Technical Program
Program Sessions: Friday June 2nd 9:30 AM – 12:35 PM
Session 26: Materials Reliability
Committee: Applied Reliability
Room: Palazzo A & B
Session Co-Chairs:
Tae-Kyu Lee
Cisco Systems, Inc.
Email: [email protected]
Darvin R. Edwards
Edwards Enterprise Consulting, LLC
Email: [email protected]
Papers:
1. Control of Solder Microstructure Stimulated by Interface Condition of the UBM/Solder and Enhancement of Electromigration Reliability
Hariram Mohanram – University of Texas, Arlington
Yi-Ram Kim – University of Texas, Arlington
Geng Ni – University of Texas, Arlington
Choongun Kim – University of Texas, Arlington
Sylvester Ankamah-Kusi – Texas Instruments, Inc.
Qiao Chen – Texas Instruments, Inc.
Patrick Thompson – Texas Instruments, Inc.
2. Al2O3-Coated Bond Wire with Adhesion Promoter & Electrical Insulation
Soojae Park – OxWires Co., Ltd.
Soohyun Jo – OxWires Co., Ltd.
Sichun Seo – Samsung Electronics Co., Ltd.
Chulhyung Cho – Samsung Electronics Co., Ltd.
Eulgi Min – NCD Co., Ltd.
Kyujung Choi – NCD Co., Ltd.
3. Evolution of Propensity for High Strain-Rate Damage Accrual in Doped and Undoped SnAgCu Lead-Free Solders in Temperature Range of -65 °C to +200 °C After 1-Year Sustained High Temperatures Exposure
Pradeep Lall – Auburn University
Vishal Mehta – Auburn University
Vikas Yadav – Auburn University
Mrinmoy Saha – Auburn University
Jeffrey Suhling – Auburn University
4. Reliability Investigations of Polymer Based Redistribution Layers (RDL) Protected by a Mold Layer
Ji-Youn Kwak – University of Ulsan
Emmanuel Chery – imec
John Slabbekoorn – imec
Julien Bertheau – imec
Joke De Messemaeker – imec
Eric Beyne – imec
5. Ionic Sensor Package Design for the Survivability in a Drop/Impact During Deployment
Pengcheng Yin – Binghamton University
Jong Hwan Ha – Binghamton University
Junbo Yang – Binghamton University
Yangyang Lai – Binghamton University
Seungbae Park – Binghamton University
Biju Jacob – GE Research
Arun Gowda – GE Research
6. Effects of Twin Boundary and Precipitates on Board Level Reliability in Sn-Ag-Cu (SAC) Solder Joints Through EBSD Analysis
DalJin Yoon – SK hynix, Inc.
Byoungdo Lee – SK hynix, Inc.
Jihye Kim – SK hynix, Inc.
Sungho Hyun – SK hynix, Inc.
Gyujei Lee – SK hynix, Inc.
Kangwook Lee – SK hynix, Inc.
7. Copper Wire Degradation Under the Effect of Different Humidity Levels
Michael Joo Zhong Lim – Nanyang Technological University
Hai Guan Loh – Infineon Technologies Asia Pacific Pte. Ltd.
Michael Goroll – Infineon Technologies AG
Zhong Chen – Nanyang Technological University
Chuan Seng Tan – Nanyang Technological University
