Technical Program

Program Sessions: Thursday June 1st 2:00 PM – 5:05 PM

Session 23: Next Generation Quantum, AI, and Secure System Design
Committee: Emerging Technologies
Room: Mediterranean 6

Session Co-Chairs:

Rohit Sharma
Indian Institute of Technology Ropar
Email: [email protected]

Santosh Kudtarkar
Analog Devices, Inc.
Email: [email protected]

Papers:

1. Thermal-Aware SoC Macro Placement and Multi-Chip Module (MCM) Package Design With Mixed-Variable Bayesian Optimization
Michael Molter – University of Illinois
Rahul Kumar – Georgia Institute of Technology
Sonja Koller – Intel Corporation
Osama Waqar Bhatti – Georgia Institute of Technology
Elyse Rosenbaum – University of Illinois
Madhavan Swaminathan – Georgia Institute of Technology

2. 3D Defect Detection and Metrology of HBMs Using Semi-Supervised Deep Learning
Ramanpreet Pahwa – Institute for Infocomm Research A*STAR
Richard Chang – Institute for Infocomm Research A*STAR
Jie Wang – Institute for Infocomm Research A*STAR
Ziyuan Zhao – Institute for Infocomm Research A*STAR
Chuan Sheng Foo – Institute for Infocomm Research A*STAR
Xun Xu – Institute for Infocomm Research A*STAR
Lile Cai – Institute for Infocomm Research A*STAR
Kangkang Lu – Institute for Infocomm Research A*STAR
Sharon Lim – Institute of Microelectronics A*STAR
Ser Choong Chong – Institute of Microelectronics A*STAR
Vempati Srinivasa Rao – Institute of Microelectronics A*STAR

3. A Si-Interposer With Buried Cu Metal Stripes and Bonded to Si-Substrate Backside for Security IC Chips
Takuya Wadatsumi – Kobe University
Rikuu Hasegawa – Kobe University
Kazuki Monta – Kobe University
Takaaki Okidono – SCU Co., Ltd.
Takuji Miki – Kobe University
Makoto Nagata – Kobe University

4. Physical Authentication of Electronic Devices Using Synthetically Generated 3D Material Signatures
Tejas Ravindra Kulkarni – Purdue University
Nikhilesh Chawla – Purdue University
Ganesh Subbarayan – Purdue University

5. Modeling and Analysis of CMOS-based Folded Memristive Crossbar Array for 3D Neuromorphic Integrated Circuits
Sherin A. Thomas – Indian Institute of Technology Ropar
Sahibia Kaur Vohra – Indian Institute of Technology Ropar
Suyash Kushwaha – Indian Institute of Technology Ropar
ROHIT SHARMA – Indian Institute of Technology Ropar
Devarshi Mrinal Das – Indian Institute of Technology Ropar

6. Cryogenic Integration for Quantum Computer Using Diamond Color Center Spin Qubits
Toshiki Iwai – Fujitsu, Ltd.
Kenichi Kawaguchi – Fujitsu, Ltd.
Tetsuya Miyatake – Fujitsu, Ltd.
Tetsuro Ishiguro – Fujitsu, Ltd.
Shoichi Miyahara – Fujitsu, Ltd.
Salahuddin Nur – Delft University of Technology
Ryoichi Ishihara – Delft University of Technology
Shintaro Sato – Fujitsu, Ltd.

7. Characterizations of Indium Interconnects for 3D Quantum Assemblies
Celine Feautrier – CEA-LETI
Edouard Deschaseaux – CEA-LETI
Alain Gueugnot – CEA-LETI
Jean Charbonnier – CEA-LETI
Aurelia Plihon – CEA-LETI
Ludovic Dupre – CEA-LETI
Franck Henry – CEA-LETI
Frederic Berger – CEA-LETI
Antoine Pagot – CEA-LETI
Sebastien Renet – CEA-LETI
Olivier Mailliart – CEA-LETI
Candice Thomas – CEA-LETI