Technical Program

Thursday, June 02, 2022

Session 21: Millimeter-Wave RF Components and Modules for 5G
1:30 PM - 5:10 PM
Committee: RF, High-Speed Components & Systems
Room: Silver Pearl 3

Session Co-Chairs:

Craig Gaw
NXP Semiconductor
[email protected]
Jaemin Shin
Qualcomm Technologies, Inc.
[email protected]

Papers:

1. Metaconductor Based Highly Energy Efficient Differential Striplines for 112 Gbps Data Bus with Sub 0.1 dB/mm Package Insertion Loss
Hae-In Kim - University of Florida
Saeyeong Jeon - University of Florida
Rockwell Hsu - Cisco Systems, Inc.
Brice Achkir - Cisco Systems, Inc.
Yong-Kyu Yoon - University of Florida

2. Multi-terminal Ultra-Thin 3D Nanoporous Silicon Capacitor Technology for High-Speed Circuits Decoupling
Mohamed Mehdi Jatlaoui - Murata Integrated Passive Solutions, SAS
Seiji Hidaka - Murata Integrated Passive Solutions, SAS
Ryo Kasai - Murata Integrated Passive Solutions, SAS
Sho Kubota - Murata Manufacturing Co., Ltd.
Masato Takesawa - Murata Manufacturing Co., Ltd.
Charles Muller - Murata Manufacturing Co., Ltd.
Florent Lallemand - Murata Manufacturing Co., Ltd.
Shunsuke Abe - Murata Manufacturing Co., Ltd.
Takashi Takeuchi - Murata Manufacturing Co., Ltd.
Hitoshi Matsuno - Murata Manufacturing Co., Ltd.

3. Mechanical and Ka-Band Electrical Reliability Testing of Interconnects in 5G Wearable System-on-Package Designs Under Bending
Yi Zhou - Georgia Institute of Technology
Kexin Hu - Georgia Institute of Technology
Manos M. Tentzeris - Georgia Institute of Technology
Suresh K. Sitaraman - Georgia Institute of Technology

4. X-band Passive Circuits Using 3-D Printed Hollow Substrate Integrated Waveguides
Yihang Chu - Michigan State University
Yamini Kotriwar - Michigan State University
Ethan Kepros - Michigan State University
Brian Wright - Michigan State University
Premjeet Chahal - Michigan State University

5. A Novel Simulation Methodology Reflecting System Power Scenario using a Markov-Chain-based Stochastic Random Power Model
Woo-Jin Na - Samsung Electronics Co., Ltd.
Kun Joo - Samsung Electronics Co., Ltd.
Rakjoo Sung - Samsung Electronics Co., Ltd.
Kyudong Lee - Samsung Electronics Co., Ltd.
Ji-Hye Yang - Samsung Electronics Co., Ltd.
Kyungsun Kim - Samsung Electronics Co., Ltd.
Young-Ho Lee - Samsung Electronics Co., Ltd.
Seung-Hee Mun - Samsung Electronics Co., Ltd.
SungJoo Park - Samsung Electronics Co., Ltd.
Jeong-Hyeon Cho - Samsung Electronics Co., Ltd.

6. Towards Mass Production of Air Filled Substrate Integrated Waveguides (AFSIW) for Ultra-Low Loss, Broadband Radar Applications
Heinrich Trischler - AT&S
Siddhartha Sinha - Imec
Erich Schlaffer - AT&S
Ilja Ocket - Imec

7. Characterisation of RF Components and Connectors for Advanced 5G Applications
Kimmo Rasilainen - University of Oulu
Marko E. Leinonen - University of Oulu
Olli Kursu - University of Oulu
Klaus Nevala - University of Oulu
Shayan Hasan Naushahi - University of Oulu
Juha-Matti Ojakoski - University of Oulu
Markus Berg - University of Oulu
Aarno Pärssinen - University of Oulu