Technical Program

Wednesday, June 01, 2022

Session 2: High Performance Dielectric Materials for Advanced Packaging
8:00 AM - 11:40 AM
Committee: Materials & Processing
Room: Silver Pearl 2

Session Co-Chairs:

Lingyun (Lucy) Wei
Dupont
[email protected]
Yi Li
Intel Corporation
[email protected]

Papers:

1. Ultra-Thin Mold Cap for Advanced Packaging Technology
Nabankur Deb - Intel Corporation
Chris Masuyama - TOWA Corporation
N. Hamada - TOWA Corporation
Y. Hirano - TOWA Corporation
K. Wada - TOWA Corporation
H. Oshida - TOWA Corporation
K. Ganbayashi - TOWA Corporation
L. L. Zhou - TOWA Corporation
T. Y. Lyu - TOWA Corporation
Xavier Brun - Intel Corporation

2. Evaluation of the Transmission Loss of Soluble Polyphenylene Ether Composite Material in a Millimeter-Wave Region
Shoya Sekiguchi - TAIYO HOLDINGS Co., Ltd.
Kota Oki - TAIYO HOLDINGS Co., Ltd.
Shoko Mishima - TAIYO HOLDINGS Co., Ltd.
Yuya Fukata - TAIYO HOLDINGS Co., Ltd.
Kaho Shibasaki - TAIYO HOLDINGS Co., Ltd.
Nobuhiro Ishikawa - TAIYO HOLDINGS Co., Ltd.
Toshiyuki Ogata - TAIYO HOLDINGS Co., Ltd.

3. Low-Dielectric, Low-Profile IC Substrate Material Development for 5G Applications
Tomo Muguruma - Panasonic Industrial Devices Sales Company of America
Andy Behr - Panasonic Industrial Devices Sales Company of America
Tom Shin - Panasonic Industrial Devices Sales Company of America
Hirosuke Saito - Panasonic Industry Co., Ltd.
Koji Kishino - Panasonic Industry Co., Ltd.
Fumito Suzuki - Panasonic Industry Co., Ltd.
Hiroaki Umehara - Panasonic Industry Co., Ltd.

4. Reliability Assessment of Ultra-Low-K Dielectric Material and Demonstration in Advanced Interposers
Pragna Bhaskar - Georgia Institute of Technology
Christopher Blancher - Georgia Institute of Technology
Mohan Kathaperumal - Georgia Institute of Technology
Madhavan Swaminathan - Georgia Institute of Technology
Mark Losego - Georgia Institute of Technology

5. Low Dielectric New Resin Cross-Linkers
Takeshi Kumano - Shikoku Chemicals Corporation
Yosuke Kurita - Shikoku Chemicals Corporation
Kazunori Aoki - Shikoku Chemicals Corporation
Takashi Kashiwabara - Shikoku Chemicals Corporation

6. Solid-Diffusion Synthesis of Robust Hollow Silica Filler with Low Dk and Low Df
Sicheng Luo - Shenzhen Institute of Advanced Electronic Materials
Ning Wang - Shenzhen Institute of Advanced Electronic Materials
Pengli Zhu - Shenzhen Institute of Advanced Electronic Materials
Tao Zhao - Shenzhen Institute of Advanced Electronic Materials
Rong Sun - Shenzhen Institute of Advanced Electronic Materials

7. Epoxy Wetting Flow and Adhesion Mechanism Within a Small Gap and Small Pitch Copper Pillar Structure
Mary-Ann Gasser - CEA-LETI
Abdenacer Ait Mani - CEA-LETI
Loïc Vanel - Institut Lumière Matière, Université Claude Bernard Lyon 1
Catherine Barentin - Institut Lumière Matière, Université Claude Bernard Lyon 1
Alain Gueugnot - CEA-LETI
Thierry Mourier - CEA-LETI
Patrick Peray - CEA-LETI