Technical Program

Program Sessions: Thursday June 1st 2:00 PM – 5:05 PM

Session 19: Advances in 3D Integration and Hybrid Bonding
Committee: Packaging Technologies
Room: Palazzo D

Session Co-Chairs:

Peng Su
Juniper Networks
Email: [email protected]

Jaesik Lee
Meta Platforms, Inc.
Email: [email protected]

Papers:

1. Thermal Improvement of HBM With Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond
Taehwan Kim – Samsung Electronics Co., Ltd.
Youngdeuk Kim – Samsung Electronics Co., Ltd.
Heejung Hwang – Samsung Electronics Co., Ltd.
Hwanjoo Park – Samsung Electronics Co., Ltd.
Jaechoon Kim – Samsung Electronics Co., Ltd.
Dan (Kyung Suk) Oh – Samsung Electronics Co., Ltd.

2. Electrical and Thermal Analysis of Bumpless Build Cube (BBCube) 3D Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Near Memory Computing
Norio Chujo – Hitachi Research & Development Group/Tokyo Institute of Technology
Hiroyuki Ryoson – Tokyo Institute of Technology
Tomoji Nakamura – Tokyo Institute of Technology
Koji Sakui – Tokyo Institute of Technology
Shinji Sugatani – Tokyo Institute of Technology
Takayuki Ohba – Tokyo Institute of Technology

3. 2.5D MCM (Multi-Chip Module) Technology Development for Advanced Package
Laurene Yip – MediaTek, Inc.
James Tsai – MediaTek, Inc.
Rosa Lin – MediaTek, Inc.
Ian Hsu – MediaTek, Inc.

4. Reliability Performance on Low Temperature Fine-Pitch SoICTM Bond
Shih-Wei Liang – Taiwan Semiconductor Manufacturing Company, Ltd.
Y. R. Liang – Taiwan Semiconductor Manufacturing Company, Ltd.
Gene C. Y. Wu – Taiwan Semiconductor Manufacturing Company, Ltd.
K. C. Yee – Taiwan Semiconductor Manufacturing Company, Ltd.
C. T. Wang – Taiwan Semiconductor Manufacturing Company, Ltd.
Douglas C. H. Yu – Taiwan Semiconductor Manufacturing Company, Ltd.

5. Development of 4 Die Stack Module Using Hybrid Bonding Approach
Ser Choong Chong – Institute of Microelectronics A*STAR
Au Keng Yuen, Jason – Institute of Microelectronics A*STAR
Nagendra Sekhar Vasarla – Institute of Microelectronics A*STAR
Ismael Daniel Cereno – Institute of Microelectronics A*STAR
Srinivasa Rao Vempati – Institute of Microelectronics A*STAR

6. Impact of Dielectric Types and Surface Profile on Wafer-to-Wafer Hybrid Bonding
Vikas Dubey – Fraunhofer ENAS
Dirk Wuensch – Fraunhofer ENAS
Knut Gottfried – Fraunhofer ENAS
Tobias Fischer – Fraunhofer ENAS
Maik Wiemer – Fraunhofer ENAS
Harald Kuhn – Fraunhofer ENAS

7. Voids-Free Die-Level Cu/ILD Hybrid Bonding
Katsuyuki Sakuma – IBM Research
Roy Yu – ASM Pacific Technology, Ltd.
John Knickerbocker – ASM Pacific Technology, Ltd.
Dale McHerron – ASM Pacific Technology, Ltd.
Ming Li – ASM Pacific Technology, Ltd.
Siu Cheung So – ASM Pacific Technology, Ltd.
So Ying Kwok – ASM Pacific Technology, Ltd.
Chun Ho Fan – ASM Pacific Technology, Ltd.
Siu Wing Lau – ASM Pacific Technology, Ltd.