1. High Density Integration of Silicon Photonic Chiplets for 51.2T Co-Packaged Optics
Sukeshwar Kannan — Broadcom, Inc.
Ray Chang — Broadcom, Inc.
Hari Potluri — Broadcom, Inc.
Sheng Zhang — Broadcom, Inc.
Jay Li — Siliconware Precision Industries Co., Ltd.
Bruce Xu — Siliconware Precision Industries Co., Ltd.
Hsi-Chang Hsu — Siliconware Precision Industries Co., Ltd.
2. Ultra Low-Loss Ion-Exchange Waveguides in Optimized Alkali Glass for Co-Packaged Optics
Lars Brusberg — Corning Research and Development Corp.
Matthew J. Dejneka — Corning Research and Development Corp.
Chukwudi A. Okoro — Corning Research and Development Corp.
David J. McEnroe — Corning Research and Development Corp.
Aramais R. Zakharian — Corning Research and Development Corp.
Chad C. Terwilliger — Corning Research and Development Corp.
3. A Surface-Mount Photonic Package With a Photonic-Wire-Bonded Glass Interposer as a Hybrid Integration Platform for Co-Packaged Optics
Hiroshi Uemura — Sumitomo Electric Industries, Ltd.
Taichi Misawa — Sumitomo Electric Industries, Ltd.
Yasutaka Mizuno — Sumitomo Electric Industries, Ltd.
Hajime Arao — Sumitomo Electric Industries, Ltd.
Tetsuya Nakanishi — Sumitomo Electric Industries, Ltd.
Keiji Tanaka — Sumitomo Electric Industries, Ltd.
Tomomi Sano — Sumitomo Electric Industries, Ltd.
Katsumi Uesaka — Sumitomo Electric Industries, Ltd.
Mami Miyairi — FICT LIMITED
Yoshikatsu Ishizuki — FICT LIMITED
Taiji Sakai — FICT LIMITED
Yoichiro Kurita — Tokyo Institute of Technology
4. Development of All-Photonics-Function Embedded Package Substrate Using 2.3D RDL Interposer for Co-Packaged Optics
Akihiro Noriki — National Institute of Advanced Industrial Science and Technology
Hirotaka Uemura — Kyocera Corporation
Haruhiko Kuwatsuka — Kyocera Corporation
Naoki Matsui — Kyocera Corporation
Reona Motoji — Kyocera Corporation
Dan Maeda — Kyocera Corporation
Tomoya Sugita — Kyocera Corporation
Fumi Nakamura — National Institute of Advanced Industrial Science and Technology
Satoshi Suda — National Institute of Advanced Industrial Science and Technology
Takayuki Kurosu — National Institute of Advanced Industrial Science and Technology
Takeru Amano — National Institute of Advanced Industrial Science and Technology
5. Advanced 3D Packaging of 3.2Tbs Optical Engine for Co-Packaged Optics (CPO) in Hyperscale Data Center Networks
Aparna Prasad — Cisco Systems, Inc.
Sandeep Razdan — Cisco Systems, Inc.
Paul Ton — Cisco Systems, Inc.
Cristiana Muzio — Cisco Systems, Inc.
6. 3D-Printed Beam Expanding Lens for Chip to Fiber Vertical Coupling
Yasutaka Mizuno — Sumitomo Electric Industries, Ltd.
Hiroshi Uemura — Sumitomo Electric Industries, Ltd.
Tomoya Saeki — Sumitomo Electric Industries, Ltd.
Keiji Tanaka — Sumitomo Electric Industries, Ltd.
Katsumi Uesaka — Sumitomo Electric Industries, Ltd.
7. Characterization of QSFP and OSFP CPO ELS Modules Employing an 8-channel CWDM TOSA in Practical Air-Cooling Conditions
Kohei Umeta — Furukawa Electric Co., Ltd.
Taketsugu Sawamura — Furukawa Electric Co., Ltd.
Kyoko Nagai — Furukawa Electric Co., Ltd.
Yuki Shiroishi — Furukawa Electric Co., Ltd.
Hideyuki Nasu — Furukawa Electric Co., Ltd.
