Technical Program
Program Sessions: Friday June 2nd 9:30 AM – 12:35 PM
Session 30: Trends in Encapsulants and Low Dk/Df Dielectrics
Committee: Materials & Processing
Room: Mediterranean 7 & 8
Session Co-Chairs:
Tanja Braun
Fraunhofer IZM
Email: [email protected]
Kimberly Yess
Brewer Science, Inc.
Email: [email protected]
Papers:
1. Liquid Compression Mold Underfill Optimization With Low Warpage and Narrow Gap Flow
Tsuyoshi Kamimura – NAMICS Corporation
Shinichi Sato – NAMICS Corporation
Brian Schmaltz – NAMICS Technologies, Inc.
Yuto Shigeno – NAMICS Corporation
2. Effect of High-Temperature Exposure on the Thermo-Mechanical Behavior of Epoxy Molding Compound and Warpage of Molded Wafers
Junmo Kim – Korea Advanced Institute of Science and Technology
Myoung Song – Korea Advanced Institute of Science and Technology
Chang-Yeon Gu – Korea Advanced Institute of Science and Technology
Min Sang Ju – Korea Advanced Institute of Science and Technology
Sung Woo Ma – SK Hynix, Inc.
Jin Hee Lee – SK Hynix, Inc.
Woong-Sun Lee – SK Hynix, Inc.
Taek-Soo Kim – Korea Advanced Institute of Science and Technology
3. Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films
Xinrui Ji – Delft University of Technology
Henk Van Zeijl – Delft University of Technology
Weiping Jiao – Delft University of Technology
Shan He – Delft University of Technology
Leiming Du – Delft University of Technology
Guoqi Zhang – Delft University of Technology
4. Novel Low Dk/Df Photoimageable Dielectric for Redistribution Layer
Guillermo Fernandez Zapico – Resonac Corporation
Fumihiko Kawauchi – Resonac Corporation
Shinya Kawashita – Resonac Corporation
Manabu Hirasawa – Resonac Corporation
Kitaru Sato – Resonac Corporation
Tetsuya Imai – Resonac Corporation
Hidekazu Kondo – Resonac Corporation
Tatsuya Makino – Resonac Corporation
5. Novel Photo-Definable Low Dk & Df Polyimide for Advanced Package of High Frequency Application
Hitoshi Araki – Toray Industries, Inc.
Akira Shimada – Toray Industries, Inc.
Hisashi Ogasawara – Toray Industries, Inc.
Masaya Jukei – Toray Industries, Inc.
Masao Tomikawa – Toray Industries, Inc.
6. Novel Low Dk/Df Film for High Frequency Substrate and RDL
Meiten Koh – Taiyo Ink Mfg. Co., Ltd.
Kazuyoshi Yoneda – Taiyo Ink Mfg. Co., Ltd.
Kazutaka Nakada – Taiyo Ink Mfg. Co., Ltd.
Yoshitomo Aoyama – Taiyo Ink Mfg. Co., Ltd.
Kasumi Hashimoto – Taiyo Ink Mfg. Co., Ltd.
Kota Oki – Taiyo Ink Mfg. Co., Ltd.
7. Properties of Low Dielectric Constant Build Up Materials Containing Micron Sized Hollow Silica
Preeya Kuray – AGC Inc.
Tom McCarthy – AGC Multi Material America, Inc.
Caleb Ancharski – AGC Multi Material America, Inc.
Yoji Nakajima – AGC Multi Material America, Inc.
