Technical Program

Program Sessions: Thursday June 1st 2:00 PM – 5:05 PM

Session 21: Fine-Pitch and Intermetallic Considerations in Advanced Solder Interconnections
Committee: Interconnections
Room: Mediterranean 2 & 3

Session Co-Chairs:

Nathan Lower
Email: [email protected]

Jian Cai
Tsinghua University
Email: [email protected]


1. Copper Pillar Voids in a Flip Chip Package During High Temperature Application
Miao Wang – NXP Semiconductor, Inc.
Amar Mavinkurve – NXP Semiconductor, Inc.
Romuald Roucou – NXP Semiconductor, Inc.
Amirul Afripin – NXP Semiconductor, Inc.
CS Foong – NXP Semiconductor, Inc.
Trent Uehling – NXP Semiconductor, Inc.
Nishant Lakhera – NXP Semiconductor, Inc.

2. Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections Using Solid Liquid Interdiffusion (SLID)
Hafiz Waqas Ali – University of Sherbrooke
David Danovitch – University of Sherbrooke
Richard Langlois – IBM Corporation
Robert Martel – IBM Corporation

3. Intermetallic Growth Study of Ultra-Thin Copper and Tin Bilayer for Hybrid Bonding Applications
Gaurav Khurana – TU Dresden
Iuliana Panchenko – TU Dresden/Fraunhofer IZM

4. Heterogeneous Integration on Organic Interposer Substrate With Fine-Pitch RDL and 40 µm Pitch Micro-Bumps
Katsuyuki Sakuma – IBM Research
Russell Kastberg – IBM Systems
Toyohiro Aoki – IBM Japan, Ltd.
Griselda Bonilla – IBM Research

5. A Study on the Advanced Chip to Wafer Stack for Better Thermal Dissipation of High Bandwidth Memory
Sangyong Lee – SK Hynix, Inc.
Jinwoo Park – SK Hynix, Inc.
Jong-Kyu Moon – SK Hynix, Inc.
Minsuk Kim – SK Hynix, Inc.
Gyujei Lee – SK Hynix, Inc.
Kangwook Lee – SK Hynix, Inc.

6. Morphological and Electrical Characterization of Hard Material Microtubes Insertion in Aluminum and Indium Pads for 10 µm, 7.5 µm and 5 µm Pitches Interconnection Technology
Natacha Raphoz – University of Grenoble Alpes/CEA-LETI
Patrick Peray – University of Grenoble Alpes/CEA-LETI
Olivier Mailliart – University of Grenoble Alpes/CEA-LETI
Frederic Berger – University of Grenoble Alpes/CEA-LETI
Cloe Desbordes – University of Grenoble Alpes/CEA-LETI

7. Development of Fluxless Micro-Bonding and Narrow Gap Filling Process
Sadaaki Katoh – Resonac Corporation
Dongchul Kan – Resonac Corporation
Keiko Ueno – Resonac Corporation
Kazuyuki Mitsukura – Resonac Corporation