Technical Program

Program Sessions: Friday June 2nd 9:30 AM – 12:35 PM

Session 26: Materials Reliability
Committee: Applied Reliability
Room: Palazzo A & B

Session Co-Chairs:

Tae-Kyu Lee
Cisco Systems, Inc.
Email: [email protected]

Darvin R. Edwards
Edwards Enterprise Consulting, LLC
Email: [email protected]


1. Control of Solder Microstructure Stimulated by Interface Condition of the UBM/Solder and Enhancement of Electromigration Reliability
Hariram Mohanram – University of Texas, Arlington
Yi-Ram Kim – University of Texas, Arlington
Geng Ni – University of Texas, Arlington
Choongun Kim – University of Texas, Arlington
Sylvester Ankamah-Kusi – Texas Instruments, Inc.
Qiao Chen – Texas Instruments, Inc.
Patrick Thompson – Texas Instruments, Inc.

2. Al2O3-Coated Bond Wire With Adhesion Promoter and Electrical Insulation
Soojae Park – Samsung Electronics Co., Ltd.

3. Evolution of Propensity for High Strain-Rate Damage Accrual in Doped and Undoped SnAgCu Lead-Free Solders in Temperature Range of -65 °C to +200 °C After 1-Year Sustained High Temperatures Exposure
Pradeep Lall – Auburn University
Vishal Mehta – Auburn University
Vikas Yadav – Auburn University
Mrinmoy Saha – Auburn University
Jeffrey Suhling – Auburn University

4. Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer
Ji-Youn Kwak – University of Ulsan
Emmanuel Chery – imec
John Slabbekoorn – imec
Julien Bertheau – imec
Joke De Messemaeker – imec
Eric Beyne – imec

5. SAC/LTS Hybrid Solder Joint in BGA Package: Identification of Mechanical Weak Spots and End-of-Life Joint Failure Prediction
Lip Teng Saw – Western Digital Corporation
Mutharasu Devarajan – Western Digital Corporation
Puurnaraj Nadarajah – Western Digital Corporation

6. The Failure Mechanisms of Bonding Between Copper Substrate and Encapsulation Epoxy Under High-Temperature Aging
Shuaijie Zhao – Osaka University
Chuantong Chen – Osaka University
Minoru Ueshima – Daicel Corporation
Motoharu Haga – Daicel Corporation
Katsuaki Suganuma – Osaka University

7. Copper Wire Degradation Under the Effect of Different Humidity Levels
Michael Joo Zhong Lim – Nanyang Technological University
Hai Guan Loh – Infineon Technologies Asia Pacific Pte. Ltd.
Michael Goroll – Infineon Technologies AG
Zhong Chen – Nanyang Technological University
Chuan Seng Tan – Nanyang Technological University