Technical Program

Friday, June 03, 2022

Session 27: Interconnection Reliability
8:00 AM - 11:40 AM
Committee: Applied Reliability
Room: Silver Pearl 3

Session Co-Chairs:

René Rongen
NXP Semiconductors
[email protected]
Seung-Hyun Chae
SK Hynix
[email protected]

Papers:

1. Thermal Cycling Induced Interconnect Stability Degradation Mechanism in Low Melting Temperature Solder Joints
Kendra Young - Portland State University
Raiyo Aspandiar - Intel Corporation
Nilesh Badwe - Indian Institute of Technology Kanpur
Satyajit Walwadkar - Intel Corporation
Young-Woo Lee - MK Electron
Tae-Kyu Lee - Cisco Systems, Inc.

2. Interconnection Reliability of Mini LEDs for Display Applications
In-Seok Kye - Electronics and Telecommunications Research Institute
Jiho Joo - Electronics and Telecommunications Research Institute
Gwang-Mun Choi - Electronics and Telecommunications Research Institute
Chanmi Lee - Electronics and Telecommunications Research Institute
Ki-Seok Jang - Electronics and Telecommunications Research Institute
Yong-Sung Eom - Electronics and Telecommunications Research Institute
Kwang-Seong Choi - Electronics and Telecommunications Research Institute
Yong-Jun Oh - Hanbat National University

3. Study of Long-Term Solder Joint and Board-Level Reliability Performance of Thin Nickel Plating ENEPIG Laminate LGA Package
Seok Phyo Tchun - Analog Devices
Joo Yeop Kim - Analog Devices
Arun Raj - Analog Devices

4. Process-Reliability Relationships of SnBiAg and SnIn Solders for Component Attachment on Flexible Direct-Write Additive Circuits in Wearable Applications
Pradeep Lall - Auburn University
Jinesh Narangaparambil - Auburn University
Scott Miller - NextFlex National Manufacturing Institute

5. Fabrication and Reliability Analysis of Quasi-Single Crystalline Cu Joints by Using Highly <111>-Oriented Nanotwinned Cu
Jia-Juen Ong - National Yang Ming Chiao Tung University
Dinh-Phuc Tran - National Yang Ming Chiao Tung University
You-Yi Lin - National Yang Ming Chiao Tung University
Po-Ning Hsu - National Yang Ming Chiao Tung University
Chih Chen - National Yang Ming Chiao Tung University

6. A Comparative Study of the Thermomechanical Reliability of Fully Filled and Conformal Through Glass Via (TGV)
Ke Pan - Binghamton University
Yangyang Lai - Binghamton University
Seungbae Park - Binghamton University
Chukwudi Okoro - Corning Corporation
Dhananjay Joshi - Corning Corporation
Scott Pollard - Corning Corporation

7. Broadband Characterization of Polymers Under Reliability Stresses and Impact of Capping Layer
Nicolas Pantano - Imec
Emmanuel Chery - Imec
Maaike Op de Beeck - Imec
John Slabbekoorn - Imec
Eric Beyne - Imec