Technical Program
Program Sessions: Friday June 2nd 9:30 AM – 12:35 PM
Session 29: AI-based Prediction for Heterogeneous Integration and Advanced Packaging
Committee: Thermal/Mechanical Simulation & Characterization
Room: Mediterranean 6
Session Co-Chairs:
Patrick McCluskey
University of Maryland
Email: [email protected]
Rui Chen
Georgia Institute of Technology
Email: [email protected]
Papers:
1. Feasibility Investigation of Machine Learning for Electronic Reliability Analysis Using FEA
Robert David Johannes
Hoehne – TU Dresden
Yichen Qi – TU Dresden
Oliver Albrecht – TU Dresden
Karsten Meier – TU Dresden
Karlheinz Bock – TU Dresden
2. NAND Package Warpage Prediction and Design With Tolerance Through Machine Learning
Yuhang Yang – Western Digital Technologies, Inc.
Chaolun Zheng – Western Digital Technologies, Inc.
Min Lin – Western Digital Technologies, Inc.
Tim Huang – Western Digital Corporation
Hedan Zhang – Western Digital Corporation
Ning Ye – Western Digital Corporation
Bo Yang – Western Digital Corporation
3. Reduced-Order Models of Digital Twin Applications for Design Platform of Flexible Hybrid Electronics
Chang-Chun Lee – National Tsing Hua University
Jui-Chang Chuang – Industrial Technology Research Institute
Chen-Tsai Yang – Industrial Technology Research Institute
Chung-I Li – Industrial Technology Research Institute
4. Methodology of Artificial Intelligence Aided Hybrid Modeling on Solder Joint Reliability Study of BGA Package
ling pan – Micron Semiconductor Asia Operations Pte. Ltd
Faxing Che – Micron Semiconductor Asia Operations Pte. Ltd
Yeow Chon Ong – Micron Semiconductor Asia Operations Pte. Ltd
hong wan ng – Micron Semiconductor Asia Operations Pte. Ltd
Gokul Kumar – Micron Technology, Inc.
5. Effect of Li-ion Battery Form Factor on the SoH Degradation Under Randomized Charge-Discharge Cycles and C-Rates
Pradeep Lall – Auburn University
Ved Soni – Auburn University
6. AI-Enabled Molding Compound Selection Method for Warpage Control of Fan-Out Panel-Level Package
Peilun Yao – Hong Kong University of Science and Technology
Yonglin Zhang – Hong Kong University of Science and Technology
Haibin CHEN – Hong Kong University of Science and Technology (Guangzhou)
Haibo Fan – Nexperia HK, Ltd.
Jingshen Wu – Hong Kong University of Science and Technology (Guangzhou)
Jinglei Yang – Hong Kong University of Science and Technology
Anthony Cheung – Nexperia HK, Ltd.
7. Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications
Aakrati Jain – IBM Research
Risa Miyazawa – IBM Research, Tokyo
Sathya Raghavan – IBM Research
Prabudhya Roy Chowdhury – IBM Research
Mukta Ghate Farooq – IBM Research
Arvind Kumar – IBM Research
Katsuyuki Sakuma – IBM Research
