysis and Design Approach Using Deep Learning Algorithm for 112Gbs HSI Signal Routing Optimization
Sodam Han - Samsung Electronics Co., Ltd.
Sungwook Moon - Samsung Electronics Co., Ltd.
Seungki Nam - Samsung Electronics Co., Ltd.
Jiyoung Park - Samsung Electronics Co., Ltd.
Sangin You - Samsung Electronics Co., Ltd.
Jungil Son - Samsung Electronics Co., Ltd.

7. Package Design and Measurements for Radar Emulator Using Accelerators and Photonics
Mercy Daniel-Aguebor - Georgia Institute of Technology
Mutee Ur Rehman - Georgia Institute of Technology
Serhat Erdogan - Georgia Institute of Technology
Kyoung-sik Moon - Georgia Institute of Technology
Nikita Ambasana - Georgia Institute of Technology
Saibal Mukhopadhya - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology
Liang Yuan Dai - Columbia University
Keren Bergman - Columbia University
Daniel Jang - Columbia University
Mingoo Seok - Columbia University