Technical Program

Thursday, June 02, 2022

Session 20: Enhancements in Fine-Pitch Interconnects, Redistribution Layers and Through-Vias
1:30 PM - 5:10 PM
Committee: Materials & Processing
Room: Silver Pearl 2

Session Co-Chairs:

Ivan Shubin
RAM Photonics LLS
[email protected] 		Jayaram Vidya
Intel Corporation
[email protected]

Papers:

1. A Study of Failure Mechanism in the Formation of Fine RDL Patterns and Vias for Heterogeneous Packages in Chip Last Fan-Out Panel Level Packaging
Yoon Young Jeon - Samsung Electronics Co., Ltd.
Youngmin - Samsung Electronics Co., Ltd.
Minju Kim - Samsung Electronics Co., Ltd.
Sangyun Lee - Samsung Electronics Co., Ltd.
Hyun-Dong Lee - Samsung Electronics Co., Ltd.
Changbo Lee - Samsung Electronics Co., Ltd.
Joon Seok Oh - Samsung Electronics Co., Ltd.

2. Novel Plasma Process for Build-Up Film in the Fine Wiring Fabrication
Daisuke Hironiwa - ULVAC, Inc.
Yasuhiro Morikawa - ULVAC, Inc.
Atsuhito Ihori - ULVAC, Inc.
Ryuichiro Kamimura - ULVAC, Inc.

3. Fine Copper Lines with High Adhesion on High Rigidity Dielectrics
Masataka Nishida - Showa Denko Materials Co., Ltd.
Hirokazu Noma - Showa Denko Materials Co., Ltd.
Masaki Yamaguchi - Showa Denko Materials Co., Ltd.
Kazuyuki Mitsukura - Showa Denko Materials Co., Ltd.

4. Fabrication and Characterization of Nanoporous Gold (NPG) Interconnects for Wafer Level Packaging
Lothar Dietrich - Fraunhofer IZM
Hermann Oppermann - Fraunhofer IZM
Christina Lopper - Fraunhofer IZM
Piotr Mackowiak - Fraunhofer IZM

5. Role of (111) Nanotwinned Cu on Dissolution Behavior and Interfacial Reaction in Micro-Scale Nanotwinned Cu/Sn/Ni Interconnects
Mingliang Huang - Dalian University of Technology
Shengbo Wang - Dalian University of Technology
Jing Ren - Dalian University of Technology

6. Approaches for a Solely Electroless Metallization of Through-Glass Vias
Aleksandra M. Zawacka - Leibniz University Hannover
Maren S. Prediger - Leibniz University Hannover
Alexander Kassner - Leibniz University Hannover
Folke Dencker - Leibniz University Hannover
Marc C. Wurz - Ulm University

7. Atmospheric HF Vapor Based Silicon Etching with Pt Catalyst for High Fidelity Through Silicon Via (TSV) Fabrication
Sunghyun Hwang - University of Florida
Yong-Kyu Yoon - University of Florida
William N. Carr - Phononic MEMS, Inc.