Technical Program

Friday, June 03, 2022

Session 26: Soldered and Sintered Interconnections
8:00 AM - 11:40 AM
Committee: Interconnections
Room: Silver Pearl 2

Session Co-Chairs:

Bernd Ebersberger
Infineon Technologies
[email protected]
Changqing Liu
Loughborough University
[email protected]

Papers:

1. Novel Ag Salt Paste for Large Area Cu-Cu Bonding in Low Temperature Low Pressure and Air Condition
Chuantong Chen - Osaka University
Bowen Zhang - Osaka University
Katsuaki Suganuma - Osaka University
Takuya Sekiguchi - Toppan Forms Co., Ltd.

2. Bonding Properties of Cu Paste in Low Temperature Pressureless Processes
Satoshi Konno - Mitsui Mining & Smelting Co., Ltd.
Takashi Hattori - Mitsui Mining & Smelting Co., Ltd.
Shinichi Yamauchi - Mitsui Mining & Smelting Co., Ltd.
Kei Anai - Mitsui Mining & Smelting Co., Ltd.

3. Tight-Pitched 10 ┬Ám-Width Solder Joints for c-2-c and c-2-w 3D-Integration in NCF Environment
M. Mariappan - Global INTegration Initiative
S. Fukuzumi - Showa Denko Materials
T. Shibata - Showa Denko Materials
H. Hashimoto - Global INTegration Initiative
J. Bea - Global INTegration Initiative
M. Koyanagi - T-Micro
T. Fukushima - Global INTegration Initiative

4. Influence of Micro-Voids in Flip Chip Bump on Electromigration Reliability
Kei Murayama - Shinko Electric Industries Co., Ltd.
Kor Lee - Intel Corporation
Toshiaki Ono - Nordson ES
Kiyoshi Oi - Shinko Electric Industries Co., Ltd.
Sze Lim - Indium Corporation
Yvonne Yeo - IBM Corporation
Keith Sweatman Martell - Nippon Superior Co., Ltd.
Haruo Shimamoto - National Institute of Advanced Industrial Science and Technology
Masahiro Tsuriya - iNEMI

5. Study of Failure and Microstructural Evolution in SAC Solder Interconnects Induced by AC Electromigration Condition
Yi Ram Kim - University of Texas at Arlington
Allison Osmanson - University of Texas at Arlington
Choong-Un Kim - University of Texas at Arlington
Patrick Thompson - Texas Instruments
Qiao Chen - Texas Instruments

6. A Study on Warpage and Reflow Profile for Extreme Extension of Mass Reflow Bonding
Ji-won Shin - Samsung Electronics Co., Ltd.
Dong-uk Kwon - Samsung Electronics Co., Ltd.
Young Ja Kim - Samsung Electronics Co., Ltd.
Young Min Lee - Samsung Electronics Co., Ltd.
Dong Woo Kang - Samsung Electronics Co., Ltd.
Haoxiang Ren - University of California, Los Angeles
Krutikesh Sahoo - University of California, Los Angeles
Yu-Pei Huang - University of California, Los Angeles
Yutao Yang - University of California, Los Angeles
Ankit Kuchhangi - University of California, Los Angeles
Subramanian S. Iyer - University of California, Los Angeles

7. Low Temperature Formation of SAC-SnBi BGA Interconnections Using Solid Liquid Inter-Diffusion (SLID)
Divya Taneja - IBM Corporation
David Danovitch - University of Sherbrooke
Malak Kanso - University of Sherbrooke
Richard Langlois - IBM Corporation
Nicolas Boyer - IBM Corporation
Eric Dalpe - IBM Corporation