Technical Program

Friday, June 03, 2022

Session 25: Advancements in 2.5D and 3D Packaging Technology
8:00 AM - 11:40 AM
Committee: Packaging Technologies
Room: Silver Pearl 1

Session Co-Chairs:

John Knickerbocker
IBM Corporation
[email protected]
Subhash L. Shinde
Notre Dame University
[email protected]

Papers:

1. A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology
Sanghoon Lee - Samsung Electronics Co., Ltd.
Youngkun Jee - Samsung Electronics Co., Ltd.
SangCheon Park - Samsung Electronics Co., Ltd.
Soohwan Lee - Samsung Electronics Co., Ltd.
Bohee Hwang - Samsung Electronics Co., Ltd.
Gyeongjae Jo - Samsung Electronics Co., Ltd.
Chungsun Lee - Samsung Electronics Co., Ltd.
Jeomyoung Park - Samsung Electronics Co., Ltd.
Unbyoung Kang - Samsung Electronics Co., Ltd.
Jongho Lee - Samsung Electronics Co., Ltd.

2. High Performance and Energy Efficient Computing with Advanced SoICTM Scaling
S. W. Liang - Taiwan Semiconductor Manufacturing Company, Ltd.
Gene C. Y. Wu - Taiwan Semiconductor Manufacturing Company, Ltd.
K. C. Yee - Taiwan Semiconductor Manufacturing Company, Ltd.
C. T. Wang - Taiwan Semiconductor Manufacturing Company, Ltd.
Ji James Cui - Taiwan Semiconductor Manufacturing Company, Ltd.
Douglas C. H. Yu - Taiwan Semiconductor Manufacturing Company, Ltd.

3. Investigation of Moisture-Induced Warpage of Chip-on-Wafer in 2.5D IC Package
Shuai Shao - Xilinx, Inc.
Yi-Ting Chen - Xilinx, Inc.
Shih-Yen Chen - Xilinx, Inc.
Ken Lee - Xilinx, Inc.
Shin Low - Xilinx, Inc.
Inderjit Singh - Xilinx, Inc.

4. 3D Packaging for Heterogeneous Integration
Rahul Agarwal - Advanced Micro Devices, Inc.
Patrick Cheng - Advanced Micro Devices, Inc.
Priyal Shah - Advanced Micro Devices, Inc.
Brett Wilkerson - Advanced Micro Devices, Inc.
Raja Swaminathan - Advanced Micro Devices, Inc.
John Wuu - Advanced Micro Devices, Inc.
Chandrasekhar Mandalapu - Advanced Micro Devices, Inc.

5. Low Temperature Backside Damascene Processing on Temporary Carrier Wafer Targeting 7µm and 5µm Pitch Microbumps for N Equal and Greater Than 2 Die to Wafer TCB Stacking
Jaber Derakhshandeh - Imec
Eric Beyne - Imec
Gerald Beyer - Imec
Giovanni Capuz - Imec
Vladimir Cherman - Imec
Inge De Preter - Imec
Carine Gerets - Imec
Ehsan Shafahian - Imec
Koen Kennes - Imec
Geraldine Jamieson - Imec
Tom Cochet - Imec

6. Demonstration of a Glass-Based 3D Package Architectures with Embedded Dies for High-Performance Computing
Siddharth Ravichandran - Georgia Institute of Technology
Vanessa Smet - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology
Rao Tummala - Georgia Institute of Technology

7. 3DIC Stacking Process Investigation by Soldering Bonding Technology
Jay Li - Siliconware Precision Industries Co., Ltd.
Wei Jhen Chen - Siliconware Precision Industries Co., Ltd.
Joe Lin - Siliconware Precision Industries Co., Ltd.
Mu Hsuan Chan - Siliconware Precision Industries Co., Ltd.
Tank Lo - Siliconware Precision Industries Co., Ltd.
Bruce Xu - Siliconware Precision Industries Co., Ltd.
Liang Yih Hung - Siliconware Precision Industries Co., Ltd.
Nicholas Kao - Siliconware Precision Industries Co., Ltd.
Don Son Jiang - Siliconware Precision Industries Co., Ltd.
Yu-Po Wang - Siliconware Precision Industries Co., Ltd.