Session 26 – ECTC

Technical Program

Program Sessions: Friday May 31st 9:30 AM – 12:35 PM

Session 26: Chiplet Interconnect Design and Validation
Committees: Interconnections and RF, High-Speed Components & Systems
Room:

Session Co-Chairs:

Gang Duan
Intel
Email: [email protected]

Jaemin Shin
Qualcomm Technologies
Email: [email protected]

Papers:

1. Impact of Pitch Scaling on 3D Die-to-Die Interconnects
Nicolas Pantano — imec
Michele Stucchi — imec
Geert Van Der Plas — imec
Eric Beyne — imec

2. A 32GB/s Full Duplex Bi-Directional Transceiver With Crosstalk Cancellation for Chiplet Interconnections
Jae-Woo Park — Sungkyunkwan University
Nicolas Pantano — imec
Geert Van Der Plas — imec
Eric Beyne — imec
Jung-Hoon Chun — Sungkyunkwan Univiversity

3. Modeling and Analysis of Heterogeneously Integrated Chiplet-to-Chiplet Communication Link in 2.5D Advanced Packaging
Haofeng Sun — University of Illinois
Bobi Shi — University of Illinois
Thong Nguyen — University of Illinois
Jose Schutt-Aine — University of Illinois

4. Signal, Power and Thermal Co-Optimization Methodology for FPGA Advanced Package
Wei Liu — Intel Corporation
Guang Chen — Intel Corporation
Brian Wang — Intel Corporation
Jenny Xiaohong Jiang — Intel Corporation
Ed Milligan — Intel Corporation

5. An Advanced Packaging Figure of Merit (AP-FoM) for Benchmarking of Heterogeneous Integration Technologies
Chuei-Tang Wang — Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-An Shang — Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Ming Hsiao — Taiwan Semiconductor Manufacturing Company, Ltd.
Mirng-Ji Lii — Taiwan Semiconductor Manufacturing Company, Ltd.
Kam Heng Lee — Taiwan Semiconductor Manufacturing Company, Ltd.
Jun He — Taiwan Semiconductor Manufacturing Company, Ltd.

6. Signal Integrity Designs at Organic Interposer CoWoS-R for HBM3-9.2Gbps High Speed Interconnection of 2.5D-IC Chiplets Integration
Sheng-Fan Yang — Global Unichip Corporation
Wei-Chiao Wang — Global Unichip Corporation
Yi-Tzeng Lin — Global Unichip Corporation
Chih-Chiang Hung — Global Unichip Corporation
Hao-Yu Tung — Global Unichip Corporation
Justin Hsieh — Global Unichip Corporation

7. Effective Interface Simulation Approach Based on Peak Distortion Analysis for UCIe IPs
Joonhyun Kim — Samsung Electronics Co., Ltd.
Seungki Nam — Samsung Electronics Co., Ltd.
Sungwook Moon — Samsung Electronics Co., Ltd.
Taeyun Kim — Samsung Electronics Co., Ltd.
Sangin You — Samsung Electronics Co., Ltd.
Chanmin Jo — Samsung Electronics Co., Ltd.
Yongho Lee — Samsung Electronics Co., Ltd.